10AS066K4F35E3LG - Arria 10 SX 660K LE SoC FPGA | Intel
料号： 10AS066K4F35E3LG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3353.77 | $3,353.77 |
| 10 | $3218.42 | $32,184.20 |
| 50 | $3091.06 | $154,553.00 |
| 100 | $2960.25 | $296,025.00 |
| 500 | $2845.83 | $1,422,915.00 |
10AS066K4F35E3LG 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks, embedded memory, DSP slices, and routing resources that designers program after manufacturing. A SoC FPGA extends the architecture by integrating one or more hard CPU cores, on-chip memory controllers, and peripheral interfaces directly into the silicon, eliminating the need for a separate processor companion chip. SoC FPGAs sit at the intersection of programmable logic and application processors, enabling hardware-accelerated signal processing with deterministic latency alongside general-purpose operating-system execution.
Key features of the 10AS066K4F35E3LG include the 660K logic element fabric, dual ARM Cortex-A9 cores with NEON media engine and CoreSight debug, high-speed transceivers supporting multi-gigabit serial protocols, hardware DSP blocks for fixed- and floating-point math, on-chip SRAM, and a wide range of configurable LVDS/SE I/O with hardened memory controllers for DDR4/3 and LPDDR3. The -E3 speed grade and the F35 1152-ball package combination is a typical configuration for industrial temperature, mid-performance designs.
The architecture combines TSMC 20 nm process technology with hardened ARM Cortex-A9 cores, allowing deterministic interrupt latency and parallel hardware acceleration for compute-intensive tasks. The SoC HPS subsystem includes ECC-protected L1 cache, dedicated SDRAM controller, and rich peripheral set (USB, Ethernet, SD/MMC, SPI, UART, I2C), reducing system bill-of-materials.
Typical applications include Software Defined Radio (SDR) baseband processing, industrial machine vision, military and aerospace electronic systems, high-performance test and measurement, and embedded computing platforms requiring hardware-software co-design. Designers choose this device when software flexibility and FPGA acceleration must coexist on one chip.
When designing with this device, ensure PCB stack-up supports multi-gigabit transceivers with controlled-impedance differential routing, and provide robust power-rail decoupling for the HPS and FPGA core domains. Quartus Prime and the Platform Designer tool flow handle SoC bring-up, bootloader configuration, and HPS-to-FPGA bridge instantiation.
This page synthesizes distributor pricing, package variant alternatives, and practical design notes drawn from the official datasheet and Intel/Altera ordering part-number guide - information not consolidated on any single vendor site.
直接替换替代料： 10AS066K4F35E3LG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AS066K4F35E3LG （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature Grade, Mounting Type, RoHS Status, Package Code.
快速对比工具——选择替代料号进行并排对比：
10AS066K4F35E3SG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2150 / 个
查看数据手册 →10AS066K3F35E3LG
✅ 直接替换📋 参考替代料（不在目录中）
10AS066K3F35E2LG
✅ 直接替换✓ 有现货
$2310 / 个
查看数据手册 →10AS066K2F35E2LG
✅ 直接替换✓ 有现货
$3360 / 个
查看数据手册 →10AS066K4F35E2LG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10AS066K4F35E3LG 最大额定值与电气特性
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | 1.5 GHz |
| 封装 | 1152-BBGA FCBGA (F35), 35x35 mm |
| Speed Grade | -E3 |
| Number of I/O | 396 (per vendor description) |
| Operating Temperature Grade | Industrial (per -E3 ordering suffix) |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant (per product compliance page) |
| Device Family | 10AS066 (Arria 10 SX) |
| Logic Element Series | K4 |
| Package Code | F35 |
| Lead-Free | Yes |
| Process Node | 20 nm (per Arria 10 family documentation) |
10AS066K4F35E3LG f35 引脚配置指南
10AS066K4F35E3LG（f35 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AS066K4F35E3LG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AS066K4F35E3LG 适用于 6 应用s: Software Defined Radio (SDR) Baseband, Industrial Machine Vision Systems, Military and Aerospace Electronic Systems, High-Performance Test and Measurement, Embedded Computing Platform / Edge Compute, High-Speed Serial Protocol Bridge.
Software Defined Radio (SDR) Baseband
The 10AS066K4F35E3LG is well-suited to SDR baseband processing because its 660K logic elements provide ample fabric for channelization, FFT, and modulation/demodulation pipelines, while the dual ARM Cortex-A9 MPCore subsystem runs the protocol stack and MAC layer. According to the Arria 10 SX product documentation, the device's hardened DSP blocks deliver fixed- and floating-point math for high-throughput sample processing at RF rates. Designers typically pair the FPGA fabric with multi-gigabit transceivers for ADC/DAC connectivity, achieving deterministic latency in the FPGA while maintaining software flexibility in the HPS.
推荐
Industrial Machine Vision Systems
The 10AS066K4F35E3LG enables high-resolution machine vision with hardware-accelerated image processing, where the FPGA fabric handles pixel-rate operations such as filtering, edge detection, and feature extraction while the ARM Cortex-A9 runs classification algorithms and network communication. The 1.5 GHz HPS supports real-time Linux or RTOS for control loops. Industrial grade temperature rating and DDR4 memory controller support make it suitable for factory-floor deployments with multi-camera input via LVDS or sub-LVDS MIPI interfaces.
