Intel

10M40DCF484I7G - MAX 10 FPGA, 40K LE, 484-FBGA | Intel

料号: 10M40DCF484I7G ✓ 量产中
有现货 1-3 个工作日内发货
1.2 V Vdss 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch) Package 472.5 MHz Speed 1,290,240 bits (Kb) Memory
低至 $71.48 USD / 件
最小起订量: 1 |
价格更新于: 2026-09-05
批量定价
数量 单价 小计
1 $129.97 $129.97
10 $116.97 $1,169.70
100 $97.48 $9,748.00
500 $81.23 $40,615.00
1,000 $71.48 $71,480.00
ℹ️ 所有价格均以 USD 计价

10M40DCF484I7G 概述

The Intel 10M40DCF484I7G is a MAX 10 Field Programmable Gate Array (FPGA) from the non-volatile MAX 10 family, integrating 40,000 logic elements into a 484-ball FineLine BGA package with 360 user I/O pins. Built on a 55 nm CMOS process, it delivers up to 472.5 MHz internal operation and includes an on-chip flash configuration memory that eliminates the need for an external boot PROM.

A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that designers can configure after manufacturing to implement arbitrary digital circuits. FPGAs sit within the semiconductor hierarchy between ASICs (which are fixed-function) and microcontrollers (which run software), making them ideal for parallel processing, custom interface bridging, hardware acceleration, and rapid prototyping.

Key features of the 10M40DCF484I7G include 1,290,240 bits of embedded SRAM (Kb memory), 4 PLLs, 2 I/O banks with LVDS support, an integrated ADC block, and a 1.2 V core supply. The 'DC' package code indicates a commercial-grade temperature range, while the 'I7' speed grade and 'G' lead-free finish complete the part designation per Altera/Intel ordering nomenclature.

The MAX 10 architecture combines LUT-based logic fabric with hardened peripherals including DDR3 memory controllers, soft processors (Nios V), and on-die configuration flash, enabling single-chip system designs. Unlike SRAM-based Cyclone or Stratix devices, MAX 10 is instant-on at power-up with no external boot device required, simplifying PCB layout and reducing BOM cost.

Typical applications include industrial motor control, factory automation I/O expansion, video processing pipelines, low-cost custom protocol bridging, and prototype ASIC emulation. The 484-ball FBGA package with 1.0 mm pitch is well-suited for moderate-density designs where high I/O count is required but full FPGA BGA assembly is acceptable.

When designing with this device, ensure the Quartus Prime software version supports the 10M40DCF484I7G device variant. Verify the IBIS model and pinout file against your PCB layout, and follow Intel's MAX 10 hardware design guidelines for power rail sequencing, decoupling, and JTAG chain implementation.

This page synthesizes distributor pricing, same-family MAX 10 drop-in alternatives, and practical Quartus Prime design notes not found in a single manufacturer datasheet.

直接替换替代料: 10M40DCF484I7G ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: 10M40DCF484I7G (相同外形与封装尺寸) ——差异在于 Package, Process Technology, Configuration Memory, On-chip ADC, PLLs.

Intel
Package: 484-FBGA
On-chip ADC: 12-bit, 1 MSPS
对比 10M40DCF484I7G →
Intel
Process Technology: 55 nm
对比 10M40DCF484I7G →
Intel
Package: 484-ball FineLine BGA (F484)
Process Technology: 55 nm TSMC
Configuration Memory: 5 Mb on-chip flash
对比 10M40DCF484I7G →
Intel
Package: 484-BGA (FineLine BGA)
Configuration Memory: Internal flash, dual-image capable
On-chip ADC: 12-bit, integrated
对比 10M40DCF484I7G →
Intel
Package: 484-FBGA (F484)
Process Technology: Non-volatile (flash-based) CMOS
On-chip ADC: 12-bit SAR (channel count package-dependent)
对比 10M40DCF484I7G →
Intel
Package: 484-FBGA (F484)
Process Technology: 55 nm embedded flash
Configuration Memory: Internal non-volatile flash
对比 10M40DCF484I7G →
Intel
Package: 484-ball FineLine BGA (F484)
PLLs: 8 (general-purpose, fractional on selected devices)
对比 10M40DCF484I7G →
Intel
Package: 484-ball FineLine BGA (F484)
Configuration Memory: On-chip non-volatile (dual image)
On-chip ADC: 12-bit, 1 Msps SAR, up to 18 channels
对比 10M40DCF484I7G →
Intel
Package: 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch
Process Technology: TSMC 55 nm embedded flash
对比 10M40DCF484I7G →

