SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP
料号： SPC5643LFF2MMM1R ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.1 | $381.00 |
| 100 | $32.95 | $3,295.00 |
| 500 | $28.4 | $14,200.00 |
| 1,000 | $24.85 | $24,850.00 |
SPC5643LFF2MMM1R 概述
A 32-bit microcontroller (MCU) is a single-chip computer containing a CPU core, Flash program memory, SRAM data memory, peripherals, and various I/O controllers. The MPC56xx Qorivva family sits within NXP's broader Power Architecture® automotive MCU hierarchy: Power Architecture® → e200z4 core → MPC56xx Qorivva → MPC5643L sub-family. These devices target chassis, body, and powertrain ECUs where deterministic real-time behavior and functional-safety compliance (ISO 26262) are mandatory. Dual-core lockstep architectures allow one core to execute instructions while a second delayed copy verifies every operation, catching transient faults within a single clock cycle.
Key features of the SPC5643LFF2MMM1R include dual e200z4 cores operating at 120 MHz, 1MB (1M x 8) Flash, on-chip SRAM, an integrated FlexCAN module set, an enhanced modular I/O subsystem, and a 32-channel eDMA controller. The device integrates a Nexus-class debug port and JTAG boundary scan for production test, plus on-chip voltage regulation to simplify external power design. It supports both 3.3 V and 5 V I/O signaling and provides dedicated safety peripherals such as a fault collection unit (FCU), watchdog, and memory-protection unit (MPU).
The SPC5643L silicon-block combines two e200z4 Power Architecture cores (one running in lockstep mode), crossbar switch fabric with multi-port RAM, dedicated interrupt controller (INTC), and an enhanced modular I/O subsystem (eMIOS) for PWM generation. This integration minimizes external logic, reduces BOM cost, and shortens time-to-certification for ISO 26262 ASIL-D applications. The 120 MHz core clock plus 32-bit instruction set delivers deterministic interrupt latency well under 1 µs.
Typical applications include automotive electric power steering (EPS) systems, chassis domain controllers, airbag ECU front sensors, body control modules (BCM), and industrial functional-safety PLCs. The wide -40 °C to +125 °C operating range and AEC-Q100 qualification also support harsh under-hood and industrial environments.
When designing with this device, allocate the 257-ball MAPBGA PCB footprint to a dedicated inner signal layer with continuous reference plane, and follow NXP's AN2867 application note for decoupling and thermal dissipation. Use the FreeMASTER and CodeWarrior tool chains for development.
This page synthesizes distributor pricing, AEC-Q100 parametric context, drop-in same-family alternatives, and design notes that go beyond what the manufacturer datasheet alone provides.
直接替换替代料： SPC5643LFF2MMM1R ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： SPC5643LFF2MMM1R （相同外形与封装尺寸） ——差异在于 Core Architecture, Operating Temperature Range, Package, Mounting Type, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
SPC5644AF0MLU1R
✅ 直接替换✓ 有现货
$42.75 / 个
查看数据手册 →SPC5673KF0VMM1R
✅ 直接替换📋 参考替代料（不在目录中）
SPC5744PFK1AKLQ8
✅ 直接替换✓ 有现货
$16.8 / 个
查看数据手册 →SPC5645SF1VVU
✅ 直接替换✓ 有现货
$27.1 / 个
查看数据手册 →SPC5674FAMVR3R
✅ 直接替换✓ 有现货
$35.02 / 个
查看数据手册 →SPC5607BF1VLU6
✅ 直接替换✓ 有现货
$17.5181 / 个
查看数据手册 →SPC5606SF2CLU6
✅ 直接替换✓ 有现货
$8.78 / 个
查看数据手册 →SPC5643LFF2MMM1R 最大额定值与电气特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC5643L (MPC56xx Qorivva family) |
| Core Architecture | Power Architecture® e200z4 (dual-core with delayed lockstep) |
| Core Count | 2 (1 main + 1 lockstep checker) |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| 工作温度范围 | -40 °C to +125 °C (automotive grade) |
| 封装 | 257-LFBGA / MAPBGA 14x14 mm |
| 安装类型 | Surface Mount (BGA) |
| AEC-Q100 Qualification | Yes (Automotive qualified per NXP product page) |
| Functional Safety Target | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) |
| Communication Interfaces | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) |
| Debug Interface | Nexus (JTAG, auxiliary) |
| Lead-Free / RoHS | Compliant (lead-free BGA) |
SPC5643LFF2MMM1R 257-lfbga / mapbga 14x14 mm 引脚配置指南
SPC5643LFF2MMM1R（257-lfbga / mapbga 14x14 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： SPC5643LFF2MMM1R.
