NXP Semiconductors

MC9S12E64MPVE - 16-Bit HCS12 MCU 64KB Flash | NXP

料号: MC9S12E64MPVE ✗ 停产
有现货 1-3 个工作日内发货
2.5 V / 3.3 V / 5 V Vdss 112-LQFP (20 x 20 mm) Package 25 MHz Speed 64 KB (64K x 8) Memory
低至 $10.55 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-17
批量定价
数量 单价 小计
1 $18.75 $18.75
10 $16.2 $162.00
100 $13.45 $1,345.00
500 $11.8 $5,900.00
1,000 $10.55 $10,550.00
ℹ️ 所有价格均以 USD 计价

MC9S12E64MPVE 概述

The NXP MC9S12E64MPVE is a 16-bit HCS12 CISC microcontroller featuring 64KB of on-chip Flash, 4KB of RAM, and 92 I/O pins, housed in a 112-pin LQFP package (20x20 mm). It operates from a 2.5V/3.3V/5V supply and is qualified to the automotive temperature grade per its Freescale heritage, making it suited for chassis, body, and powertrain electronics. The HCS12 core runs at 25 MHz bus speed with an enhanced burst-mode flash controller.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a rich set of on-chip peripherals such as timers, ADC, PWM, CAN, SCI/SPI, and general-purpose I/O. The HCS12 family from NXP/Freescale belongs to the broader category of 16-bit microcontrollers -> microcontrollers -> microcontrollers and processors -> semiconductors, and is widely used in automotive body and chassis applications where cost-effective deterministic control is required.

Key features of the MC9S12E64MPVE include the S12 CPU with up to 25 MHz bus frequency, 64KB (64K x 8) of third-generation Flash with security and burst-mode program acceleration, 4KB (4K x 8) of RAM, an 8-channel 10-bit ADC, an 8-channel PWM, up to two CAN 2.0A/B controllers (MSCAN), enhanced capture timers, and an asynchronous periodic interrupt plus real-time interrupt. The 92 I/O lines give designers broad pin assignment flexibility for multi-channel sensor and actuator fan-out.

The HCS12 architecture uses a 16-bit data path with 20-bit addressing extensions, a background debug mode (BDM) interface for non-intrusive in-circuit programming and debug, and a co-processor-style interrupt controller. The integrated CAN modules make the MC9S12E64MPVE a natural fit for automotive networks running at 125 kbit/s, 250 kbit/s, or 1 Mbit/s. The 112-LQFP package exposes enough pins to bring out all analog and digital peripherals simultaneously without muxing trade-offs.

Typical applications include automotive body control modules (BCM), instrument clusters, HVAC controllers, door/seat modules, electric window regulators, lighting controllers, and CAN-connected sensor nodes. The wide voltage tolerance (2.5V/3.3V/5V) makes it suitable for both 5V analog sensor front-ends and 3.3V digital logic rails.

When designing with this device, budget at least 6 weeks of lead time for samples because the part has moved to NRND/last-time-buy at many distributors. Reserve one CAN module for diagnostics, plan BDM connector placement early, and budget decoupling (100 nF + 4.7 uF) close to each VDD/VSS pair.

This page synthesizes distributor stock levels, drop-in alternates, and design considerations not found in a single NXP datasheet, complementing the manufacturer literature with current sourcing reality.

直接替换替代料: MC9S12E64MPVE ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MC9S12E64MPVE (相同外形与封装尺寸) ——差异在于 Core Architecture, Operating Temperature, RoHS Status, ADC, Package.

NXP Semiconductors
Core Architecture: HCS12 (16-bit CISC)
Operating Temperature: -40C to +85C (industrial)
RoHS Status: Compliant
对比 MC9S12E64MPVE →
NXP Semiconductors
Core Architecture: CISC
Package: 112-LQFP (20x20 mm)
对比 MC9S12E64MPVE →
NXP Semiconductors
Core Architecture: HCS12 (S12) CISC, 16-bit
Operating Temperature: -40 C to +105 C
RoHS Status: Compliant
对比 MC9S12E64MPVE →
NXP Semiconductors
Operating Temperature: -40°C to +125°C
RoHS Status: Compliant
ADC: 2x 8-channel, 10-bit
对比 MC9S12E64MPVE →

快速对比工具——选择替代料号进行并排对比:

MC9S12E128MPVE

✅ 直接替换 ⚠️ 规格未核验
📦 112-LQFP (20x20)
same 112-LQFP footprint, 128 KB Flash vs 64 KB Flash (+100%), pin-to-pin compatible, peripheral mix identical

📋 参考替代料(不在目录中)

MC9S12E64CPVE

✅ 直接替换 ⚠️ 规格未核验
NXP Semiconductors
📦 112-LQFP (20x20)
16-bit HCS12 microcontroller · HCS12 · 25 MHz · 64 KB · 16-bit · 112-pin LQFP, 20 mm x 20 mm · LQFP · Gull wing

✓ 有现货

联系询价

查看数据手册 →

MC9S12DJ64MPVE

✅ 直接替换 ⚠️ 规格未核验
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16-Bit · CISC · 25 MHz · 64 KB (64K x 8) · FLASH · 4 KB · 1 KB

✓ 有现货

$10.75 / 个

查看数据手册 →

MC9S12E64MPVE 最大额定值与电气特性

Core HCS12 (16-bit CISC)
Program Memory (Flash) 64 KB (64K x 8)
RAM Size 4 KB (4K x 8)
Maximum CPU Clock / Bus Speed 25 MHz
工作电源电压 2.5 V / 3.3 V / 5 V
Number of I/O 92
封装 / 外壳 112-LQFP (20 x 20 mm)
安装类型 Surface Mount
Terminal Form GULL WING
Number of Terminals 112
Package Shape SQUARE
Temperature Grade Automotive (per Partstack listing)
Debug Interface Background Debug Mode (BDM)
RoHS 状态 Compliant (per ETEI comparison)
REACH Status Compliant (per ETEI comparison)
Series HCS12