快速对比工具——选择替代料号进行并排对比:

10M40DCF484C8G

✅ 直接替换
Intel
📦 484-FBGA
MAX 10 · 10M40 · 40000 · 1290240 · 360 · 484-FBGA (F484) · F484 · Surface Mount (BGA)

✓ 有现货

$53.9 / 个

查看数据手册 →

10M40DCF484C7G

✅ 直接替换
Intel
📦 484-FBGA
MAX 10 · 40,000 · 1,290,240 bits (160 Kib) · 360 · 484-FBGA (F484) · 23 x 23 mm · 1.0 mm · Non-volatile (flash-based) CMOS

✓ 有现货

$124.2 / 个

查看数据手册 →

10M25DCF484I7G

✅ 直接替换
Intel
📦 484-FBGA
MAX 10 · 25,000 · 1,728 Kbits (M9K blocks) · 360 · 484-ball FineLine BGA (F484) · 1.0 mm · 1.2 V core · 5 Mb on-chip flash

✓ 有现货

$45.1 / 个

查看数据手册 →

10M16DCF484I7G

✅ 直接替换
Intel
📦 484-FBGA
MAX 10 · Non-volatile FPGA · 16000 · 562176 · 320 · 1.2 V

✓ 有现货

$43.95 / 个

查看数据手册 →

10M40DAF484C7G

✅ 直接替换
Intel
📦 484-FBGA
MAX 10 · 40,000 · 1,290,240 · 360 · 4 · 484-BGA (FineLine BGA) · Internal flash, dual-image capable · 12-bit, integrated

✓ 有现货

$92.4 / 个

查看数据手册 →

10M08DCF484I7G

✅ 直接替换
Intel
📦 484-FBGA
MAX 10 · 8,000 · 387,072 · 378,880 · 250 · 484-FBGA · Industrial (-40C to +100C) · 12-bit, 1 MSPS

✓ 有现货

$28.2 / 个

查看数据手册 →

10M40DCF484I7G 最大额定值与电气特性

Family MAX 10
Logic Elements 40,000
Embedded Memory 1,290,240 bits (Kb)
User I/O Count 360
封装 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch)
Process Technology 55 nm CMOS
Core Voltage 1.2 V
Maximum Internal Frequency 472.5 MHz
PLLs 4
I/O Banks 2 (with LVDS support)
Configuration Memory On-chip flash (instant-on, no external boot PROM)
Temperature Grade Commercial (DC suffix)
Speed Grade I7
Lead-Free Finish Yes (G suffix)
RoHS 状态 Compliant

10M40DCF484I7G 484-fbga (fineline bga, 23 x 23 mm, 1.0 mm pitch) 引脚配置指南

10M40DCF484I7G(484-fbga (fineline bga, 23 x 23 mm, 1.0 mm pitch) 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

10M40DCF484I7G 的 484-fbga (fineline bga, 23 x 23 mm, 1.0 mm pitch) 封装引脚图

暂无详细引脚数据: 10M40DCF484I7G.

请参阅 数据手册 以查看完整引脚配置。

典型应用

10M40DCF484I7G 适用于 6 应用s: Industrial Motor Control, Factory Automation I/O Expansion, Video Processing and Bridging, Custom Protocol Bridging and Interface Conversion, ASIC Prototyping and Hardware Emulation, LED Lighting and Display Control.

🏭

Industrial Motor Control

The Intel MAX 10 10M40DCF484I7G is well-suited for industrial motor control designs requiring deterministic PWM generation and feedback loop processing. The 40,000 logic elements handle multi-axis FOC algorithms, while the 4 PLLs generate precise clock trees for encoder interfaces and PWM synchronization. Its 360 user I/O pins connect directly to gate drivers, Hall sensors, and resolver decoders without external muxing. The integrated 12-bit ADC block samples motor currents and bus voltages synchronously with the PWM carrier, reducing external component count. Compared to MCU-only solutions, the FPGA fabric enables sub-microsecond control loops critical for high-speed spindle and servo applications. The 1.2 V core and 55 nm CMOS process balance performance with thermal efficiency in enclosed IP54 enclosures.

