XC6SLX25-2FG484C vs XC6SLX25-3FG484I 对比
详细并排对比 XC6SLX25-2FG484C 出自 AMD 和 XC6SLX25-3FG484I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX25-2FG484C | XC6SLX25-3FG484I |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Device Type | Field-Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 24,051 cells | 24,051 cells |
| Number of I/O | 266 I/O | — |
| Internal Frequency | 500 MHz | 500 MHz |
| Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | [DATA_NEEDED: core supply voltage] |
| Speed Grade | -2 | -3 |
| Package Type | 484-pin FBGA | 484-BBGA |
| Number of Package Balls | 484 balls | — |
| Terminal Type | Ball | — |
| Package Shape | Square | — |
| 工作温度 | 0°C to 85°C | 0°C to 85°C |
| Lead-Free Status | Lead-free | Lead-free package |
| RoHS 状态 | RoHS compliant | [DATA_NEEDED: RoHS status] |
| 安装类型 | Surface mount | — |
| I/O Count | — | 266 I/O |
| Process Technology | — | 45 nm CMOS |
| Package Pin Count | — | 484 pins |
| Package Body Size | — | 15 mm x 15 mm |
| Ball Pitch | — | 0.80 mm |
| Terminal Form | — | BGA balls |
| Power Consumption | — | [DATA_NEEDED: typical and maximum power consumption] |
| REACH Status | — | [DATA_NEEDED: REACH status] |