MW4IC2230NBR1 vs MW4IC2230MBR5 对比
详细并排对比 MW4IC2230NBR1 出自 NXP Semiconductors 和 MW4IC2230MBR5 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MW4IC2230NBR1 - 30W W-CDMA RF Power Amplifier, 1.6-2.4 GHz | NXP
MW4IC2230NBR1 Obsolete
规格对比
| 参数 | MW4IC2230NBR1 | MW4IC2230MBR5 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | RF Amplifiers | RF Amplifiers |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $32.00 | $29.85 |
| Technology | LDMOS (High Voltage, multi-stage integrated) | LDMOS (Laterally Diffused MOSFET) |
| Frequency Range | 1.6 GHz to 2.4 GHz (usable); 2110-2170 MHz target band | 1.6 GHz to 2.4 GHz |
| Test Frequency | 2.14 GHz | — |
| Supply Voltage (Drain) | 26 V to 28 V | — |
| Supply Current (Quiescent) | 60 mA nominal | — |
| Small-Signal Gain | 31 dB typical | — |
| Output Power (P1dB / Pout) | [DATA_NEEDED: P1dB / saturated Pout at W-CDMA] | — |
| Power Added Efficiency | [DATA_NEEDED: PAE typical] | — |
| Modulation Support | W-CDMA, CDMA, EDGE, GSM, TDMA | — |
| Input Impedance | 50 ohm (internally matched) | — |
| 封装 | TO-272 WB-16 (over-molded plastic, flange mount) | — |
| 安装类型 | Surface / chassis mount via flange | Surface Mount (with heatsink) |
| Maximum Operating Temperature | 85 C | — |
| 引脚数量 | 16 | — |
| RoHS 状态 | [DATA_NEEDED: RoHS / lead-free status from NXP product page] | [DATA_NEEDED: rohs status] |
| Application | Cellular base-station RF power amplifier | — |
| Lead Configuration | Flat leads (TO-272-16 Variant) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Type | — | RF LDMOS Wideband Integrated Power Amplifier |
| Output Power (Pout) | — | 30 W (CW) |
| Power Gain | — | 31 dB (typical) |
| Supply Voltage (Vdd) | — | 26 V nominal |
| Quiescent Current (Idq) | — | 60 mA |
| 封装 / 外壳 | — | TO-272 WB-16 Variant, Flat Leads (over-molded plastic) |
| Operating Mode | — | Class AB (typical) |
| Supported Air Interfaces | — | Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA |
| Input Matching | — | Internal wideband matching network |
| Lead Finish | — | [DATA_NEEDED: lead finish] |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |