SPC5643LFF2MLL6 vs SPC5516GBMLQ66 对比

详细并排对比 SPC5643LFF2MLL6 出自 NXP Semiconductors 和 SPC5516GBMLQ66 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
SPC5643LFF2MLL6 SPC5643LFF2MLL6 - 32-bit Dual-Core 64MHz MCU, 1MB Flash | NXP

SPC5643LFF2MLL6 - 32-bit Dual-Core 64MHz MCU, 1MB Flash | NXP

SPC5643LFF2MLL6 ✓ 量产中
NXP Semiconductors
SPC5516GBMLQ66 SPC5516GBMLQ66 - 32-bit Dual-Core 66MHz MCU 1MB Flash | NXP

SPC5516GBMLQ66 - 32-bit Dual-Core 66MHz MCU 1MB Flash | NXP

SPC5516GBMLQ66 ✓ 量产中

规格对比

参数 SPC5643LFF2MLL6 SPC5516GBMLQ66
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $8.60 $10.40
Core Processor e200z4 (Power Architecture) e200z0, e200z1
Core Size 32-Bit Dual-Core 32-Bit Dual-Core
Max Clock Speed 64 MHz —
Flash Memory 1 MB (1M x 8) —
电源电压 3.3 V / 5 V 4.5 V to 5.25 V
Connectivity CANbus, FlexRay, LINbus, SPI, UART/USART CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Architecture Dual Power Architecture (functional safety features on-chip) —
Series MPC56xx Qorivva —
工作温度 -40C to +125C -40C to +125C (AEC-Q100 Grade 3)
封装 100-LQFP (14 x 14 mm) 144-LQFP (20 x 20 mm, 1.40 mm height)
安装类型 Surface Mount Surface Mount
Grade Automotive —
Part Status Active —
Number of I/O [DATA_NEEDED: Number of I/O] 111
SRAM Size [DATA_NEEDED: SRAM size] —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
Core Architecture — Power Architecture (MPC55xx Qorivva)
Maximum Clock Speed — 66 MHz
Program Memory Size — 1 MB (1M x 8) FLASH
Program Memory Type — Flash with ECC
RAM Size — [DATA_NEEDED: RAM size]
数据总线宽度 — 32-bit
AEC-Q100 Qualified — Yes (automotive grade)
MSL 等级 — [DATA_NEEDED: MSL rating]

数据手册与资源

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