XC6SLX45-2FG676I vs XC6SLX45-3FG676I 对比

详细并排对比 XC6SLX45-2FG676I 出自 AMD 和 XC6SLX45-3FG676I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 XC6SLX45-2FG676I XC6SLX45-3FG676I
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 Unknown
Device Type Spartan-6 LX Field Programmable Gate Array (FPGA) Field Programmable Gate Array (FPGA)
Logic Cells 43,661 cells 43,661 cells
I/O Count 358 I/O —
Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Speed Grade -2 —
Temperature Grade Industrial Industrial
封装 676-BGA 676-BGA, 1 mm pitch
Package Type BGA FCBGA-676
Number of Terminals 676 —
Package Shape Square —
Terminal Form Ball —
Programmable Logic Type FPGA FPGA
Manufacturer AMD / Xilinx —
RoHS 状态 [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
工作温度范围 [DATA_NEEDED: operating temperature range] —
最大时钟频率 [DATA_NEEDED: maximum clock frequency] —
Block RAM [DATA_NEEDED: block RAM capacity] 2,138,112 RAM bits
DSP Resources [DATA_NEEDED: DSP resource count] —
FPGA Family — Spartan-6 LX
Configurable Logic Blocks — 3,411 CLBs
Maximum Internal Frequency — 500 MHz
Number of I/O — 358 I/O
电源电压 — 1.14 V to 1.26 V
Process Technology — 45 nm CMOS
Package Dimensions — 27 mm x 27 mm
Lead-Free Status — Lead-free
工作温度 — 0°C to 85°C
安装类型 — Surface mount
Configuration Memory — [DATA_NEEDED: configuration memory type]
Number of DSP Blocks — [DATA_NEEDED: DSP block count]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency by I/O and logic configuration]
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]

数据手册与资源

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