10M08DCF484I7G - MAX 10 FPGA, 8K LE, 250 I/O, 484-FBGA | Intel
料号： 10M08DCF484I7G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $42.25 | $42.25 |
| 10 | $38.95 | $389.50 |
| 100 | $35.4 | $3,540.00 |
| 500 | $31.85 | $15,925.00 |
| 1,000 | $28.2 | $28,200.00 |
10M08DCF484I7G 概述
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that engineers can re-program to implement arbitrary digital circuits, glue logic, state machines, or full processor subsystems. FPGAs sit above microcontrollers in flexibility but below ASICs in per-unit cost, making them ideal for low-to-mid-volume designs, hardware prototyping, hardware-accelerated signal processing, and industrial I/O expansion. The MAX 10 family specifically targets applications that previously required a discrete MCU plus a CPLD plus an ADC.
Key features of the 10M08DCF484I7G include 8 K logic elements, 378 Kbits of user flash memory, an integrated 12-bit ADC, on-chip temperature sensor, and dual-configuration flash that supports remote field updates. The device supports LVDS, LVCMOS, SSTL, and other I/O standards, and provides up to 250 general-purpose I/O pins. Configuration is instantaneous because the configuration bitstream is stored in on-die flash rather than an external serial PROM. Hard IP blocks include PLLs, embedded memory blocks (M9K), and multiplier blocks (18x18). Power supplies require a 1.2V core rail plus 2.5V/3.3V auxiliary rails.
Typical applications include industrial machine vision and motor control, factory automation I/O expansion, video bridging and display controllers, low-cost software-defined radio (SDR) front ends, test and measurement instruments, and bridge/replacement of legacy discrete logic. The integrated ADC is often used for monitoring power rails or sensor inputs directly inside the FPGA, eliminating a separate analog front-end IC.
When designing with the 10M08DCF484I7G, pay attention to the FBGA484 ball-pitch (1.0 mm) PCB escape routing: at least 4 routing layers with microvias are recommended for fan-out. Use Intel Quartus Prime Lite or Standard Edition for design entry; the 484-FBGA package has a substantial 23x23 mm footprint that requires careful power-plane segmentation between 1.2V core and 3.3V I/O domains.
This page synthesizes distributor pricing, drop-in alternatives within the MAX 10 and Cyclone 10 families, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： 10M08DCF484I7G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M08DCF484I7G （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Process Technology, Embedded Memory, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
10M08DCF484C8G
✅ 直接替换✓ 有现货
$19.8 / 个
查看数据手册 →10M08DAF484I7G
✅ 直接替换✓ 有现货
$25.8 / 个
查看数据手册 →10M08DAF484I7P
✅ 直接替换✓ 有现货
$22.1 / 个
查看数据手册 →10M08DAF484C8G
✅ 直接替换✓ 有现货
$27.65 / 个
查看数据手册 →10M04DAF484I7G
✅ 直接替换📋 参考替代料（不在目录中）
10M08DCF484I7G 最大额定值与电气特性
| Device Family | MAX 10 |
| Logic Elements | 8,000 |
| Embedded Memory (Bits) | 387,072 |
| User Flash (Bits) | 378,880 |
| Maximum User I/O | 250 |
| 封装 | 484-FBGA |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| On-chip ADC | 12-bit, 1 MSPS |
| Configuration Method | On-die flash (instant-on) |
| PLLs | 4 |
| 18x18 Multipliers | 24 |
| Core Voltage | 1.2 V |
| I/O Voltage Support | 1.2 V to 3.3 V (LVCMOS/LVDS/SSTL) |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
10M08DCF484I7G 484-fbga 引脚配置指南
10M08DCF484I7G（484-fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10M08DCF484I7G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10M08DCF484I7G 适用于 6 应用s: Industrial Machine Vision and Imaging, Factory Automation and Motor Control I/O Expansion, Display Bridging and Video Format Conversion, Test and Measurement Instrumentation, Low-Cost Software-Defined Radio Front End, Legacy Glue Logic and Bridge Replacement.
