10AS066K4F35E3LG - Arria 10 SX 660K LE SoC FPGA | Intel
MPN: 10AS066K4F35E3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3353.77 | $3,353.77 |
| 10 | $3218.42 | $32,184.20 |
| 50 | $3091.06 | $154,553.00 |
| 100 | $2960.25 | $296,025.00 |
| 500 | $2845.83 | $1,422,915.00 |
Drop-in alternatives for 10AS066K4F35E3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS066K4F35E3SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2150 / Unit
View Datasheet →10AS066K3F35E3LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS066K3F35E2LG
✅ Drop-In✓ In Stock
$2310 / Unit
View Datasheet →10AS066K2F35E2LG
✅ Drop-In✓ In Stock
$3360 / Unit
View Datasheet →10AS066K4F35E2LG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS066K4F35E3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | 1.5 GHz |
| Package | 1152-BBGA FCBGA (F35), 35x35 mm |
| Speed Grade | -E3 |
| Number of I/O | 396 (per vendor description) |
| Operating Temperature Grade | Industrial (per -E3 ordering suffix) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (per product compliance page) |
| Device Family | 10AS066 (Arria 10 SX) |
| Logic Element Series | K4 |
| Package Code | F35 |
| Lead-Free | Yes |
| Process Node | 20 nm (per Arria 10 family documentation) |
10AS066K4F35E3LG f35 Pin Configuration Guide
Complete pinout information for 10AS066K4F35E3LG (f35 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066K4F35E3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066K4F35E3LG is suitable for 6 applications: Software Defined Radio (SDR) Baseband, Industrial Machine Vision Systems, Military and Aerospace Electronic Systems, High-Performance Test and Measurement, Embedded Computing Platform / Edge Compute, High-Speed Serial Protocol Bridge.
Software Defined Radio (SDR) Baseband
The 10AS066K4F35E3LG is well-suited to SDR baseband processing because its 660K logic elements provide ample fabric for channelization, FFT, and modulation/demodulation pipelines, while the dual ARM Cortex-A9 MPCore subsystem runs the protocol stack and MAC layer. According to the Arria 10 SX product documentation, the device's hardened DSP blocks deliver fixed- and floating-point math for high-throughput sample processing at RF rates. Designers typically pair the FPGA fabric with multi-gigabit transceivers for ADC/DAC connectivity, achieving deterministic latency in the FPGA while maintaining software flexibility in the HPS.
Recommended
Industrial Machine Vision Systems
The 10AS066K4F35E3LG enables high-resolution machine vision with hardware-accelerated image processing, where the FPGA fabric handles pixel-rate operations such as filtering, edge detection, and feature extraction while the ARM Cortex-A9 runs classification algorithms and network communication. The 1.5 GHz HPS supports real-time Linux or RTOS for control loops. Industrial grade temperature rating and DDR4 memory controller support make it suitable for factory-floor deployments with multi-camera input via LVDS or sub-LVDS MIPI interfaces.
Recommended
Military and Aerospace Electronic Systems
The 10AS066K4F35E3LG delivers the radiation-aware architecture and SoC integration needed for military and aerospace applications such as electronic warfare, radar signal processing, and secure communications. The hardened ARM Cortex-A9 subsystem handles command and control software with deterministic interrupt latency, while the FPGA fabric accelerates signal processing at radio frequencies. The F35 1152-ball FCBGA package provides robust thermal performance for ruggedized enclosures and the industrial temperature grade (-E3) covers extended military operating profiles.
Recommended
High-Performance Test and Measurement
The 10AS066K4F35E3LG supports test and measurement instruments where fast real-time acquisition and analysis are required, including oscilloscopes, spectrum analyzers, and protocol analyzers. The FPGA fabric captures and processes high-speed ADC samples at line rates, while the dual ARM cores run instrument firmware, display updates, and remote interfaces (USB, Ethernet). The 396 I/O provide ample channels for mixed-signal interfacing, and hardened memory controllers support deep capture buffers for transient analysis.
Recommended
Embedded Computing Platform / Edge Compute
The 10AS066K4F35E3LG serves as an embedded computing platform when a design requires both a Linux-capable application processor and FPGA acceleration in a single chip. Common deployments include edge AI inferencing with hardware-accelerated pre-processing, video transcoding, and industrial IoT gateways. The HPS subsystem provides standard peripherals (USB, Ethernet, SD/MMC, SPI, I2C) reducing external component count, while the FPGA fabric handles deterministic data plane operations. This SoC integration reduces PCB complexity and BOM cost versus discrete CPU+FPGA designs.