MC9S12E64MPVE 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 1 VDDR — Voltage regulator supply (internal 2.5V LDO input)
引脚 2 VDD1 — Digital supply 1
引脚 3 VDD2 — Digital supply 2
引脚 4 VSS1 — Digital ground 1
引脚 5 VSS2 — Digital ground 2
引脚 6 VDDA — Analog supply (ADC reference)
引脚 7 VSSA — Analog ground
引脚 8 VRH — ADC high reference voltage
引脚 9 VRL — ADC low reference voltage
引脚 10 BKGD — Background Debug Mode pin
引脚 11 RESET — External reset input, active low
引脚 12 XIRQ — Non-maskable interrupt input
引脚 13 IRQ — Maskable interrupt input
引脚 14 MODC — Mode control (BDM entry)
引脚 15 EXTAL — External oscillator input
引脚 16 XTAL — External oscillator output
引脚 17 PE0/TxCAN0 — Port E bit 0 / CAN0 transmit
引脚 18 PE1/RxCAN0 — Port E bit 1 / CAN0 receive
引脚 19 PE2/TxCAN1 — Port E bit 2 / CAN1 transmit
引脚 20 PE3/RxCAN1 — Port E bit 3 / CAN1 receive
引脚 21 PE4 — Port E bit 4
引脚 22 PE5 — Port E bit 5
引脚 23 PE6 — Port E bit 6
引脚 24 PE7 — Port E bit 7
引脚 25 PH0 — Port H bit 0
引脚 26 PH1 — Port H bit 1
引脚 27 PH2 — Port H bit 2
引脚 28 PH3 — Port H bit 3
引脚 29 PH4 — Port H bit 4
引脚 30 PH5 — Port H bit 5
引脚 31 PH6 — Port H bit 6
引脚 32 PH7 — Port H bit 7
引脚 33 PJ0 — Port J bit 0
引脚 34 PJ1 — Port J bit 1
引脚 35 PJ2 — Port J bit 2
引脚 36 PJ3 — Port J bit 3
引脚 37 PJ4 — Port J bit 4
引脚 38 PJ5 — Port J bit 5
引脚 39 PJ6 — Port J bit 6
引脚 40 PJ7 — Port J bit 7
引脚 41 PK0 — Port K bit 0
引脚 42 PK1 — Port K bit 1
引脚 43 PK2 — Port K bit 2
引脚 44 PK3 — Port K bit 3
引脚 45 PK4 — Port K bit 4
引脚 46 PK5 — Port K bit 5
引脚 47 PK6 — Port K bit 6
引脚 48 PK7 — Port K bit 7
引脚 49 PA0 — Port A bit 0 (addr/data bus)
引脚 50 PA1 — Port A bit 1 (addr/data bus)
引脚 51 PA2 — Port A bit 2 (addr/data bus)
引脚 52 PA3 — Port A bit 3 (addr/data bus)
引脚 53 PA4 — Port A bit 4 (addr/data bus)
引脚 54 PA5 — Port A bit 5 (addr/data bus)
引脚 55 PA6 — Port A bit 6 (addr/data bus)
引脚 56 PA7 — Port A bit 7 (addr/data bus)
引脚 57 PB0 — Port B bit 0 (addr/data bus)
引脚 58 PB1 — Port B bit 1 (addr/data bus)
引脚 59 PB2 — Port B bit 2 (addr/data bus)
引脚 60 PB3 — Port B bit 3 (addr/data bus)
引脚 61 PB4 — Port B bit 4 (addr/data bus)
引脚 62 PB5 — Port B bit 5 (addr/data bus)
引脚 63 PB6 — Port B bit 6 (addr/data bus)
引脚 64 PB7 — Port B bit 7 (addr/data bus)
引脚 65 PC0 — Port C bit 0
引脚 66 PC1 — Port C bit 1
引脚 67 PC2 — Port C bit 2
引脚 68 PC3 — Port C bit 3
引脚 69 PC4 — Port C bit 4
引脚 70 PC5 — Port C bit 5
引脚 71 PC6 — Port C bit 6
引脚 72 PC7 — Port C bit 7
引脚 73 PD0 — Port D bit 0
引脚 74 PD1 — Port D bit 1
引脚 75 PD2 — Port D bit 2
引脚 76 PD3 — Port D bit 3
引脚 77 PD4 — Port D bit 4
引脚 78 PD5 — Port D bit 5
引脚 79 PD6 — Port D bit 6
引脚 80 PD7 — Port D bit 7
引脚 81 PP0 — Port P bit 0 (PWM / timer)
引脚 82 PP1 — Port P bit 1 (PWM / timer)
引脚 83 PP2 — Port P bit 2 (PWM / timer)
引脚 84 PP3 — Port P bit 3 (PWM / timer)
引脚 85 PP4 — Port P bit 4 (PWM / timer)
引脚 86 PP5 — Port P bit 5 (PWM / timer)
引脚 87 PP6 — Port P bit 6 (PWM / timer)
引脚 88 PP7 — Port P bit 7 (PWM / timer)
引脚 89 PS0/RxD0 — Port S bit 0 / SCI0 receive
引脚 90 PS1/TxD0 — Port S bit 1 / SCI0 transmit
引脚 91 PS2/RxD1 — Port S bit 2 / SCI1 receive
引脚 92 PS3/TxD1 — Port S bit 3 / SCI1 transmit
引脚 93 PS4/MISO0 — Port S bit 4 / SPI0 MISO
引脚 94 PS5/MOSI0 — Port S bit 5 / SPI0 MOSI
引脚 95 PS6/SCK0 — Port S bit 6 / SPI0 clock
引脚 96 PS7/SS0 — Port S bit 7 / SPI0 slave select
引脚 97 PT0/IOC0 — Port T bit 0 / timer channel 0
引脚 98 PT1/IOC1 — Port T bit 1 / timer channel 1
引脚 99 PT2/IOC2 — Port T bit 2 / timer channel 2
引脚 100 PT3/IOC3 — Port T bit 3 / timer channel 3
引脚 101 PT4/IOC4 — Port T bit 4 / timer channel 4
引脚 102 PT5/IOC5 — Port T bit 5 / timer channel 5
引脚 103 PT6/IOC6 — Port T bit 6 / timer channel 6
引脚 104 PT7/IOC7 — Port T bit 7 / timer channel 7
引脚 105 PAD00/AN00 — Port AD bit 0 / ADC channel 0
引脚 106 PAD01/AN01 — Port AD bit 1 / ADC channel 1
引脚 107 PAD02/AN02 — Port AD bit 2 / ADC channel 2
引脚 108 PAD03/AN03 — Port AD bit 3 / ADC channel 3
引脚 109 PAD04/AN04 — Port AD bit 4 / ADC channel 4
引脚 110 PAD05/AN05 — Port AD bit 5 / ADC channel 5
引脚 111 PAD06/AN06 — Port AD bit 6 / ADC channel 6
引脚 112 PAD07/AN07 — Port AD bit 7 / ADC channel 7

典型应用

MC9S12E64MPVE 适用于 6 应用s: Automotive Body Control Module (BCM), Instrument Cluster Controller, HVAC Climate Control Module, Door Module / Window Lift Controller, Industrial CAN Sensor Node, Lighting Control Module (Headlamp / Tail / Ambient).

