XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD
料号： XC6SLX25-3FG484I ✓ 量产中XC6SLX25-3FG484I 概述
A field-programmable gate array is a semiconductor whose digital logic, interconnect, and peripheral functions are configured after manufacture. The FPGA hierarchy extends from configurable logic blocks and programmable interconnect to FPGA, programmable logic device, and digital semiconductor. Compared with a fixed-function application-specific integrated circuit, an FPGA allows interface changes, parallel processing, and hardware customization to be implemented in a single device while retaining the flexibility of field updates.
The XC6SLX25-3FG484I combines 24,051 logic cells with 266 available I/O in a 484-BBGA package. The verified data identifies a 500 MHz internal frequency, a -3 speed designation, and operation from 0°C to 85°C. Its 484-ball format supports substantially denser board routing than a low-pin-count FPGA package, while the 15 mm by 15 mm body and 0.80 mm ball pitch provide a practical high-density footprint for multilayer PCB layouts.
The Spartan-6 LX architecture is positioned between fixed logic and higher-end programmable SoC devices. Its logic resources can implement parallel data acquisition, protocol conversion, control state machines, and interface bridging, while its I/O count allows multiple external buses and high-speed links to converge on one package. The -3 grade favors designs in which timing performance is more important than the lower power or lower cost associated with slower speed grades.
Typical uses include industrial automation, embedded control, communications equipment, test and measurement systems, signal processing, and generic embedded processing. The 266 I/O are useful when a design must connect external memories, transceivers, converters, and control peripherals. The 500 MHz internal frequency also provides a meaningful clocking target for pipelined logic, provided that board-level timing closure is completed with the selected toolchain and design constraints.
Engineers should treat the 484-BBGA as a demanding fine-pitch package. PCB design must provide adequate escape routing, power and ground planes, via access, and thermal spreading. The verified sources expose a pinout-file resource, but the complete 484-ball pin map and exact power requirements were not included in the supplied data; those details must therefore be confirmed against the manufacturer package files and datasheet before release.
This product record combines verified distributor availability information, exact device identity, package characteristics, and practical design considerations with same-family replacement guidance. It distinguishes confirmed facts from unresolved parameters and avoids presenting an unverifiable pinout, price schedule, or cross-vendor equivalence as established data.
直接替换替代料： XC6SLX25-3FG484I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC6SLX25-3FG484I （相同外形与封装尺寸） ——差异在于 Device Type, Lead-Free Status, Operating Temperature, Package Type, Speed Grade.
XC6SLX25-2FG484I
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →XC6SLX25-1FG484I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC6SLX25-3FG484C
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →XC6SLX25-2FG484C
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →XC6SLX25-1FG484C
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC6SLX25-3FG484I 最大额定值与电气特性
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 24,051 cells |
| I/O Count | 266 I/O |
| Internal Frequency | 500 MHz |
| Speed Grade | -3 |
| Process Technology | 45 nm CMOS |
| Package Type | 484-BBGA |
| Package Pin Count | 484 pins |
| Package Body Size | 15 mm x 15 mm |
| Ball Pitch | 0.80 mm |
| 工作温度 | 0°C to 85°C |
| Lead-Free Status | Lead-free package |
| Terminal Form | BGA balls |
XC6SLX25-3FG484I 15 mm x 15 mm 引脚配置指南
XC6SLX25-3FG484I（15 mm x 15 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC6SLX25-3FG484I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC6SLX25-3FG484I 适用于 6 应用s: Industrial Automation and Control, Communications and Protocol Conversion, Video and Image Interface Processing, Test and Measurement Instrumentation, Embedded Processing and System Control, Audio and Communication Interface Hub.
Industrial Automation and Control
The XC6SLX25-3FG484I is suitable for industrial automation because it combines 24,051 logic cells, 266 I/O, and a 500 MHz internal frequency in one programmable device. Engineers can implement motor-control sequencing, sensor conditioning logic, safety interlocks, and machine communication in parallel rather than splitting them among multiple fixed-function devices. The -3 speed grade benefits timing-sensitive control paths, while the 484-BBGA package provides enough ball density for external transceivers, converters, and isolated interfaces. Its 0°C to 85°C operating range is also appropriate for many industrial enclosure temperatures, subject to final system qualification.
推荐
Communications and Protocol Conversion
The Spartan-6 LX XC6SLX25-3FG484I can consolidate multiple communications functions because its 24,051 logic cells and 266 I/O provide substantial parallel-processing capacity. A single implementation can bridge legacy serial interfaces, frame packets, manage buffers, and supervise communication status while operating from a 500 MHz internal clock. The 484-BBGA package supports dense routing to network transceivers and other high-speed companions. For networking equipment, timing closure should be performed for each implemented interface because the verified data identifies the internal frequency but does not provide individual I/O performance ratings.
