SPC5643LFF2MMM1R vs SPC5674FAMVR3R 对比

详细并排对比 SPC5643LFF2MMM1R 出自 NXP Semiconductors 和 SPC5674FAMVR3R 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
SPC5643LFF2MMM1R SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R ✓ 量产中
NXP Semiconductors
SPC5674FAMVR3R SPC5674FAMVR3R - 32-bit e200z7 MCU 4MB Flash 264MHz PBGA-416

SPC5674FAMVR3R - 32-bit e200z7 MCU 4MB Flash 264MHz PBGA-416

SPC5674FAMVR3R ✓ 量产中

规格对比

参数 SPC5643LFF2MMM1R SPC5674FAMVR3R
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $24.85 $35.02
Manufacturer NXP Semiconductors (formerly Freescale) —
Series MPC5643L (MPC56xx Qorivva family) MPC56xx Qorivva
Core Architecture Power Architecture® e200z4 (dual-core with delayed lockstep) —
Core Count 2 (1 main + 1 lockstep checker) —
Maximum CPU Clock 120 MHz —
Program Memory (Flash) 1 MB (1M x 8) —
Data Memory (SRAM) [DATA_NEEDED: SRAM size] —
Operating Voltage Range [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] —
工作温度范围 -40 °C to +125 °C (automotive grade) —
封装 257-LFBGA / MAPBGA 14x14 mm 416-PBGA (27x27 mm)
安装类型 Surface Mount (BGA) Surface Mount (PBGA)
AEC-Q100 Qualification Yes (Automotive qualified per NXP product page) —
Functional Safety Target ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) —
Communication Interfaces FlexCAN, SPI, I²C, UART (LIN-capable via SCI) —
Debug Interface Nexus (JTAG, auxiliary) —
Lead-Free / RoHS Compliant (lead-free BGA) —
Core Processor — e200z7 (Power Architecture)
Core Size — 32-Bit
Core Speed — 264 MHz
Program Memory Size — 4 MB (4M x 8)
Program Memory Type — FLASH
EEPROM Size — [DATA_NEEDED: EEPROM size]
RAM Size — [DATA_NEEDED: RAM size]
电源电压 — 1.2 V / 3.3 V / 5 V
Number of I/O — 32
Connectivity — CANbus, SCI, SPI
Peripherals — DMA, POR, PWM
工作温度 — -40C to +125C
Automotive Grade — AEC-Q100
Temperature Grade — Automotive

数据手册与资源

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