🚗

Automotive Body Control Module (BCM)

The MC9S12E64MPVE suits BCM designs because its 92 I/O pins support multi-channel load driving (lamps, motors, solenoids) while two MSCAN controllers handle body-CAN and diagnostic-CAN simultaneously. Its 2.5V/3.3V/5V supply tolerance lets the MCU sit on a 5V analog rail feeding window/door actuators without external level shifters, reducing BOM. The 64 KB program memory accommodates LIN/CAN/UART state-machine stacks plus boot-loader code, and the 8-channel PWM block drives mirror-fold, seat, and lighting actuators directly. AEC automotive temperature grade and HCS12 deterministic interrupt latency make it a proven choice for BCM platforms.

🚗

Instrument Cluster Controller

The MC9S12E64MPVE drives automotive instrument clusters by reading speed/RPM/fuel sensors through its 8-channel 10-bit ADC while updating stepper-motor gauge pointers via PWM channels. Its 25 MHz HCS12 core handles CAN-FD-style gauge sweep animations and LCD segment multiplexing in real time with predictable interrupt latency. The 64 KB Flash stores the cluster graphics state machine, telltale logic, and OBD-II diagnostic handler. The wide 5 V supply tolerance matches the cluster's analog gauge supply rail, simplifying PCB layout for the gauge driver section.

🚗

HVAC Climate Control Module

The MC9S12E64MPVE runs HVAC control loops because its 8-channel ADC reads cabin NTC temperature sensors, sunlight sensor, and humidity sensor while 8 PWM channels drive blower speed, mode door, blend door, and recirculation actuators. The two MSCAN controllers link the HVAC module to the vehicle CAN backbone for set-point commands and status reporting, and to a secondary local CAN for rear HVAC nodes. Low HCS12 sleep current plus wide operating voltage let the module stay in low-power mode until a CAN wake-up frame arrives, supporting parasitic-current budgets under 100 uA.

🚗

Door Module / Window Lift Controller

The MC9S12E64MPVE serves door modules that control window lift, mirror fold, lock actuator, and puddle lamp, all multiplexed over a single CAN/LIN backbone. Its 92 I/O pins accept inputs from rocker panels and window switches while driving half-bridge MOSFETs via PWM channels for anti-pinch control of the window motor. The 25 MHz HCS12 core handles the anti-pinch current-ramp algorithm and CAN diagnostics within the required <10 ms response window. 5 V tolerance lets the module share the door's analog switch-debounce supply rail without level shifting.

🏭

Industrial CAN Sensor Node

Outside automotive, the MC9S12E64MPVE works in industrial CANopen sensor nodes measuring pressure, flow, level, or temperature. Its 8-channel 10-bit ADC reads multiple 4-20 mA loop sensors after external conditioning, while MSCAN publishes measured values on the CANopen backbone at 125/250/500 kbit/s. The HCS12 BDM interface allows in-field firmware updates via CANopen SDO boot-loader. Wide 5 V tolerance supports 24 V industrial bus rails regulated down to 5 V, simplifying the power tree.

💡

Lighting Control Module (Headlamp / Tail / Ambient)

The MC9S12E64MPVE drives LED matrix headlamp controllers, adaptive tail-light modules, and interior ambient lighting strips by generating multi-channel PWM at 100-400 Hz with phase-shifted pairs to reduce EMI. Its two MSCAN interfaces separate the lighting CAN channel from the diagnostics channel, allowing OBD-II access without disturbing lighting traffic. 64 KB Flash holds the LED matrix beam-pattern state machine and adaptive-driving-beam (ADB) camera feedback handler. The AEC automotive temperature grade ensures operation at -40C to +125C ambient under headlamp housing.

