XC6SLX25-3FGG484I vs XC6SLX25-2FG484I 对比
详细并排对比 XC6SLX25-3FGG484I 出自 AMD 和 XC6SLX25-2FG484I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX25-3FGG484I | XC6SLX25-2FG484I |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | Unknown |
| Family | Spartan-6 LX | — |
| Logic Cells | 24051 | 24,051 cells |
| Configurable Logic Blocks (CLBs) | 1879 | — |
| Total RAM Bits | 958464 | — |
| Number of I/O | 266 | 266 I/O |
| 封装 | 484-BBGA (23x23 mm) | 484-pin FBGA |
| 安装类型 | Surface Mount | Surface Mount |
| 工作电源电压 | 1.14 V ~ 1.26 V | — |
| 工作温度范围 | -40°C ~ 100°C (TJ) | — |
| Speed Grade | -3 (highest performance) | -2 |
| Internal Frequency | 500 MHz | 500 MHz |
| Process Technology | 45nm CMOS | — |
| RoHS 状态 | Compliant | RoHS Non-Compliant |
| Lead Free | Yes | — |
| Number of LABs/CLBs | 1879 | — |
| Device Type | — | Spartan-6 LX FPGA |
| Technology | — | 45 nm CMOS |
| 电源电压 | — | 1.2 V |
| Package Type | — | 484-BBGA |
| Package Dimensions | — | 15 x 15 mm |
| Package Pitch | — | 0.80 mm |
| 工作温度 | — | 0 C to 85 C |
| Terminals | — | 484 balls |
| Lead-Free Status | — | Contains Lead |
| 输出配置 | — | Field Programmable Gate Array |
| FPGA Family | — | Spartan-6 LX |
| Device Revision | — | [DATA_NEEDED: device revision] |
| Block RAM | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slices | — | [DATA_NEEDED: DSP slice count] |