10M08SAU169A7G - MAX 10 FPGA 8K LE 169-UBGA | Intel
料号： 10M08SAU169A7G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.5 | $1,450.00 |
| 500 | $12.2 | $6,100.00 |
| 1,000 | $10.5 | $10,500.00 |
10M08SAU169A7G 概述
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as memory and DSP slices. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLD), which sit alongside ASICs and microcontrollers as the three main approaches to custom digital hardware. MAX 10 FPGAs specifically occupy the low-power, non-volatile niche, replacing traditional CPLD + external flash + ADC combinations in cost-sensitive industrial and automotive designs.
Key features include 8,000 logic elements (4-input LUTs), 378 Kbits (approximately 46 Kbytes) of embedded SRAM, 16 full-precision 18x18 multipliers, and a hard DDR3 memory controller. The 169-UBGA package exposes 130 general-purpose I/Os supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards, while the integrated 12-bit ADC provides up to 1 MSPS sampling across 17 analog inputs.
Architecturally, the MAX 10 family uses a logic-array-block (LAB) fabric with 16 logic elements per LAB, and includes embedded NOR flash for single-chip configuration storage. This eliminates the external boot flash typically required by SRAM-based FPGAs from Xilinx and AMD (formerly Xilinx Spartan-6), reducing BOM cost and PCB footprint. The device supports up to 450 MHz internal clock operation via phase-locked loops (PLLs).
Typical applications include industrial motor control and factory automation, automotive driver-assistance systems (ADAS), portable medical instruments, video processing for surveillance and machine vision, and I/O expansion for processors. The combination of integrated ADC, flash memory, and small form factor suits space-constrained and cost-optimized designs.
When designing with the 10M08SAU169A7G, verify that the 169-UBGA ballmap is compatible with your PCB footprint and that the Quartus Prime toolchain supports the speed grade 7 timing model. For migration paths within the MAX 10 family, the 169-UBGA package is shared with 10M04 and 10M16 variants, enabling scalable logic capacity on a single PCB layout.
This page synthesizes distributor pricing, drop-in alternative FPGAs from the same MAX 10 family, comparison parameters, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： 10M08SAU169A7G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M08SAU169A7G （相同外形与封装尺寸） ——差异在于 Package, Configuration Memory, Operating Temperature, Family, Process Technology.
快速对比工具——选择替代料号进行并排对比：
10M08SCU169A7G
✅ 直接替换✓ 有现货
$19.85 / 个
查看数据手册 →10M08SAU169C7G
✅ 直接替换📋 参考替代料（不在目录中）
10M08SAU169C8G
✅ 直接替换✓ 有现货
$10.2 / 个
查看数据手册 →10M08SAU169I7G
✅ 直接替换✓ 有现货
$10.45 / 个
查看数据手册 →10M16SAU169A7G
✅ 直接替换📋 参考替代料（不在目录中）
10M04SAU169A7G
✅ 直接替换📋 参考替代料（不在目录中）
10M08SAU169A7G 最大额定值与电气特性
| Series | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory | 378 Kbits (≈46 Kbytes) |
| User I/Os | 130 |
| DSP Blocks / 18x18 Multipliers | 16 |
| PLLs | 4 |
| On-chip Flash | Dual-configuration (1.4 Mbits user flash) |
| ADC | 12-bit, 1 MSPS, 17 analog inputs (hard IP) |
| 封装 | 169-LFBGA (Ultra FineLine BGA, 11x11 mm) |
| 工作温度 | -40C to +125C (automotive grade) |
| Speed Grade | 7 (fast) |
| Process Technology | TSMC 55 nm embedded NOR flash |
| 安装类型 | Surface Mount (BGA) |
| MSL 等级 | 3 (168 hours) |
| RoHS 状态 | Compliant |
| Configuration Memory | Internal flash (single-chip instant-on) |
10M08SAU169A7G 169-lfbga (ultra fineline bga, 11x11 mm) 引脚配置指南
10M08SAU169A7G（169-lfbga (ultra fineline bga, 11x11 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10M08SAU169A7G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10M08SAU169A7G 适用于 6 应用s: Industrial Motor Control, Automotive Body Electronics, Video Surveillance and Machine Vision, Portable Medical Instruments, Industrial I/O Expansion Module, LED Video Wall Controller.
Industrial Motor Control
The 10M08SAU169A7G suits industrial motor control drives because its 8,000 logic elements and 16 DSP 18x18 multipliers implement field-oriented control (FOC) loops and space-vector PWM generation within one chip. The integrated 12-bit 1 MSPS ADC with 17 analog inputs samples phase currents, DC bus voltage, and temperature without external ADCs, reducing BOM cost by $2-$5 per axis. Internal flash enables instant-on from power-up, critical for safety-rated drives where deterministic startup under 10 ms is mandatory. The 169-UBGA package keeps the PCB footprint compact for multi-axis servo drives.
推荐
Automotive Body Electronics
The 10M08SAU169A7G is qualified for automotive body electronics including body control modules, LED matrix drivers, and HVAC control units. The integrated ADC and flash simplify BCM designs by combining I/O expansion, sensor signal conditioning, and instant-on wake-up logic. AEC-Q100 automotive temperature rating of -40C to +125C allows deployment in underhood and cabin environments. The 169-UBGA package provides 130 user I/Os sufficient for multiple LIN/CAN node aggregation with PWM-controlled loads.
推荐
Video Surveillance and Machine Vision
The 10M08SAU169A7G performs front-end image preprocessing for IP cameras and machine vision systems, including Bayer demosaicing, color space conversion, and motion detection. 378 Kbits of embedded SRAM buffers one or two video scanlines without external memory, reducing BOM cost for low-resolution sensors. The DDR3 hard memory controller supports up to 1 GB of external SDRAM for 1080p stream buffering. PLLs generate precise pixel clocks from 27 MHz crystals with sub-percent jitter.