Recommended
High-Speed Serial Protocol Bridge
The 10AS066K4F35E3LG's high-speed transceivers support protocols such as PCIe Gen2/3, 10 Gigabit Ethernet, Serial RapidIO, JESD204B/C, and CPRI, making it suitable for protocol bridging in telecom infrastructure, base stations, and data-center equipment. The FPGA fabric performs protocol translation and packet processing at wire speed, while the ARM Cortex-A9 cores manage control plane and higher-layer protocols. Combined with hardened memory controllers and PCIe hard IP, the device provides a low-latency bridging solution for multi-protocol systems.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066K4F35E3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066K4F35E3SG | 10AS066K3F35E3LG | 10AS066K3F35E2LG | 10AS066K2F35E2LG | 10AS066K4F35E2LG |
|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (F35), 35x35 mm | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 660,000 | 660,000 | 660,000 (different series K3) | 660,000 (different series K3) | 660,000 (different series K2) | 660,000 |
| Speed Grade | -E3 | -E3 | -E3 | -E2 (faster) | -E2 (faster) | -E2 (faster) |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz |
| DSP Block Count | [DATA_NEEDED: DSP blocks] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Number of I/O | 396 | 396 | 396 | 396 | 396 | 396 |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Family Position | 10AS066 - mid-high density Arria 10 SX | Same 10AS066 family | Same 10AS066 family | Same 10AS066 family | Same 10AS066 family | Same 10AS066 family |
Key Differentiators
- Identical density at faster speed grade (vs 10AS066K4F35E2LG)
- Same package with different logic element series (vs 10AS066K3F35E3LG)
- SoC FPGA integration advantage (vs Discrete CPU + FPGA approach)
Design Notes
The 1152-ball F35 FCBGA package requires a high-density PCB stack-up with microvia technology for inner row escape routing. Use at least 8-layer stack-up with HDI (High Density Interconnect) processes for production-grade reliability. Decoupling capacitors must be placed directly under the BGA footprint using 0201 or 0402 sizes for high-frequency FPGA core and HPS power rail decoupling. Reference the Intel Arria 10 device pin connection guidelines for ball map and recommended escape routing topology.
Arria 10 SX devices require multiple sequenced power rails including VCC, VCCPT, VCCPGM, VCCR, VCCT, and HPS-specific rails (VCC_HPS, VCC_HPS_PLL). Power-on-reset sequencing must follow Intel's Power Management Design Guide. Decoupling on each rail should include a combination of bulk capacitors, mid-frequency ceramics, and high-frequency ceramics placed within 100 mils of the corresponding balls. Power estimation in Quartus Prime early in design flow helps size rails accurately.
The 1152-ball F35 FCBGA provides the thermal dissipation path for this high-power SoC FPGA. Designs targeting full fabric utilization with high toggle rates may dissipate 10-20W or more, requiring thermal vias under the BGA and a thermal management strategy. Reference the Arria 10 thermal management literature for junction-to-ambient thermal resistance values and recommended airflow requirements. At industrial temperature extremes (-40C to +100C Tj), ensure worst-case power scenarios are accounted for in thermal design.
Multi-gigabit transceiver channels require controlled-impedance differential routing (typically 100 ohm differential) with length matching to within design-specific tolerances. Routes should avoid crossing reference plane splits, and the transceiver power rails must be heavily decoupled with ferrite beads isolating them from digital noise. For DDR4/3 interfaces, follow JEDEC-compliant trace length matching, fly-by topology for clock, and proper write leveling calibration during bring-up.
Common pitfalls when designing with the 10AS066K4F35E3LG include: failing to assign all transceiver power pins even for unused channels (Intel recommends connecting unused transceiver pins to specific supply levels), insufficient decoupling on HPS rails causing SoC boot failures, ignoring Configuration via Protocol (CvP) requirements when using PCIe for FPGA configuration, and missing the early pin-out planning step before PCB layout commit. Always validate the Quartus Prime pin assignments against the F35 ball map before final layout.
Compliance Information
RoHS compliance confirmed per the Altera/Intel ordering part-number product compliance page. REACH and conflict minerals compliance status not explicitly disclosed in the verified web data and marked as unknown. AEC-Q100 not applicable for FPGAs not specifically marketed as automotive-grade.