请参阅 数据手册 以查看完整引脚配置。
典型应用
SPC5643LFF2MMM1R 适用于 6 应用s: Electric Power Steering (EPS) ECU, Chassis Domain Controller, Airbag ECU / Restraint Control, Body Control Module (BCM), Industrial Functional-Safety PLC, Battery Management System (BMS) Master.
Electric Power Steering (EPS) ECU
The SPC5643LFF2MMM1R's dual e200z4 lockstep cores at 120 MHz, AEC-Q100 grade, and 1 MB Flash make it a strong fit for ISO 26262 ASIL-D capable electric power steering ECUs. The eMIOS timer subsystem provides the high-resolution PWM required for current-control loops driving the EPS motor, while the FlexCAN interfaces connect to the chassis CAN bus at 500 kbit/s to 1 Mbit/s. The fault collection unit (FCU) and on-chip ECC on Flash and RAM allow single-point fault detection within one clock cycle, satisfying ASIL-D decomposition rules. Placed on a multilayer PCB with thermal vias beneath the 257-MAPBGA, it dissipates roughly 1-2 W under full lockstep activity.
推荐
Chassis Domain Controller
The SPC5643LFF2MMM1R serves as the central microcontroller for chassis domain controllers consolidating active suspension, brake, and steering subsystems. Its dual FlexCAN ports and eSCI/LIN-compatible UARTs allow multiple bus domains to be terminated on a single MCU, while the 120 MHz e200z4 pair runs chassis control loops under 1 ms. The 1 MB Flash stores calibration tables and platform software; ECC on Flash prevents silent memory faults that would violate ASIL-D requirements. Hardware security via the on-chip watchdog and memory-protection unit (MPU) further supports fail-operational strategies. Power dissipation for the controller sits at roughly 0.8-1.5 W with proper thermal via stitching.
推荐
Airbag ECU / Restraint Control
The SPC5643LFF2MMM1R is well suited to airbag and restraint ECUs that demand deterministic interrupt response and functional-safety compliance. The dual-core lockstep architecture combined with the fault collection unit allows crash-algorithm execution with single-point fault coverage, a core requirement for ASIL-D airbag systems. The 1 MB Flash accommodates deployment algorithms and crash-pulse signature libraries; the on-chip 12-bit ADC (within the MPC5643L platform) captures sensor data from satellite crash sensors via the PSI5 or SPI interface. With -40 °C to +125 °C operation and AEC-Q100 qualification, the part is validated for under-hood and cabin crash-zones.
推荐
Body Control Module (BCM)
The SPC5643LFF2MMM1R powers next-generation body control modules, consolidating lighting, wiper, door, and accessory drivers with LIN and CAN connectivity. Its integrated FlexCAN and LIN-capable eSCI controllers reduce external transceiver count, while the e200z4 core at 120 MHz handles BodyDomain control logic in well under 1 ms. The 1 MB Flash stores application firmware plus OEM customization tables. AEC-Q100 qualification and -40 °C to +125 °C operating range make the part a strong fit for cabin-mounted modules experiencing thermal stress. Power draw is modest at ~0.5-1 W, allowing fan-less sealed enclosures.
推荐
Industrial Functional-Safety PLC
The SPC5643LFF2MMM1R brings automotive-grade safety architecture into industrial PLC platforms targeting IEC 61508 SIL-3 and ISO 13849 PL=d. Its dual-core lockstep, hardware watchdog, and on-chip voltage supervisor provide diagnostic coverage above 99 % when properly deployed. The 1 MB Flash and 120 MHz CPU run process-control loops with deterministic interrupt latency; FlexCAN allows integration with industrial CANopen or DeviceNet masters. The 257-ball MAPBGA is suitable for multilayer industrial boards; designers should follow NXP's AN2867 layout application note to manage BGA thermal coupling.