Industrial Machine Vision and Imaging
The 10M08DCF484I7G is well suited to industrial machine vision pipelines because its 250 user I/Os can simultaneously capture a parallel RGB camera interface, drive an LVDS display, and aggregate sensor buses (I2C, SPI, GPIO), while the 8,000 logic elements implement Bayer demosaicing, gamma correction, and region-of-interest extraction. The integrated 12-bit ADC at 1 MSPS allows direct monitoring of illumination LEDs and supply rails without an external ADC IC. Compared with a discrete MCU-plus-CPLD-plus-ADC implementation, the MAX 10 consolidates three chips into one, reducing BOM cost by roughly 30 percent and freeing board area for a smaller 484-FBGA footprint. Quartus Prime IP libraries provide ready-made Image Processing and Video Sync Generator blocks that shorten development cycles for typical camera-link replacement designs.
推荐
Factory Automation and Motor Control I/O Expansion
The 10M08DCF484I7G excels as an I/O aggregator for factory-automation backplanes because the 250 LVCMOS/LVDS-capable pins can sink hundreds of optocoupler-isolated 24V digital inputs while the on-die 12-bit ADC samples analog current and voltage feedback for multi-axis motor control. Hard IP including 4 PLLs and 24 18x18 multipliers supports encoder decoding, PWM generation, and field-oriented-control math without soft logic penalties. Instant-on flash configuration is critical in safety-related machinery where the FPGA must be ready before the MCU queries it. Industrial-grade -40C to +100C operation and the 484-FBGA package with high I/O density make the 10M08 a common choice for multi-axis stepper and BLDC controller boards.
推荐
Display Bridging and Video Format Conversion
In display-bridging applications the 10M08DCF484I7G converts between parallel RGB, LVDS, and MIPI-style video interfaces using its abundant 250 I/Os and dedicated LVDS serializer/deserializer hardware. The 387 Kbit of M9K embedded memory supports line-buffer and frame-rate-conversion FIFOs, while the dual-configuration flash allows secure boot plus golden-image recovery, important for field-upgradable signage. The integrated ADC and temperature sensor enable on-screen diagnostics for industrial HMI panels. Designers can leverage Altera/Intel Video IP cores in Quartus Prime to implement color-space conversion (RGB to YCbCr, etc.) with deterministic latency. The industrial temperature grade supports outdoor kiosk deployments without additional thermal hardening.
推荐
Test and Measurement Instrumentation
The 10M08DCF484I7G is a frequent choice for test-and-measurement front ends because the integrated 12-bit ADC at 1 MSPS digitizes multi-channel analog sensor inputs (temperature, pressure, current) directly, while the 250 user I/Os drive relays, multiplexers, and front-panel keypads. The on-chip 378 Kbit user flash stores calibration coefficients and instrument firmware, eliminating an EEPROM from the BOM. Hardware multipliers accelerate DSP blocks such as FIR filtering and FFT computation common in stimulus-response measurement equipment. Instant-on configuration also shortens instrument boot time, improving production-line throughput. Industrial-grade operation supports laboratory and factory-floor deployment in a single SKU.
推荐
Low-Cost Software-Defined Radio Front End
For entry-level SDR designs, the 10M08DCF484I7G implements digital down-conversion, channel filtering, and I/Q buffering using its 24 hardware 18x18 multipliers and 4 PLLs while the 250 I/Os interface directly to ADC/DAC LVDS data buses. The instant-on flash boot allows fast band-switching without external PROMs. Industrial-grade parts are valuable for portable SDR gear exposed to outdoor temperature swings. The 484-FBGA package's I/O density is sufficient for 14-bit dual-channel ADC interfaces plus auxiliary control signals. Hobby and commercial SDR products based on MAX 10 leverage its deterministic low-latency fabric for protocol decoding.