推荐
Military and Aerospace Electronic Systems
The 10AS066K4F35E3LG delivers the radiation-aware architecture and SoC integration needed for military and aerospace applications such as electronic warfare, radar signal processing, and secure communications. The hardened ARM Cortex-A9 subsystem handles command and control software with deterministic interrupt latency, while the FPGA fabric accelerates signal processing at radio frequencies. The F35 1152-ball FCBGA package provides robust thermal performance for ruggedized enclosures and the industrial temperature grade (-E3) covers extended military operating profiles.
推荐
High-Performance Test and Measurement
The 10AS066K4F35E3LG supports test and measurement instruments where fast real-time acquisition and analysis are required, including oscilloscopes, spectrum analyzers, and protocol analyzers. The FPGA fabric captures and processes high-speed ADC samples at line rates, while the dual ARM cores run instrument firmware, display updates, and remote interfaces (USB, Ethernet). The 396 I/O provide ample channels for mixed-signal interfacing, and hardened memory controllers support deep capture buffers for transient analysis.
推荐
Embedded Computing Platform / Edge Compute
The 10AS066K4F35E3LG serves as an embedded computing platform when a design requires both a Linux-capable application processor and FPGA acceleration in a single chip. Common deployments include edge AI inferencing with hardware-accelerated pre-processing, video transcoding, and industrial IoT gateways. The HPS subsystem provides standard peripherals (USB, Ethernet, SD/MMC, SPI, I2C) reducing external component count, while the FPGA fabric handles deterministic data plane operations. This SoC integration reduces PCB complexity and BOM cost versus discrete CPU+FPGA designs.
推荐
High-Speed Serial Protocol Bridge
The 10AS066K4F35E3LG's high-speed transceivers support protocols such as PCIe Gen2/3, 10 Gigabit Ethernet, Serial RapidIO, JESD204B/C, and CPRI, making it suitable for protocol bridging in telecom infrastructure, base stations, and data-center equipment. The FPGA fabric performs protocol translation and packet processing at wire speed, while the ARM Cortex-A9 cores manage control plane and higher-layer protocols. Combined with hardened memory controllers and PCIe hard IP, the device provides a low-latency bridging solution for multi-protocol systems.
推荐
推荐产品汇总
工程参考数据： 10AS066K4F35E3LG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AS066K4F35E3SG | 10AS066K3F35E3LG | 10AS066K3F35E2LG | 10AS066K2F35E2LG | 10AS066K4F35E2LG |
|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (F35), 35x35 mm | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 660,000 | 660,000 | 660,000 (different series K3) | 660,000 (different series K3) | 660,000 (different series K2) | 660,000 |
| Speed Grade | -E3 | -E3 | -E3 | -E2 (faster) | -E2 (faster) | -E2 (faster) |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz |
| Number of I/O | 396 | 396 | 396 | 396 | 396 | 396 |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Family Position | 10AS066 - mid-high density Arria 10 SX | Same 10AS066 family | Same 10AS066 family | Same 10AS066 family | Same 10AS066 family | Same 10AS066 family |
关键差异点
- Identical density at faster speed grade （对比 10AS066K4F35E2LG)
- Same package with different logic element series （对比 10AS066K3F35E3LG)
- SoC FPGA integration advantage （对比 Discrete CPU + FPGA approach)
设计说明
The 1152-ball F35 FCBGA package requires a high-density PCB stack-up with microvia technology for inner row escape routing. Use at least 8-layer stack-up with HDI (High Density Interconnect) processes for production-grade reliability. Decoupling capacitors must be placed directly under the BGA footprint using 0201 or 0402 sizes for high-frequency FPGA core and HPS power rail decoupling. Reference the Intel Arria 10 device pin connection guidelines for ball map and recommended escape routing topology.
Arria 10 SX devices require multiple sequenced power rails including VCC, VCCPT, VCCPGM, VCCR, VCCT, and HPS-specific rails (VCC_HPS, VCC_HPS_PLL). Power-on-reset sequencing must follow Intel's Power Management Design Guide. Decoupling on each rail should include a combination of bulk capacitors, mid-frequency ceramics, and high-frequency ceramics placed within 100 mils of the corresponding balls. Power estimation in Quartus Prime early in design flow helps size rails accurately.
The 1152-ball F35 FCBGA provides the thermal dissipation path for this high-power SoC FPGA. Designs targeting full fabric utilization with high toggle rates may dissipate 10-20W or more, requiring thermal vias under the BGA and a thermal management strategy. Reference the Arria 10 thermal management literature for junction-to-ambient thermal resistance values and recommended airflow requirements. At industrial temperature extremes (-40C to +100C Tj), ensure worst-case power scenarios are accounted for in thermal design.
Multi-gigabit transceiver channels require controlled-impedance differential routing (typically 100 ohm differential) with length matching to within design-specific tolerances. Routes should avoid crossing reference plane splits, and the transceiver power rails must be heavily decoupled with ferrite beads isolating them from digital noise. For DDR4/3 interfaces, follow JEDEC-compliant trace length matching, fly-by topology for clock, and proper write leveling calibration during bring-up.
Common pitfalls when designing with the 10AS066K4F35E3LG include: failing to assign all transceiver power pins even for unused channels (Intel recommends connecting unused transceiver pins to specific supply levels), insufficient decoupling on HPS rails causing SoC boot failures, ignoring Configuration via Protocol (CvP) requirements when using PCIe for FPGA configuration, and missing the early pin-out planning step before PCB layout commit. Always validate the Quartus Prime pin assignments against the F35 ball map before final layout.
合规信息
RoHS compliance confirmed per the Altera/Intel ordering part-number product compliance page. REACH and conflict minerals compliance status not explicitly disclosed in the verified web data and marked as unknown. AEC-Q100 not applicable for FPGAs not specifically marketed as automotive-grade.
