SPC5516GBMLQ66 vs SPC5643LFF2MLQ1 对比
详细并排对比 SPC5516GBMLQ66 出自 NXP Semiconductors 和 SPC5643LFF2MLQ1 出自 STMicroelectronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
STMicroelectronics
SPC5643LFF2MLQ1 - Automotive 32-bit Power Architecture MCU | ST
SPC5643LFF2MLQ1 Unknown规格对比
| 参数 | SPC5516GBMLQ66 | SPC5643LFF2MLQ1 |
|---|---|---|
| 品牌 | NXP Semiconductors | STMicroelectronics |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | Unknown |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10.40 | $0.00 |
| Core Processor | e200z0, e200z1 | — |
| Core Size | 32-Bit Dual-Core | — |
| Core Architecture | Power Architecture (MPC55xx Qorivva) | 32-bit Power Architecture (SPC56 automotive family) |
| Maximum Clock Speed | 66 MHz | — |
| Program Memory Size | 1 MB (1M x 8) FLASH | — |
| Program Memory Type | Flash with ECC | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| 电源电压 | 4.5 V to 5.25 V | [DATA_NEEDED: VDD range] |
| Number of I/O | 111 | — |
| Connectivity | CANbus, EBI/EMI, I2C, SCI, SPI | — |
| Peripherals | DMA, POR, PWM, WDT | — |
| 数据总线宽度 | 32-bit | — |
| 封装 | 144-LQFP (20 x 20 mm, 1.40 mm height) | [DATA_NEEDED: package code] (LFF2 ordering convention, QFP-style SMT) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | -40C to +125C (AEC-Q100 Grade 3) | [DATA_NEEDED: temperature range] |
| AEC-Q100 Qualified | Yes (automotive grade) | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| MSL 等级 | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| 品牌 | — | STMicroelectronics |
| Product Family | — | SPC56 automotive MCU family |
| Qualification Target | — | Automotive grade (AEC-Q100 intent, Q1 suffix convention) [DATA_NEEDED: AEC-Q100 grade] |
| Flash Memory | — | [DATA_NEEDED: flash size] |
| SRAM | — | [DATA_NEEDED: SRAM size] |
| Core Clock Frequency | — | [DATA_NEEDED: core frequency] |
| CAN Channels | — | [DATA_NEEDED: CAN channel count] |
| LIN/UART Peripherals | — | [DATA_NEEDED: LIN/UART count] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution] |