S9S12DG25F0MPVE vs MC9S12A64CPVE 对比

详细并排对比 S9S12DG25F0MPVE 出自 NXP Semiconductors 和 MC9S12A64CPVE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
S9S12DG25F0MPVE S9S12DG25F0MPVE - 16-bit MCU, 256KB Flash, 25MHz, AEC-Q100 | NXP

S9S12DG25F0MPVE - 16-bit MCU, 256KB Flash, 25MHz, AEC-Q100 | NXP

S9S12DG25F0MPVE ✓ 量产中
NXP Semiconductors
MC9S12A64CPVE MC9S12A64CPVE - 16-bit HCS12 MCU 64KB Flash 25MHz | NXP

MC9S12A64CPVE - 16-bit HCS12 MCU 64KB Flash 25MHz | NXP

MC9S12A64CPVE Nrnd

规格对比

参数 S9S12DG25F0MPVE MC9S12A64CPVE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $19.10 $32.60
Core Processor HCS12 HCS12
Core Size 16-Bit 16-Bit
CPU Speed 25 MHz —
Program Memory Type FLASH FLASH
Program Memory Size 256 KB (256K x 8) 64KB (64K x 8)
EEPROM Size 4 KB (4K x 8) —
RAM Size [DATA_NEEDED: RAM size in KB] [DATA_NEEDED: SRAM size]
Number of I/O 91 [DATA_NEEDED: GPIO count]
Connectivity CANbus, I²C, SCI, SPI —
Peripherals PWM, WDT —
ADC 2x 8-channel, 10-bit —
Timers 8-channel IC/OC Enhanced Capture Timer —
工作温度 -40°C to +125°C [DATA_NEEDED: operating temperature range]
封装 / 外壳 112-LQFP (20 x 20 mm) —
安装类型 Surface Mount Surface Mount
Automotive Qualification AEC-Q100 Qualified —
RoHS 状态 Compliant Compliant
Lead-Free Yes —
Architecture — CISC
最大时钟频率 — 25 MHz
电源电压 — 2.5V/5V
封装 — 112-LQFP (20x20 mm)
引脚数量 — 112
External Bus — 8-bit narrow mode supported
System Module — SIM (System Integration Module)
ADC Resolution — [DATA_NEEDED: ADC resolution]
生命周期状态 — NRND (Not Recommended for New Designs)

数据手册与资源

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