XC6SLX75-2FGG676I vs XC6SLX45-2FGG676I 对比

详细并排对比 XC6SLX75-2FGG676I 出自 AMD 和 XC6SLX45-2FGG676I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

AMD
XC6SLX75-2FGG676I XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I ✓ 量产中

规格对比

参数 XC6SLX75-2FGG676I XC6SLX45-2FGG676I
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Type Spartan-6 LX field-programmable gate array (FPGA) —
Logic Cells 74,637 cells 43,661
Configurable Logic Blocks 5,831 CLBs —
Internal Frequency 667 MHz 500 MHz
Input/Output Count 408 I/O —
电源电压 1 V —
Speed Grade -2 -2
Process Technology 45 nm CMOS 45 nm CMOS
Package Type 676-ball FBGA —
Package Dimensions 27 mm × 27 mm —
Ball Pitch 1 mm —
安装类型 Surface mount —
工作温度 -40°C to +100°C —
Lead-Free Status Lead free —
Device Family Spartan-6 LX —
FPGA Configuration [DATA_NEEDED: FPGA configuration interface and supported configuration modes] —
Block RAM [DATA_NEEDED: block RAM capacity] 2,088 Kbit
DSP Resources [DATA_NEEDED: DSP slice count] —
RoHS Compliance [DATA_NEEDED: RoHS compliance status] —
REACH Compliance [DATA_NEEDED: REACH compliance status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Family — Spartan-6 LX
Part Number — XC6SLX45-2FGG676I
Configurable Logic Blocks (CLBs) — 3,411
Total Flip-Flops — 54,576
DSP48A1 Slices — 58
User I/Os — 358
Number of I/O Banks — 4
Core Voltage — 1.2 V
封装 — 676-ball FBGA (FGG676), 27 x 27 mm, 1.0 mm pitch
Operating Temperature (Industrial) — -40 °C to +100 °C
Compliance — RoHS compliant, Lead Free

数据手册与资源

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