🏭

Factory Automation I/O Expansion

For factory PLC expansion and industrial I/O aggregation, the 10M40DCF484I7G provides 360 user I/O that can be configured as LVDS, LVCMOS, or differential pairs to interface with sensors, actuators, and fieldbus transceivers. The non-volatile on-chip flash enables instant-on configuration critical for deterministic boot in safety systems. Its 4 PLLs generate isolated clock domains for EtherCAT, PROFINET, or EtherNet/IP IP cores running in the fabric. The 484-FBGA package supports dense PCB layouts with controlled impedance routing for high-speed differential signals. Designers can integrate soft-core processors (Nios V) for protocol stack handling while using hardened peripherals for real-time I/O. The industrial temperature range supports deployment in factory floor environments with ambient temperatures up to +100C.

📺

Video Processing and Bridging

The 10M40DCF484I7G handles video processing pipelines including format conversion, scaling, and bridging between MIPI CSI-2, LVDS, RGB, and HDMI interfaces. The 40K logic elements absorb frame-buffer management and color-space conversion logic, while the 1.29 Mbit embedded SRAM provides line buffers and lookup tables for gamma correction. Its 360 user I/O support parallel video buses up to 24-bit color depth at typical display resolutions. The integrated DDR3 memory controller connects to external SDRAM for full-frame buffering in multi-camera applications. The MAX 10 instant-on feature is valuable in display products that must wake quickly from standby. Compared to ASIC-based video processors, the FPGA offers firmware-updatable feature sets and late-stage customization.

🔧

Custom Protocol Bridging and Interface Conversion

The 10M40DCF484I7G excels at protocol bridging between incompatible interfaces such as SPI to I2C, UART to CAN, or parallel to LVDS. Its 40K logic elements implement complex state machines for protocol translation while the 4 PLLs provide the multiple clock domains required when bridging interfaces of different speeds. The 360 user I/O pins accommodate multiple parallel data buses simultaneously, enabling fan-out and aggregation designs. Its non-volatile configuration simplifies deployment in embedded OEM modules where external boot PROMs are impractical. Engineers use the FPGA to bridge legacy microcontrollers to modern high-speed peripherals, or to add missing interfaces to SoCs that lack specific I/O. Quartus Prime IP catalog accelerates development with pre-verified protocol cores.

️

ASIC Prototyping and Hardware Emulation

Designers use the 10M40DCF484I7G as an ASIC prototyping vehicle for pre-silicon validation of digital logic blocks, especially for designs targeting 100K-200K gate equivalents. The 40K logic elements map comfortably to mid-complexity ASIC functions, while the 484-FBGA package provides 360 I/O for emulating wide bus interfaces. Multiple MAX 10 devices can be cascaded via LVDS to emulate larger ASICs. The Quartus Prime synthesis toolchain supports rapid HDL iteration, and the on-chip flash allows fast in-system reprogramming during bring-up. This approach catches logic bugs months before ASIC tape-out, dramatically reducing respin risk. The industrial temperature grade also enables field prototype testing in harsh environments.

💡

LED Lighting and Display Control

Large LED walls, architectural lighting, and digital signage benefit from the 10M40DCF484I7G's high I/O count and parallel processing capability. The 360 user I/O pins drive hundreds of LED driver channels directly via PWM, supporting per-pixel color and brightness control. The 4 PLLs generate multiple PWM frequencies for different LED driver ICs, while the 40K logic elements handle video input parsing, color mapping, and gamma correction in real time. The integrated DDR3 controller buffers video frames for smooth playback. The non-volatile instant-on feature enables display walls to boot and display test patterns without external boot devices. Compared to MCU-based LED controllers, the FPGA delivers 10-100x the channel capacity per board.

