XC6SLX45-3FG676I - 43,661-Cell Spartan-6 FPGA | AMD
料号： XC6SLX45-3FG676I ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XC6SLX45-3FG676I 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 LX family combines configurable logic blocks, block RAM, digital signal processing resources, and programmable I/O. This makes an FPGA suitable for parallel data processing, protocol bridging, control automation, signal generation, and system consolidation where changing hardware requirements are important.
The verified device information identifies 43,661 logic cells, 2,138,112 RAM bits, 358 I/O, and 500 MHz internal frequency. The -3 suffix denotes the highest-performance speed grade listed in the retrieved Spartan-6 LX data. The XC6SLX45 device combines substantial programmable logic with embedded block memory, allowing designers to implement parallel datapaths and control functions in one device rather than relying on multiple fixed-function components.
The XC6SLX45-3FG676I uses a 676-BGA package with a 1 mm ball pitch and is identified as lead-free in the retrieved distributor and comparison data. Its operating-temperature classification is reported as industrial in the retrieved Partstack result, while the provided DigiChip listing reports 0°C to 85°C. Designers should verify the exact temperature grade, electrical limits, package dimensions, and power requirements against the official AMD Spartan-6 documentation before release to manufacturing.
Typical applications include industrial automation, test and measurement equipment, communications infrastructure, embedded control systems, data acquisition, and digital signal processing. The large I/O count is valuable for systems requiring parallel interfaces, while the RAM resources support buffering, packet storage, lookup tables, and high-throughput parallel logic. FPGA designs must also account for configuration setup, clocking, power delivery, thermal performance, signal integrity, and pin assignment.
For a new design, use the official AMD Spartan-6 package files and datasheet to confirm every BGA ball assignment, power rail, decoupling requirement, configuration interface, and supported I/O standard. This page summarizes verified catalog data and highlights the practical design considerations that matter most when selecting, routing, sourcing, or replacing this FPGA.
直接替换替代料： XC6SLX45-3FG676I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC6SLX45-3FG676I （相同外形与封装尺寸） ——差异在于 Logic Cells, Mounting Type, Operating Temperature, Package, Process Technology.
快速对比工具——选择替代料号进行并排对比：
XC6SLX45-3FGG676I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45-2FG676I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45-N3FG676I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45-2FGG676C
✅ 直接替换✓ 有现货
$24.5 / 个
查看数据手册 →XC6SLX45-N3FGG676I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45-3FG676I 最大额定值与电气特性
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 43,661 cells |
| Configurable Logic Blocks | 3,411 CLBs |
| Block RAM | 2,138,112 RAM bits |
| Maximum Internal Frequency | 500 MHz |
| Number of I/O | 358 I/O |
| 电源电压 | 1.14 V to 1.26 V |
| Process Technology | 45 nm CMOS |
| 封装 | 676-BGA, 1 mm pitch |
| Package Type | FCBGA-676 |
| Package Dimensions | 27 mm x 27 mm |
| Lead-Free Status | Lead-free |
| 工作温度 | 0°C to 85°C |
| Temperature Grade | Industrial |
| 安装类型 | Surface mount |
| Programmable Logic Type | FPGA |
XC6SLX45-3FG676I 27 mm x 27 mm 引脚配置指南
XC6SLX45-3FG676I（27 mm x 27 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC6SLX45-3FG676I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC6SLX45-3FG676I 适用于 6 应用s: Industrial Automation Control, Communications Infrastructure, Data Acquisition and Test Equipment, Embedded Control and Instrumentation, Digital Signal Processing, High-Speed Data Interfaces.
Industrial Automation Control
The AMD XC6SLX45-3FG676I is suitable for industrial automation when a design needs substantial parallel logic, configurable I/O, and local memory. Its listed 43,661 logic cells and 2,138,112 RAM bits can support sequencing, machine-state control, sensor aggregation, actuator drivers, and communication bridges without relying solely on a microcontroller. The 358-I/O count helps when the controller must connect to multiple digital inputs, outputs, counters, and field-bus interfaces. The device is reported as industrial-grade in the retrieved Partstack data, but the exact temperature, power, and qualification requirements should be verified in the official AMD documentation for each production design.
推荐
Communications Infrastructure
XC6SLX45-3FG676I can serve as a programmable communications controller when design requirements include parallel packet processing, buffering, protocol framing, or custom interface timing. The listed 2,138,112 RAM bits provide on-chip storage for packet buffers and queues, while 43,661 logic cells support parallel datapaths and state machines. Its 358 available I/O are useful for parallel data buses and chip-to-chip interfaces. The catalog data identifies a 500 MHz internal-frequency value, but actual line rates depend on the selected I/O standard, clocking architecture, timing constraints, and FPGA implementation, so the design should be closed with the official AMD timing and I/O specifications.