推荐
Portable Medical Instruments
The 10M08SAU169A7G serves portable medical instruments such as blood-glucose meters, pulse oximeters, and handheld ultrasound probes. The integrated 12-bit ADC digitizes biosensor signals directly, eliminating external ADC chips and reducing the patient-side leakage footprint. Single-chip instant-on from internal flash supports FDA-mandated device self-test sequences within 100 ms of power-on. The 169-UBGA 11x11 mm package fits handheld enclosures while 130 user I/Os accommodate display, keypad, and wireless module interfaces.
推荐
Industrial I/O Expansion Module
The 10M08SAU169A7G acts as a standalone I/O expansion co-processor in PLC backplanes and modular industrial controllers, offloading high-speed digital I/O scanning from a host CPU. The 130 user I/Os handle opto-isolated 24V inputs and relay-driver outputs in parallel, while embedded flash stores the scan-programmable logic matrix for deterministic 1 ms cycle times. Internal ADC adds analog input channels (4-20 mA, 0-10 V) to digital I/O cards without external ADC ICs.
推荐
LED Video Wall Controller
The 10M08SAU169A7G drives small-to-medium LED video walls at refresh rates above 1920 Hz, performing gamma correction, color depth reduction, and scan-multiplexing in real time. Embedded RAM and 130 LVDS-capable I/Os support scan-line buffering and parallel RGB data output to LED driver chains. Single-chip instant-on ensures clean boot without visible flashing artifacts in retail and broadcast installations. The 169-UBGA package's 0.65 mm pitch requires standard 4-layer PCB with microvia escape.
推荐
推荐产品汇总
工程参考数据： 10M08SAU169A7G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M08SCU169A7G | 10M08SAU169C7G | 10M08SAU169C8G | 10M08SAU169I7G | 10M16SAU169A7G | 10M04SAU169A7G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 169-UBGA (11x11 mm) | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 16,000 (+100%) | 4,000 (-50%) |
| Embedded RAM | 378 Kbits | 378 Kbits | 378 Kbits | 378 Kbits | 378 Kbits | 549 Kbits (+45%) | 189 Kbits (-50%) |
| User I/Os | 130 | 130 | 130 | 130 | 130 | 130 | 130 |
| DSP / 18x18 Multipliers | 16 | 16 | 16 | 16 | 16 | 32 (+100%) | 8 (-50%) |
| Temperature Grade | Automotive -40C to +125C | Commercial 0C to +85C | Automotive -40C to +125C | Commercial 0C to +85C | Industrial -40C to +100C | Automotive -40C to +125C | Automotive -40C to +125C |
| Speed Grade | 7 (fast) | 7 | 7 | 8 (slower) | 7 | 7 | 7 |
| Integrated ADC | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels |
关键差异点
- Integrated ADC reduces BOM cost （对比 10M08SAU169C7G (same part, slower speed grade))
- Scalable to 16K LEs on the same footprint （对比 10M04SAU169A7G)
- Automotive temperature grade （对比 10M08SCU169A7G (commercial grade))
- Same-package migration to higher-density 10M16 （对比 10M16SAU169A7G)
设计说明
Estimated: at 85C ambient and full 8K LE utilization at 100 MHz toggle rate, the 10M08SAU169A7G dissipates approximately 1.2 W. The 169-UBGA package requires a thermal pad bonded to an inner ground plane with 4-6 thermal vias for a junction-to-ambient thermal resistance (theta_JA) of approximately 25 C/W on a 4-layer JEDEC test PCB. For continuous operation near +125C ambient, place thermal vias directly under the BGA thermal balls and maintain minimum 4-layer PCB with 1 oz copper on outer layers.
The 169-UBGA at 0.65 mm ball pitch requires laser-drilled microvias or staggered 0.2 mm via-in-pad escape on the top layer. Maintain a 4-layer stack-up with 0.5 oz copper on internal power planes (VCCINT 1.2V, VCCIO 1.2-3.3V). Decoupling per Intel MAX 10 reference: 0.1 uF X7R + 10 uF tantalum for every 10 LEs, placed within 2 mm of each power pin. Use impedance-controlled traces (50 ohm single-ended, 100 ohm differential) for LVDS pairs.
Common pitfalls: (1) Failing to enable the internal configuration mode in the Quartus Prime device options before generating the .pof/.sof bitstream - the device will not boot from internal flash if dual-boot mode is incorrectly set. (2) Not connecting all VCC and GND balls - the 169-UBGA has multiple power balls (VCCINT, VCCA, VCCD_PLL, VCCIO) that must all be decoupled; missing connections cause incremental failures at temperature. (3) Using 8-bit parallel flash memory patterns for configuration; MAX 10 uses internal flash only and does not accept external passive-mode configuration.
Place the 25 MHz or 50 MHz crystal within 5 mm of the CLK0 ball to minimize clock jitter, and guard the trace with a ground via fence on both sides. Route the JTAG chain (TCK, TMS, TDI, TDO) as a single-ended 50 ohm daisy-chain topology with 10K pull-ups on TCK and TMS to VCCIO1.2V. Reserve a 4-pin header on the PCB edge for USB-Blaster II connection during board bring-up. Per Intel AN-773, place configuration-related pull-ups (MSEL[3:0], nCONFIG, nSTATUS, CONF_DONE) close to the FPGA to avoid false reset events during power-up.
合规信息
RoHS and REACH compliance per distributor listings (DigiKey, Mouser). AEC-Q100 automotive grade indicated by A7G suffix per Vyrian listing. Lead-free manufacturing process. Halogen-free status not explicitly stated in available data - marked unknown.
