MX30UF4G18AB vs MX30UF4G16AB 对比

详细并排对比 MX30UF4G18AB 出自 Macronix 和 MX30UF4G16AB 出自 Macronix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 MX30UF4G18AB MX30UF4G16AB
品牌 Macronix Macronix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $2.80 $2.55
存储器类型 Non-volatile NAND Flash (SLC) Non-volatile NAND Flash (SLC)
Density 4 Gbit (512 MiB x8) 4 Gbit (512 MB)
Cell Technology Single-Level Cell (SLC), 1 bit/cell —
Supply Voltage (VCC) 1.7 V to 1.95 V (1.8 V typ) 1.7 V to 1.95 V (1.8 V typical)
接口 8-bit parallel asynchronous Parallel / Asynchronous NAND (ONFI 1.0)
Page Size 2,112 bytes (2,048 + 64 spare) or 4,320 bytes ONFI mode [DATA_NEEDED: page size bytes]
Block Size 128 KiB (64 pages x 2 KiB) [DATA_NEEDED: exact blocks-per-die count] [DATA_NEEDED: block size / block erase granularity]
Page Read Time (tR) 25 ns (async, typical) [DATA_NEEDED: confirmed from datasheet v1.2 timing table] —
Standby Current (Sleep Mode) 50 uA max 50 uA (maximum)
ONFI Compliance ONFI 1.0 ONFI 1.0 parameter page
Endurance (P/E cycles) [DATA_NEEDED: typical endurance spec] —
Data Retention [DATA_NEEDED: typical retention spec] [DATA_NEEDED: typical data retention years]
工作温度 -40 C to +85 C (industrial) —
封装 48-pin TSOP I (12 mm x 20 mm x 1.0 mm) for -TI; 63-VFBGA (9x11) for -XKI 63-ball VFBGA, 9 mm x 11 mm
安装类型 Surface Mount Surface Mount
MSL 等级 3 [DATA_NEEDED: confirm from datasheet] —
RoHS 状态 Compliant Compliant
Lead-free Yes —
存储组织 — 256 M x 16
Bus Width — x16 (also supports x8)
Access Time (tRC) — 25 ns (typical)
Endurance (P/E Cycles) — [DATA_NEEDED: typical P/E cycles]
工作温度范围 — -40C to +85C (industrial)
Lead-Free — Yes
Bad Block Management — External (host-managed)
ECC Support — External hardware ECC required

数据手册与资源

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