推荐
Legacy Glue Logic and Bridge Replacement
The 10M08DCF484I7G is widely used to replace obsolete discrete logic, PAL/GAL devices, and legacy CPLDs in long-life industrial products because the on-die flash configuration eliminates an external boot PROM and the 8,000 LEs comfortably absorb large state machines plus bus-arbitration glue. Dual-configuration flash enables fail-safe firmware updates in the field, critical for installed equipment that cannot easily be returned for service. Industrial temperature grade and the 23x23 mm 484-FBGA footprint make it a drop-in modernization path for legacy boards originally designed around 5V CPLDs. Quartus Prime legacy pin-assignment import eases migration from older MAX devices.
推荐
推荐产品汇总
工程参考数据： 10M08DCF484I7G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M08DCF484C8G | 10M08DAF484I7G | 10M08DAF484I7P | 10M08DAF484C8G | 10M04DAF484I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) |
| Embedded Memory (Bits) | 387,072 | 387,072 | 387,072 | 387,072 | 387,072 | 189,696 (-50%) |
| Maximum User I/O | 250 | 250 | 250 | 250 | 250 | 178 (-29%) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Configuration Flash | Dual-configuration | Dual-configuration | Analog content | Analog content | Analog content | Analog content |
| Approx. Unit Price (USD, qty 100) | 35.40 | 29.50 (-17%) | 36.10 (+2%) | 36.10 (+2%) | 30.20 (-15%) | 30.80 (-13%) |
关键差异点
- Integrated 12-bit ADC eliminates external ADC IC （对比 10CL080YF484I7G (Cyclone 10 LP))
- On-die flash configuration enables instant-on (<10 ms boot) （对比 10CL080YF484I7G (Cyclone 10 LP))
- Dual-configuration flash allows field firmware updates with rollback （对比 10M08DAF484I7G (analog variant))
- Industrial temperature grade supports -40C to +100C （对比 10M08DCF484C8G (commercial variant))
设计说明
The 484-FBGA package uses a 1.0 mm ball pitch and a 23x23 mm body, which requires at least a 4-layer PCB with laser-drilled microvias for fan-out routing. According to the Intel MAX 10 Pin Connection Guidelines, signals routed on the top layer must reach the perimeter through via-in-pad or dog-bone fan-out; route high-speed LVDS pairs with matched length within 50 mil tolerance. Decoupling: place 0.1 uF X7R ceramics on every VCC pin within 200 mil and add four 10 uF bulk capacitors around the package perimeter.
The 10M08DCF484I7G requires a 1.2V core rail plus a 2.5V or 3.3V analog/auxiliary rail, both of which must come up monotonically within the Intel power-sequencing specification (VCCAINT before VCCIO). Estimated: at 100 percent toggle on 250 LVCMOS outputs at 100 MHz, the device draws up to approximately 350 mA from the 1.2V core, so the regulator must supply at least 500 mA with 20 percent margin. Use a 3.3V LDO such as a TI TPS7A4531 or equivalent for low-noise analog rail support of the integrated ADC.
Route the LVDS pairs on an inner stripline layer adjacent to a continuous ground plane to control impedance (100 ohm differential). The 484-FBGA escape pattern must reserve microvia antipads under BGA balls; do not run signals through the keep-out zone, as this degrades solder-joint reliability. Keep analog ADC traces (ANAIN pins) short and guarded with ground pours to minimize digital coupling noise into the 12-bit ADC.
Do not assume the 10M08DCF484I7G is pin-compatible with non-MAX 10 FPGAs in similar 484-BGA packages - pin 1 orientation, ball matrix, and function are specific to MAX 10. Also, the 'I7' temperature grade only guarantees -40C to +100C junction; the junction-to-ambient thermal resistance of the 484-FBGA is approximately 20 C/W without airflow, meaning a 2 W internal dissipation will raise Tj by 40C above ambient, requiring airflow or thermal vias for high-utilization designs.
合规信息
RoHS compliant per Intel MAX 10 product page. Industrial temperature grade (I7) is not AEC-Q100 qualified; the device is targeted at industrial automation, not automotive.