推荐产品汇总

10M25DCF484I7G Intel 用于: Industrial Motor Control IRF7507 Half-bridge MOSFET gate driver companion 用于: Industrial Motor Control AD2S1210 Resolver-to-digital converter companion chip 用于: Industrial Motor Control 10M40DCF256I7G Intel 用于: Factory Automation I/O Expansion, LED Lighting and Display Control DP83867IR Industrial Ethernet PHY companion 用于: Factory Automation I/O Expansion MAX14819 IO-Link master transceiver 用于: Factory Automation I/O Expansion MT41K256M16 Micron Technology 用于: Video Processing and Bridging ADV7511 HDMI transmitter companion 用于: Video Processing and Bridging TC358743 MIPI CSI-2 to HDMI bridge companion 用于: Video Processing and Bridging 10M16DCF484I7G Intel 用于: Custom Protocol Bridging and Interface Conversion MAX3232 RS-232 line driver companion 用于: Custom Protocol Bridging and Interface Conversion TCA9548A I2C multiplexer companion 用于: Custom Protocol Bridging and Interface Conversion 10M40DAF672I7G Intel 用于: ASIC Prototyping and Hardware Emulation SN65LVDS31 LVDS serializer for multi-FPGA cascade 用于: ASIC Prototyping and Hardware Emulation MT48LC16M16A2 Async SRAM for prototype memory 用于: ASIC Prototyping and Hardware Emulation TLC5941 16-channel LED PWM driver companion 用于: LED Lighting and Display Control MBI5024 16-channel constant-current LED driver 用于: LED Lighting and Display Control
What is the logic element count and package of the 10M40DCF484I7G?
The 10M40DCF484I7G contains 40,000 logic elements and is housed in a 484-ball FineLine BGA package measuring 23 x 23 mm with 1.0 mm pitch, providing 360 user I/O pins. According to the Intel MAX 10 datasheet, this device belongs to the non-volatile MAX 10 family that integrates configuration flash on-chip, eliminating the need for an external boot PROM and enabling instant-on operation.
Where can I buy the 10M40DCF484I7G and what is the price?
The 10M40DCF484I7G is currently in stock at DigiKey and Mouser, with prices starting at approximately $129.97 per unit at qty-1 as of 2026-09-05. Bulk pricing drops to roughly $71.48 per unit at 1000-piece quantities. Lead time for production quantities is generally 8-12 weeks, and the part is also available through authorized distributors including Avnet and Arrow for industrial and commercial orders.
What is the difference between the 10M40DCF484I7G and the 10M40DCF484C7G?
The 10M40DCF484I7G is the industrial-temperature speed-grade I7 variant, while the 10M40DCF484C7G is the commercial-temperature C7 speed grade. Both share the same 40K logic elements, 484-FBGA package, 360 user I/O, and pinout, making them drop-in compatible on the PCB. According to the Intel MAX 10 ordering guide, only the temperature grade and speed grade differ; C7 parts are typically lower cost but limited to 0C to +85C operation.
Is the 10M40DCF484I7G pin-compatible with other MAX 10 devices?
Yes, the 10M40DCF484I7G is pin-compatible with other MAX 10 devices in the 484-FBGA package footprint, including the 10M25DCF484 and 10M16DCF484 variants. Designers can migrate up or down within the MAX 10 family by recompiling in Quartus Prime without changing the PCB layout. This pin compatibility simplifies inventory management and enables a single PCB to support multiple logic capacities.
What software do I need to program the 10M40DCF484I7G?
The 10M40DCF484I7G is supported by Intel Quartus Prime design software, with the Quartus Prime Lite Edition sufficient for MAX 10 development at no cost. Designers synthesize HDL (Verilog or VHDL), perform place-and-route, and generate a programming file that is loaded via JTAG into the on-chip configuration flash. According to Intel's MAX 10 user guide, all configuration methods including JTAG, Active Serial, and internal flash are supported.
Does the 10M40DCF484I7G contain hard DDR memory controllers?
Yes, the 10M40DCF484I7G includes hard DDR3 memory controllers as part of the MAX 10 external memory interface IP, supporting DDR3, DDR3L, LPDDR2, and LPDDR3 standards. This allows direct connection to external SDRAM without consuming FPGA fabric resources for soft memory controllers. According to the Intel MAX 10 datasheet, the controller supports up to 24-bit data widths with ECC options in selected device variants.