推荐产品汇总

TJA1057 High-speed CAN transceiver companion 用于: Automotive Body Control Module (BCM), Industrial CAN Sensor Node MC33660 LIN bus transceiver for body sub-modules 用于: Automotive Body Control Module (BCM), Door Module / Window Lift Controller MC33984 NXP Semiconductors 用于: Automotive Body Control Module (BCM), HVAC Climate Control Module, Lighting Control Module (Headlamp / Tail / Ambient) MC33992 Stepper motor gauge driver companion 用于: Instrument Cluster Controller PCA85133 Cluster LCD segment driver 用于: Instrument Cluster Controller TJA1042 NXP Semiconductors 用于: Instrument Cluster Controller, Lighting Control Module (Headlamp / Tail / Ambient) TJA1051 CAN transceiver for HVAC-CAN 用于: HVAC Climate Control Module MCP9700 Cabin temperature analog sensor 用于: HVAC Climate Control Module MC33937 Three-phase gate driver for window motor 用于: Door Module / Window Lift Controller TJA1027 LIN transceiver companion 用于: Door Module / Window Lift Controller MAX31865 RTD temperature sensor front-end 用于: Industrial CAN Sensor Node XTR105 4-20 mA loop transmitter for sensors 用于: Industrial CAN Sensor Node TPS92691 Texas Instruments 用于: Lighting Control Module (Headlamp / Tail / Ambient)
What is the flash memory size of MC9S12E64MPVE?
The MC9S12E64MPVE integrates 64 KB (64K x 8) of on-chip Flash program memory, according to the NXP HCS12 E-family datasheet. This is paired with 4 KB (4K x 8) of RAM for working data. The third-generation Flash supports burst-mode programming, security lock bits, and BDM-based in-circuit updates for field service.
How many I/O pins does the MC9S12E64MPVE expose?
The MC9S12E64MPVE exposes 92 general-purpose I/O pins through its 112-LQFP package, leaving 20 pins reserved for power, ground, oscillator, BDM, and reset. The 112-LQFP (20x20 mm) footprint lets designers route all major peripherals simultaneously - including both CAN modules, full ADC channel count, and capture timers - without pin-multiplexing trade-offs that plague smaller packages.
What supply voltage does the MC9S12E64MPVE support?
The MC9S12E64MPVE supports a wide 2.5 V / 3.3 V / 5 V operating supply range, accepting single-rail analog or mixed-voltage I/O systems. Internally the HCS12 core runs on a regulated 1.8 V domain; the wide external range lets designers power the MCU from a 5 V analog rail or a 3.3 V digital rail without external level shifters, simplifying BOM in automotive body modules.
What is the maximum bus speed of the MC9S12E64MPVE?
The MC9S12E64MPVE HCS12 core runs at up to 25 MHz bus speed, giving roughly 25 MIPS of throughput for 16-bit CISC instructions. For typical automotive body tasks - CAN message handling, PWM generation, ADC sequencing, and state-machine control - 25 MHz is more than sufficient. Higher-speed HCS12X or S12Z derivatives are available if more headroom is required.
Where can I buy the MC9S12E64MPVE and what is the price?
The MC9S12E64MPVE is available from authorized distributors including DigiKey, Mouser, Heisener, TrustedParts, and Rochester Electronics, as of 2026-10-18. Heisener currently lists approximately 2,480 pieces in stock with lead times of 5-7 days for expedited orders. Octopart compares 17 distributors for live bulk pricing. Quoted unit pricing ranges roughly $10-$19 depending on quantity break, with 1-piece pricing near $18.75.
What is the lead time for the MC9S12E64MPVE?
The MC9S12E64MPVE lead time as of 2026-10-18 is reported by Heisener as approximately 5-7 days via expedited shipping (Oct 15 to Oct 20 quoted window). Because this part is marked NRND by NXP/Freescale, lead time tends to lengthen as inventory depletes; design teams should qualify a second source now rather than waiting for a line-down event.
Is the MC9S12E64MPVE in stock anywhere right now?
