TJA1022HGZ vs TJA1024HG 对比
详细并排对比 TJA1022HGZ 出自 NXP Semiconductors 和 TJA1024HG 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
TJA1022HGZ - Dual LIN 2.2A/SAE J2602 Transceiver DHVQFN-24 | NXP
TJA1022HGZ ✓ 量产中规格对比
| 参数 | TJA1022HGZ | TJA1024HG |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Interface ICs | Interface ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1.98 | $2.84 |
| 功能 | Dual LIN 2.2A / SAE J2602 transceiver | Quad LIN 2.2A/SAE J2602 transceiver |
| Number of Channels | 2 (dual independent LIN physical layer) | — |
| Protocol | LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 | — |
| Maximum Data Rate | 20 kBd | — |
| Supply Voltage (VBAT) | 5 V to 27 V (load-dump tolerant to 40 V) | 5 V to 27 V (load-dump tolerant to 40 V) |
| Logic Supply (VCC) | 3.3 V or 5 V integrated LDO | — |
| 工作温度 | -40 C to +125 C | -40 C to +125 C |
| 封装 | DHVQFN-24 (5.5 x 3.5 mm) with exposed pad | DHVQFN-24 (SOT815-1), 3.5 x 5.5 mm |
| 安装类型 | Surface Mount | Surface Mount |
| MSL (Moisture Sensitivity Level) | 1 | — |
| Peak Reflow Temperature | 260 C (max 30 s) | — |
| Terminal Finish | Nickel-Palladium-Gold-Silver (NiPdAuAg) | — |
| JEDEC J-Standard | JESD-609 code e4 | — |
| Automotive Qualification | AEC-Q100 (intended for in-vehicle sub-networks) | — |
| RoHS / REACH | RoHS compliant per NXP product page | — |
| Number of LIN Channels | — | 4 (two independent dual-LIN transceivers) |
| 数据速率 | — | Up to 20 kBd |
| LIN Compliance | — | LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 |
| LIN Bus Peak Current | — | 2.2 A |
| Sleep Mode Current | — | < 10 uA (typical per dual channel) |
| ESD (LIN pin, HBM) | — | [DATA_NEEDED: HBM ESD value V] |
| AEC-Q100 | — | Qualified |
| RoHS 状态 | — | Compliant |
| Software Compatibility | — | TJA1022, TJA1027, TJA1029 |
| 引脚数 | — | 24 |