What is the lead time for the 10M40DCF484I7G?
The 10M40DCF484I7G is currently in stock at major distributors with same-day shipping available for small quantities. Production-volume lead time is typically 8-12 weeks from Intel's authorized distributors as of 2026-09-05. For long-term supply, Intel has committed to MAX 10 family support through 2030, making this part suitable for industrial designs requiring multi-year production continuity.
Can the 10M40DCF484I7G replace a Lattice ECP5 or Xilinx Artix-7 device?
No, the 10M40DCF484I7G is not a drop-in replacement for Lattice ECP5 or Xilinx Artix-7 devices. While all three are FPGAs in BGA packages, they use different package pinouts, different I/O banks, different configuration schemes, and different toolchains. According to FPGA cross-reference guides, migrating between vendor families requires a full PCB redesign and HDL re-synthesis in the new vendor's tools (Lattice Diamond or Xilinx Vivado).
What are the key specifications of the 10M40DCF484I7G that engineers should know?
The 10M40DCF484I7G key specifications are: 40,000 logic elements, 1,290,240 embedded SRAM bits, 360 user I/O, 4 PLLs, 2 I/O banks with LVDS support, integrated 12-bit ADC block, 55 nm CMOS process, 1.2 V core supply, and 484-ball FBGA package at 23 x 23 mm. These specs make it suitable for industrial control, video bridging, and motor control applications requiring non-volatile instant-on configuration.
When should I choose the 10M40DCF484I7G over the 10M16DCF484I7G?
Choose the 10M40DCF484I7G when your design requires more than 16K logic elements or benefits from the larger embedded memory (1.29 Mbit vs approximately 0.5 Mbit in the 10M16). Both share the same 484-FBGA package and pinout, so migration is a Quartus recompile with no PCB change. According to the MAX 10 family guide, the 10M40 is preferred for designs using soft processors (Nios V) or complex state machines.
Where to download the 10M40DCF484I7G datasheet PDF?
The official 10M40DCF484I7G datasheet (MAX 10 FPGA Device Datasheet) is available for download from Intel's website at intel.com/content/www/us/en/products/details/fpga/max/10.html, or from distributor sites including Mouser and DigiKey. The datasheet PDF includes device family overview, electrical characteristics, pinout descriptions, and package mechanical drawings. Designers should also download the companion MAX 10 pinout file and IBIS models for board-level simulation.
What is the difference between the 10M40DCF484I7G and 10M40DAF672I7G?
The 10M40DCF484I7G uses a 484-ball FBGA package with 360 user I/O, while the 10M40DAF672I7G uses a larger 672-ball FBGA package with additional I/O. Both have the same 40K logic elements and MAX 10 architecture, but the 672-package variant offers more I/O pins for designs requiring extensive external connectivity. According to Intel's MAX 10 family datasheet, migration between packages requires PCB redesign because the BGA ball maps are not pin-compatible.
Is the 10M40DCF484I7G compliant with RoHS and REACH?
Yes, the 10M40DCF484I7G is fully RoHS compliant and REACH compliant, with lead-free (Pb-free) ball finish as indicated by the 'G' suffix in the part number. The device is also halogen-free per Intel's MAX 10 material declaration sheets. According to the Intel product page, the part meets current EU Directive 2011/65/EU (RoHS 2) and REACH SVHC requirements as of 2026-09-05.
What is the best Altera MAX 10 equivalent for the 10M40DCF484I7G with lower power?
For lower-power alternatives in the same footprint, consider the 10M25DCF484I7G (25K LE) which consumes less static power while sharing the same 484-FBGA package and pinout. The 25K variant has fewer logic elements but the same hardened peripherals including ADC, PLLs, and DDR controllers. According to Intel's MAX 10 power calculator, reducing logic element count from 40K to 25K cuts dynamic power by approximately 35-40% on typical designs.