Yes, the MC9S12E64MPVE is in stock at Heisener (approximately 2,480 pieces as of 2026-10-18) and at Rochester Electronics, which carries legacy NXP/Freescale inventory. DigiKey and Mouser also list the part with intermittent stock. Given NRND status, distributors are draining remaining inventory rather than building new lots - place orders before Q4-2026 depletion.
MC9S12E64MPVE vs MC9S12DJ64CPVE - which should I choose?
The MC9S12E64MPVE and MC9S12DJ64CPVE are both HCS12-family 64KB-Flash MCUs in 112-LQFP, but the E64 (E-series) has different peripheral mix and lower power consumption than the DJ64 (D-family), which targets dual-CAN/J1850 body networks. Choose MC9S12E64MPVE for newer low-power body-control designs; choose MC9S12DJ64CPVE only if you are maintaining an existing J1850/Class-2 legacy platform.
MC9S12E64MPVE vs MC9S12A64CPVE - what is the difference?
The MC9S12E64MPVE (E-family) targets low-power body electronics with reduced peripheral count, while the MC9S12A64CPVE (A-family) is aimed at higher-end body/chassis with a richer peripheral set including additional CAN channels and PWM. Both share 64 KB Flash and 112-LQFP. Pick MC9S12A64CPVE if you need more timers/PWM channels; pick MC9S12E64MPVE for cost-sensitive body nodes where lower pin count and BOM cost matter.
When should I choose MC9S12E64MPVE over an S12X or S12Z part?
Choose the MC9S12E64MPVE only for cost-driven designs where the lowest unit price on a proven 16-bit platform matters more than processing headroom. For new designs with future scalability, an S12X (e.g., MC9S12XEP100MAG) or S12Z MCU offers more Flash, faster core, and more peripherals at similar price. The MC9S12E64MPVE is best treated as a maintain-stock component, not a new-design choice.
What is the best drop-in replacement for MC9S12E64MPVE?
The closest same-package drop-in alternatives within the HCS12 family are MC9S12E64CPVE (industrial temperature grade, same 112-LQFP) and MC9S12E128MPVE (128 KB Flash, same 112-LQFP, more code space). For pin-to-pin second source, the MC9S12DJ64MPVE shares the footprint but adds peripheral differences - verify BDM and pin mapping against your schematic before substituting.
Is there an NXP same-package replacement for the MC9S12E64MPVE?
Yes, NXP offers the MC9S12E128MPVE in the same 112-LQFP footprint with 128 KB Flash (double the code space), making it the cleanest upgrade path for existing MC9S12E64MPVE designs. The MC9S12E64CPVE is also NXP, same footprint, 64 KB Flash, but industrial temperature grade instead of automotive. Both retain BDM, MSCAN, ADC, and PWM block compatibility per the HCS12 E-family reference manual.
Where can I download the MC9S12E64MPVE datasheet PDF?
The official MC9S12E64MPVE datasheet PDF can be downloaded from NXP's product documentation portal at nxp.com (search MC9S12E64), or via FindIC and Zeanoit mirror sites that host the original PDF. According to FindIC, the original datasheet file size is approximately 5427 KB, published 2005-10-10. For the most current revision, always pull from the NXP site rather than third-party mirrors.
Where can I find the MC9S12E64MPVE pinout diagram?
The MC9S12E64MPVE pinout for the 112-LQFP package is documented in the HCS12 E-family reference manual on NXP.com, specifically in the signal description chapter that lists pin-by-pin alternate functions. The 112-LQFP (20x20 mm) pinout includes dedicated BDM, IRQ/XIRQ, oscillator, reset, and dual power/ground domains. Pin 1 is marked with a dot on the package top.
Is the MC9S12E64MPVE RoHS compliant?
Yes, the MC9S12E64MPVE is RoHS compliant per ETEI's comparison data for this part. REACH status is also reported as compliant. The 112-LQFP package uses lead-free (Pb-free) matte-tin terminations suitable for standard reflow profiles up to 260 C peak. Confirm the specific reel's MSL rating on the manufacturer label before reflow assembly to avoid package-cracking defects.