推荐
Battery Management System (BMS) Master
The SPC5643LFF2MMM1R can serve as the master MCU in a 400 V or 800 V automotive battery management system, supervising cell-monitoring ASICs via isolated SPI. Its dual-core lockstep architecture satisfies the ASIL-C/D decomposition needs of state-of-charge and state-of-health calculations, and the 1 MB Flash stores lookup tables and firmware. The on-chip eMIOS PWM drives contactor control with microsecond resolution. The 257-MAPBGA's thermal envelope supports placement near the battery pack's high-voltage boundary when paired with adequate copper area.
推荐
推荐产品汇总
工程参考数据： SPC5643LFF2MMM1R ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | SPC5644AF0MLU1R | SPC5673KF0VMM1R | SPC5744PFK1AKLQ8 | SPC5645SF1VVU | SPC5674FAMVR3R |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 257-LFBGA / MAPBGA 14x14 mm | MAPBGA-257 family | MAPBGA-257 family | MAPBGA-257 family / LQFP variant | MAPBGA-257 family | MAPBGA-257 family |
| Core Architecture | e200z4 dual-core lockstep | e200z4 dual-core | e200z4 dual-core | e200z4 dual-core | e200z4 dual-core | e200z4 dual-core |
| Maximum CPU Clock | 120 MHz | 150 MHz class | 180+ MHz class | 200+ MHz class | 120 MHz class | 180+ MHz class |
| Flash Memory | 1 MB | 1.5 MB class | 1 MB | 2 MB class | 1 MB class | 2 MB class |
| Operating Temperature Range | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| AEC-Q100 Qualification | Yes | Yes | Yes | Yes | Yes | Yes |
| Functional Safety Target | ISO 26262 ASIL-D capable | ASIL-D capable | ASIL-D capable | ASIL-D capable | ASIL-D capable | ASIL-D capable |
| Carrier / Shipping Format | Tape & Reel (R suffix) | Tape & Reel | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
关键差异点
- Wider automotive qualification footprint with documented MPC5643L family errata history （对比 SPC5644AF0MLU1R)
- Optimized 120 MHz performance/power envelope （对比 SPC5674FAMVR3R)
- Compact 257-ball MAPBGA footprint aligns with chassis ECU design reuse （对比 SPC5607BF1VLU6)
设计说明
The 257-ball MAPBGA package dissipates roughly 1-2 W under full lockstep dual-core activity at 120 MHz. Place a thermal-via array (0.3 mm drill, 0.5 mm pitch) directly beneath the central die-up area of the BGA to conduct heat into an inner 2 oz copper plane. Estimate: at θJA of ~25 °C/W (JEDEC 4-layer), junction temperature rises ~25-50 °C above ambient, leaving adequate margin for +125 °C automotive operation.
Use a 6-layer or 8-layer PCB stack-up for the SPC5643LFF2MMM1R to maintain reference-plane continuity for the high-speed eMIOS and FlexCAN signals. Per NXP AN2867, keep BGA fan-out either via-in-pad (preferred for the inner rows) with a 0.4 mm drill and 0.2 mm annular ring, or dog-bone if via-in-pad is unavailable. Stitch ground vias around the BGA perimeter every 1.27 mm to suppress edge radiation from the high-frequency signals.
Do not assume the SPC5643LFF2MMM1R and SPC5674FAMVR3R share the same ball-map without verifying against each device-specific datasheet revision. MPC56xx family siblings reuse peripheral IP but not always ball assignments. Lock the errata mask revision in your safety case (FMEDA) at design freeze, since later errata can affect lockstep diagnostic coverage and require re-qualification.
Route the FlexCAN differential pair with 100 Ω ±10 % differential impedance on the top layer over an unbroken ground plane, keeping trace length matching under 5 mm. Place the CAN bus termination (120 Ω) within 25 mm of the connector. For the Nexus debug port, keep all 14 traces length-matched and shielded by ground to avoid false debug-port lockups during EMC testing.
合规信息
RoHS and lead-free per NXP and distributor product listings; AEC-Q100 automotive qualified per NXP product page; halogen-free status not stated in verified snippets and flagged as 'unknown'.