推荐
Data Acquisition and Test Equipment
The Spartan-6 LX XC6SLX45-3FG676I is appropriate for data-acquisition and test systems that require configurable timing, parallel sampling, and local data storage. Its listed 358 I/O can support wide digital interfaces, while the 2,138,112 RAM bits can buffer captured data between acquisition and processing stages. The FPGA can implement trigger logic, channel sequencing, filtering, pattern generation, and communication formatting in programmable hardware. Because the supplied results do not provide analog specifications, differential I/O limits, or acquisition reference circuits, those requirements must be checked separately; the FPGA is the digital processing and control element, not a substitute for an analog front end.
推荐
Embedded Control and Instrumentation
XC6SLX45-3FG676I fits embedded control and instrumentation systems where deterministic hardware timing, programmable state machines, and flexible I/O are more valuable than a fixed instruction set. The 3,411 CLBs and 43,661 logic cells allow control logic to be partitioned into parallel acquisition, sequencing, protection, and communication blocks. Its block RAM can hold lookup tables, calibration data, or operational status, while the 358 I/O support external sensors, relays, displays, and industrial interfaces. The listed 1.14 V to 1.26 V supply range indicates a 1.2 V-class power domain, but the exact core and I/O rail architecture must be confirmed in the official AMD documentation.
推荐
Digital Signal Processing
The Spartan-6 LX device is a useful platform for parallel digital signal processing because programmable logic can implement filters, correlators, waveform generation, and data-format converters with deterministic timing. Its 43,661 logic cells provide substantial combinational and sequential capacity, and the 2,138,112 RAM bits support sample buffers, delay lines, and coefficient storage. The 500 MHz catalog frequency is a device-level reference rather than a guaranteed user clock rate; achievable throughput depends on pipeline structure, clocking, memory inference, I/O standards, and timing closure. Use the AMD implementation tools and official resource tables to confirm DSP block availability and map the design to the selected XC6SLX45 device.
推荐
High-Speed Data Interfaces
XC6SLX45-3FG676I is suitable for interface bridging and high-speed parallel data handling when the design requires programmable protocol logic and flexible I/O timing. The 358-I/O count can support wide data buses, while the FPGA's configurable logic can implement framing, lane alignment, buffering, error detection, and clock-domain crossing. The 676-BGA package provides a high pin-count interface platform, but it also requires careful escape routing, via-in-pad and microvia planning, reference-plane continuity, and BGA assembly capability. The supplied data does not verify specific transceiver standards or maximum user I/O rates, so board designers should obtain the official package and I/O documentation before committing to a physical interface.
推荐
推荐产品汇总
工程参考数据： XC6SLX45-3FG676I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC6SLX45-3FGG676I | XC6SLX45-2FG676I | XC6SLX45-N3FG676I | XC6SLX45-2FGG676C | XC6SLX45-N3FGG676I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 | -3 | -2 | N3 ordering notation | -2 | N3 ordering notation |
关键差异点
- The target is identified with the -3 speed-grade suffix, associated with the highest Spartan-6 LX performance grade in the retrieved family data. （对比 XC6SLX45-2FG676I)
- The target is verified with 43,661 logic cells, 2,138,112 RAM bits, and 358 I/O. （对比 XC6SLX45-3FGG676I)
- The target is presented in a 676-BGA package with a 1 mm pitch. （对比 XC6SLX45-FGG484)
设计说明
The XC6SLX45-3FG676I uses a high-pin-count 676-BGA package, so PCB layout should begin with the official AMD package pinout and land-pattern files. Keep power and ground distribution continuous, preserve BGA escape-routing width, and use the package-specific recommended via and solder-mask rules. Do not infer ball assignments from another Spartan-6 package, because package suffixes can change the available I/O and power-ball arrangement.
The verified supply-voltage range is 1.14 V to 1.26 V, but the complete rail requirements and tolerance must be checked in the official AMD documentation. Separate core, I/O, auxiliary, and configuration supplies as directed, place local decoupling close to the relevant device balls, and verify sequencing requirements before power-up. Do not use the catalog voltage alone as the power-supply design specification.
For high-speed interfaces, route clocks and data through the FPGA only after confirming the supported I/O standard, voltage, slew behavior, and timing constraints for the selected package. Maintain continuous reference planes, minimize stubs and unnecessary layer transitions, and use the official Spartan-6 pin and I/O guidance. The listed 500 MHz internal-frequency value does not by itself guarantee a 500 MHz user interface.
A common design error is treating XC6SLX45-3FG676I as interchangeable with XC6SLX45-3FGG676I or an -2/N3 ordering variant solely because the family and package descriptions look similar. Confirm exact speed grade, temperature code, package ballout, configuration requirements, and lifecycle status in AMD documentation. Another common error is using the listed 358 I/O without checking whether a particular pin is available for the required I/O standard or power function.
合规信息
The retrieved catalog data identifies the package as lead-free, but no direct RoHS, REACH, halogen-free, or conflict-minerals declaration was provided. The part is reported as industrial in one retrieved result; automotive qualification is not established.