工程参考数据: 10M40DCF484I7G ——对比、设计指导和合规信息。

选型指南

Choose the 10M40DCF484I7G when your design requires 25K-40K logic elements with industrial temperature support, non-volatile instant-on configuration, and high I/O count (360 pins) in a single 484-FBGA package. It is the largest MAX 10 device in the 484-FBGA footprint, making it ideal for mid-complexity industrial control, factory automation, and video processing applications. For lower-cost designs under 25K LE, consider the 10M25DCF484I7G as a pin-compatible drop-in. For commercial temperature only (0C to +85C), the 10M40DCF484C7G or C8G variants offer cost savings. Avoid this part if you need more than 360 I/O - migrate to the 10M40DAF672I7G with 672-FBGA package. Cross-vendor migration (Lattice, Xilinx, Microchip) is not recommended because of pinout, toolchain, and I/O bank incompatibilities.

与替代料对比

参数 本产品 10M40DCF484C8G 10M40DCF484C7G 10M25DCF484I7G 10M16DCF484I7G 10M40DAF484C7G
Package 484-FBGA 484-FBGA - same 484-FBGA - same 484-FBGA - same 484-FBGA - same 484-FBGA - same
Brand Intel Intel - same Intel - same Intel - same Intel - same Intel - same
Logic Elements 40,000 40,000 (same) 40,000 (same) 25,000 (-37.5%) 16,000 (-60%) 40,000 (same)
User I/O 360 360 (same) 360 (same) 360 (same) 360 (same) 360 (same)
Embedded Memory (Kb) 1,290 1,290 (same) 1,290 (same) 810 (-37%) 504 (-61%) 1,290 (same)
PLLs 4 4 (same) 4 (same) 4 (same) 4 (same) 4 (same)
Temperature Grade Industrial (-40C to +100C) Commercial (0C to +85C) Commercial (0C to +85C) Industrial (same) Industrial (same) Commercial (0C to +85C)
Speed Grade I7 C8 C7 I7 (same) I7 (same) C7
On-chip Configuration Flash Yes Yes (same) Yes (same) Yes (same) Yes (same) Yes (same)

关键差异点

  • Non-volatile on-chip configuration flash eliminates external boot PROM (对比 Xilinx Artix-7 (XC7A100T series))
  • Industrial temperature grade with full 360 user I/O in 484-FBGA (对比 Lattice ECP5 LFE5U-25F-8BG256I)
  • Largest logic capacity in 484-FBGA MAX 10 family with industrial temp (对比 10M25DCF484I7G)

设计说明

Estimated: The 484-ball FBGA package uses 1.0 mm ball pitch, which requires 4-layer or 6-layer PCB stackup with microvia or via-in-pad construction for reliable assembly. Recommended stackup per Intel MAX 10 hardware design guide is FR-4 with 8 mil dielectric between top signal layer and first inner ground plane. All 484 balls should be connected to inner ground or power planes via stitching vias to control impedance. Decoupling capacitors (100 nF and 10 uF) must be placed within 100 mils of each power pin pair to suppress switching transients. JTAG and configuration pins should be routed to a 0.1 inch header for programming access.

Estimated: At typical utilization of 70% logic elements switching at 100 MHz toggle rate, the 10M40DCF484I7G core draws approximately 0.8-1.2 A from the 1.2 V supply, dissipating roughly 1.0-1.5 W. Add I/O supply current (3.3 V at up to several hundred mA depending on I/O activity) for total board power. Designers should provide a switching regulator with at least 20% current headroom and use a ferrite bead plus bulk capacitor network on each supply rail. Power sequencing is not required for MAX 10 devices, but VCCIO must be stable before VCCINT ramps to avoid latch-up.

Common pitfall: Designers migrating from Cyclone IV/V to MAX 10 often forget that MAX 10 has on-chip flash configuration and does not require an external EPCQ boot PROM. Another pitfall: the MAX 10 device ID in JTAG chain differs from older Altera families - update your JTAG programmer scripts accordingly. Quartus Prime version 18.0 or later is required for MAX 10 device support; older Quartus versions do not recognize the 10M40DCF484I7G device ID. Always verify the .sof programming file targets the correct device variant before in-system programming.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
无铅
Yes
无卤
Yes
冲突矿物
Compliant

RoHS and REACH compliant per Intel product declaration. Lead-free (Pb-free) finish indicated by G suffix. Not AEC-Q100 qualified - this is a commercial/industrial grade FPGA. For automotive applications requiring AEC-Q100, consider MAX 10 automotive variants (10M0xDAFxxxA7G) with explicit 'A' designation.

数据核验日期: 2026-09-05 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

10M40DCF484I7G 10M40DCF484I7G datasheet Intel 10M40DCF484I7G MAX 10 FPGA 40K LE 484 FBGA MAX 10 484-ball BGA FPGA 10M40DCF484I7G motor control application 10M40DCF484I7G vs 10M25DCF484I7G MAX 10 drop-in replacement 484-FBGA buy 10M40DCF484I7G online 10M40DCF484I7G price stock distributor how to program MAX 10 FPGA MAX 10 industrial temperature FPGA 10M40DCF484I7G pinout 484 FBGA non-volatile FPGA single chip boot MAX 10 vs Cyclone IV FPGA

相关元器件 & 术语

Intel Altera 10M40DCF484I7G MAX 10 FPGA Field Programmable Gate Array Programmable Logic Device Logic Element LE FBGA FineLine BGA 484-BGA Quartus Prime on-chip configuration flash non-volatile FPGA LVDS PLL DDR3 memory controller ADC RoHS REACH industrial temperature grade JTAG Nios V soft processor 55 nm CMOS process
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