XC6SLX25-3FG484C vs XC6SLX25-3FGG484I 对比

详细并排对比 XC6SLX25-3FG484C 出自 Advanced Micro Devices, Inc. 和 XC6SLX25-3FGG484I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Advanced Micro Devices, Inc.
XC6SLX25-3FG484C XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx

XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx

XC6SLX25-3FG484C ✓ 量产中
AMD
XC6SLX25-3FGG484I XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD

XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD

XC6SLX25-3FGG484I ✓ 量产中

规格对比

参数 XC6SLX25-3FG484C XC6SLX25-3FGG484I
品牌 Advanced Micro Devices, Inc. AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Type FPGA —
FPGA Family Spartan-6 LX —
Logic Cells 24,051 cells 24051
Configurable Logic Blocks 1,879 CLBs —
Internal Frequency 500 MHz 500 MHz
Process Technology 45 nm CMOS 45nm CMOS
Core Supply Voltage 1.2 V —
Speed Grade -3 -3 (highest performance)
工作温度 0 °C to 85 °C —
封装 484-BBGA, 15 x 15 mm, 0.80 mm pitch 484-BBGA (23x23 mm)
Package Classification Lead-free CSBGA-324 —
Metal Balls 266 balls —
Package Reference MO-275 —
安装类型 Surface Mount Surface Mount
RoHS 状态 Compliant Compliant
Family — Spartan-6 LX
Configurable Logic Blocks (CLBs) — 1879
Total RAM Bits — 958464
Number of I/O — 266
工作电源电压 — 1.14 V ~ 1.26 V
工作温度范围 — -40°C ~ 100°C (TJ)
Lead Free — Yes
Number of LABs/CLBs — 1879

数据手册与资源

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