工程参考数据: MC9S12E64MPVE ——对比、设计指导和合规信息。

选型指南

Choose the MC9S12E64MPVE for cost-driven automotive body-control, BCM, HVAC, and door-module designs where the proven HCS12 E-family peripheral mix and 64 KB Flash are sufficient. The wide 2.5V/3.3V/5V supply tolerance simplifies the BOM by allowing the MCU to share a 5 V analog rail without level shifters. Because this part is NRND at NXP, also evaluate MC9S12E128MPVE (same footprint, 128 KB Flash, automotive grade) for new designs needing code headroom, or MC9S12E64CPVE (same footprint, industrial grade) for non-automotive industrial CAN nodes. For greenfield designs, prefer the newer S12X (e.g., MC9S12XEP100MAG) or S12Z families over the HCS12 E-line.

与替代料对比

参数 本产品 MC9S12E128MPVE MC9S12E64CPVE MC9S12DJ64MPVE
Package 112-LQFP (20x20) 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Flash Memory 64 KB 128 KB (+100%) 64 KB 64 KB
Bus Speed 25 MHz 25 MHz 25 MHz 25 MHz
Temperature Grade Automotive (-40C to +125C) Automotive Industrial (-40C to +85C) Automotive
Family / Series HCS12 E-family HCS12 E-family HCS12 E-family HCS12 DJ-family
Supply Voltage 2.5V / 3.3V / 5V 2.5V / 3.3V / 5V 2.5V / 3.3V / 5V 2.5V / 3.3V / 5V
I/O Pins 92 92 92 92

关键差异点

  • Largest Flash option in 112-LQFP for code headroom (对比 MC9S12E64MPVE vs MC9S12E64CPVE)
  • Lower power E-family peripheral mix (对比 MC9S12E64MPVE vs MC9S12DJ64MPVE)
  • Identical 112-LQFP footprint for direct PCB reuse (对比 MC9S12E64MPVE vs MC9S12E128MPVE)

设计说明

Estimated: The MC9S12E64MPVE draws roughly 30-50 mA active at 25 MHz with all peripherals enabled, plus 5-15 mA analog supply current for the ADC and reference. Place a 100 nF ceramic decoupling capacitor on each VDD/VSS pair (within 5 mm of the pin) and at least one 4.7 uF bulk tantalum or ceramic on VDDR. The internal 2.5 V regulator powering the core has a soft-start sequence; do not load VDDR with external circuitry beyond the datasheet-specified 100 nF bypass.

Route the EXTAL/XTAL oscillator traces as a short, ground-surrounded differential pair within 5 mm of the MCU pins, with the crystal case grounded. Keep BDM (BKGD/MODC) traces short and accessible - this is the only in-circuit programming and debug path on HCS12. Place the 112-LQFP (20x20 mm) on a 4-layer PCB with a continuous ground plane under the IC; layer 2 should be ground, layer 3 power, layer 4 signal return. Allow at least 0.5 mm clearance between analog (VRH/VRL/VDDA/VSSA) and digital signals.

Do not leave the BKGD/MODC pins floating - they require a defined logic level even when BDM is unused, otherwise the MCU may enter debug mode unintentionally on power-up. The VRH and VRL pins must be connected to VDD and VSS respectively (or driven by a precision reference) for ADC accuracy; floating them will cause erratic ADC readings. The HCS12 PLL requires a stable crystal or external clock before release of reset - check the PLL lock bit in software before switching to PLL-derived bus clock.

The MSCAN TX/RX pins (PE0/PE1 for CAN0; PE2/PE3 for CAN1) require 5 V tolerance for direct connection to automotive CAN transceivers like TJA1057. Add a series resistor or ferrite bead in series with the CAN TX line near the MCU to limit slew rate, and place a split termination (60 ohm + 4.7 nF) at each CAN node per ISO 11898. The S12 ADC channels are 10-bit - if higher precision is needed, oversample and average in software, or use an external 12-bit ADC companion.

Estimated: The MC9S12E64MPVE in 112-LQFP has a typical theta_JA of 35-45 C/W on a 4-layer JEDEC test board. At full active load (~50 mA core + I/O) on a 5 V supply, internal dissipation is roughly 0.25 W, giving a junction temperature rise of 10-15 C above ambient. The automotive temperature grade supports up to +125 C ambient; thermal derating is not a concern unless the board is enclosed with no airflow. Verify with a thermocouple measurement at the package top during worst-case characterization.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

RoHS and REACH compliance per ETEI cross-comparison data. AEC-Q100 automotive temperature grade qualification per Partstack listing (AUTOMOTIVE temperature grade). Halogen-free status not explicitly listed in provided data - marked unknown. Lead-free (Pb-free) matte-tin terminations standard for 112-LQFP.

数据核验日期: 2026-10-18 ——数据由 XAIPART 元器件工程团队核验和整理

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