XC6SLX45-3FG676I vs XC6SLX45-2FG676I 对比

详细并排对比 XC6SLX45-3FG676I 出自 AMD 和 XC6SLX45-2FG676I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 XC6SLX45-3FG676I XC6SLX45-2FG676I
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Unknown 有效
Device Type Field Programmable Gate Array (FPGA) Spartan-6 LX Field Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX —
Logic Cells 43,661 cells 43,661 cells
Configurable Logic Blocks 3,411 CLBs —
Block RAM 2,138,112 RAM bits [DATA_NEEDED: block RAM capacity]
Maximum Internal Frequency 500 MHz —
Number of I/O 358 I/O —
电源电压 1.14 V to 1.26 V —
Process Technology 45 nm CMOS —
封装 676-BGA, 1 mm pitch 676-BGA
Package Type FCBGA-676 BGA
Package Dimensions 27 mm x 27 mm —
Lead-Free Status Lead-free —
工作温度 0°C to 85°C —
Temperature Grade Industrial Industrial
安装类型 Surface mount —
Programmable Logic Type FPGA FPGA
Configuration Memory [DATA_NEEDED: configuration memory type] —
Number of DSP Blocks [DATA_NEEDED: DSP block count] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency by I/O and logic configuration] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
I/O Count — 358 I/O
Technology — 45 nm CMOS
Core Supply Voltage — 1.2 V
Speed Grade — -2
Number of Terminals — 676
Package Shape — Square
Terminal Form — Ball
Manufacturer — AMD / Xilinx
RoHS 状态 — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
工作温度范围 — [DATA_NEEDED: operating temperature range]
最大时钟频率 — [DATA_NEEDED: maximum clock frequency]
DSP Resources — [DATA_NEEDED: DSP resource count]

数据手册与资源

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