推荐
Video and Image Interface Processing
The XC6SLX25-3FG484I is well matched to parallel video and image-processing tasks that benefit from configurable logic depth. Its 24,051 logic cells can support pixel pipelines, timing generators, crossbar routing, and format conversion, while 266 I/O provide connections to sensors, memory, and display interface devices. The 500 MHz internal frequency allows pipelined processing stages to be distributed rather than processed serially. In display or camera designs, the fine-pitch 484-BBGA footprint reduces board area but requires careful escape routing and a multilayer PCB with continuous power and ground planes.
推荐
Test and Measurement Instrumentation
A 24,051-cell FPGA can implement parallel acquisition, trigger logic, calibration, and result processing in a test-and-measurement instrument. The XC6SLX25-3FG484I provides 266 I/O for connecting converters, memory, and front-end devices, and its 500 MHz internal frequency supports deeply pipelined digital channels. The -3 grade is attractive when instrumentation timing margins are tight, although actual channel-rate claims require project-specific static timing analysis. Designers should also budget board space for decoupling and thermal spreading because the 484-BBGA package concentrates a large number of connections into a 15 mm by 15 mm body.
推荐
Embedded Processing and System Control
The Spartan-6 LX XC6SLX25-3FG484I can act as a hardware-assisted control processor for systems requiring deterministic parallel operations. Its programmable logic can execute multiple state machines, data filters, and accelerator pipelines while external processors handle higher-level software tasks. With 266 I/O and 24,051 logic cells, the device is suitable for consolidating supervisory control around an embedded processor. The industrial-temperature grade and -3 speed designation provide flexibility, but software-to-hardware interfaces, interrupt timing, and memory-mapped buses must be designed and constrained for the selected FPGA toolchain.
推荐
Audio and Communication Interface Hub
The XC6SLX25-3FG484I can combine audio, control, and communications logic in one device for multimedia or communication endpoints. Its 24,051 logic cells allow audio-format conversion, buffering, and control processing to operate concurrently, while 266 I/O connect codecs, memories, and network interfaces. The 500 MHz internal clock provides headroom for pipelined sample-processing paths, but supported external audio rates depend on the selected I/O standards and timing constraints. The 484-BBGA package supports the required fanout, although its 0.80 mm ball pitch demands assembly inspection and precise PCB alignment.
推荐
推荐产品汇总
工程参考数据： XC6SLX25-3FG484I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC6SLX25-2FG484I | XC6SLX25-1FG484I | XC6SLX25-3FG484C | XC6SLX25-2FG484C | XC6SLX25-1FG484C |
|---|---|---|---|---|---|---|
| Package | 484-BBGA | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| Speed Grade | -3 | -2 | -1 | -3 | -2 | -1 |
| I/O Count | 266 I/O | 266 I/O | 266 I/O | 266 I/O | 266 I/O | 266 I/O |
关键差异点
- Highest-performance speed grade in the compared Spartan-6 LX alternatives （对比 XC6SLX25-2FG484I)
- Maintains the -3 speed grade when changing temperature suffix （对比 XC6SLX25-3FG484C)
- Industrial-temperature suffix in the same FG484 footprint （对比 XC6SLX25-3FG484C)
- Higher speed grade than the two lower-grade same-package candidates （对比 XC6SLX25-1FG484I)
设计说明
The 484-BBGA package uses 0.80 mm pitch balls on a 15 mm by 15 mm body, so the PCB should use a manufacturer-compatible land pattern and escape-routing strategy. Avoid routing high-speed signals directly through the BGA area; use via fields and short layer transitions to reach external components. Assembly drawings should be cross-checked against the official AMD package file because the complete pin list was not included in the supplied web data.
Provide separate, low-impedance power and ground planes with dense vias near the device, and place decoupling capacitors close to the relevant package balls. Capacitor values and voltage tolerances must be selected from the official power-supply requirements rather than estimated here. Confirm all core, auxiliary, and I/O supply rails against the package pinout before fabrication because the supplied source did not include voltage values.
The 484-ball footprint concentrates power dissipation into a small package area. Use uninterrupted ground planes and thermal vias beneath the device where the package design permits, and maintain airflow across the board or provide a defined thermal path. Actual junction temperature depends on device activity, board construction, and enclosure temperature, so estimate it only after obtaining the manufacturer power data and ambient operating conditions.
Do not treat the XC6SLX25-3FGG484I as a drop-in replacement merely because both have 484 balls. Verified cross-reference information describes FGG484 as a 23 mm by 23 mm, 1 mm-pitch package, whereas the target FG484 is 15 mm by 15 mm with 0.80 mm pitch. Likewise, speed-grade substitutions require static timing analysis and bitstream validation before a board is released.
合规信息
The verified package data identifies the target as lead-free. RoHS, REACH, halogen-free, and conflict-minerals statements were not included in the supplied sources and are therefore recorded as unknown.