10M08SAU169A7G - MAX 10 FPGA 8K LE 169-UBGA | Intel
MPN: 10M08SAU169A7G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.5 | $1,450.00 |
| 500 | $12.2 | $6,100.00 |
| 1,000 | $10.5 | $10,500.00 |
Drop-in alternatives for 10M08SAU169A7G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M08SCU169A7G
β Drop-Inβ In Stock
$19.85 / Unit
View Datasheet β10M08SAU169C7G
β Drop-Inπ Reference alternative (not in catalog)
10M08SAU169C8G
β Drop-Inβ In Stock
$11.85 / Unit
View Datasheet β10M08SAU169I7G
β Drop-Inπ Reference alternative (not in catalog)
10M16SAU169A7G
β Drop-Inπ Reference alternative (not in catalog)
10M04SAU169A7G
β Drop-Inπ Reference alternative (not in catalog)
10M08SAU169A7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory | 378 Kbits (β46 Kbytes) |
| User I/Os | 130 |
| DSP Blocks / 18x18 Multipliers | 16 |
| PLLs | 4 |
| On-chip Flash | Dual-configuration (1.4 Mbits user flash) |
| ADC | 12-bit, 1 MSPS, 17 analog inputs (hard IP) |
| Package | 169-LFBGA (Ultra FineLine BGA, 11x11 mm) |
| Operating Temperature | -40C to +125C (automotive grade) |
| Speed Grade | 7 (fast) |
| Process Technology | TSMC 55 nm embedded NOR flash |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Configuration Memory | Internal flash (single-chip instant-on) |
10M08SAU169A7G 169-lfbga (ultra fineline bga, 11x11 mm) Pin Configuration Guide
Complete pinout information for 10M08SAU169A7G (169-lfbga (ultra fineline bga, 11x11 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08SAU169A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08SAU169A7G is suitable for 6 applications: Industrial Motor Control, Automotive Body Electronics, Video Surveillance and Machine Vision, Portable Medical Instruments, Industrial I/O Expansion Module, LED Video Wall Controller.
Industrial Motor Control
The 10M08SAU169A7G suits industrial motor control drives because its 8,000 logic elements and 16 DSP 18x18 multipliers implement field-oriented control (FOC) loops and space-vector PWM generation within one chip. The integrated 12-bit 1 MSPS ADC with 17 analog inputs samples phase currents, DC bus voltage, and temperature without external ADCs, reducing BOM cost by $2-$5 per axis. Internal flash enables instant-on from power-up, critical for safety-rated drives where deterministic startup under 10 ms is mandatory. The 169-UBGA package keeps the PCB footprint compact for multi-axis servo drives.
Recommended
Automotive Body Electronics
The 10M08SAU169A7G is qualified for automotive body electronics including body control modules, LED matrix drivers, and HVAC control units. The integrated ADC and flash simplify BCM designs by combining I/O expansion, sensor signal conditioning, and instant-on wake-up logic. AEC-Q100 automotive temperature rating of -40C to +125C allows deployment in underhood and cabin environments. The 169-UBGA package provides 130 user I/Os sufficient for multiple LIN/CAN node aggregation with PWM-controlled loads.
Recommended
Video Surveillance and Machine Vision
The 10M08SAU169A7G performs front-end image preprocessing for IP cameras and machine vision systems, including Bayer demosaicing, color space conversion, and motion detection. 378 Kbits of embedded SRAM buffers one or two video scanlines without external memory, reducing BOM cost for low-resolution sensors. The DDR3 hard memory controller supports up to 1 GB of external SDRAM for 1080p stream buffering. PLLs generate precise pixel clocks from 27 MHz crystals with sub-percent jitter.
Recommended
Portable Medical Instruments
The 10M08SAU169A7G serves portable medical instruments such as blood-glucose meters, pulse oximeters, and handheld ultrasound probes. The integrated 12-bit ADC digitizes biosensor signals directly, eliminating external ADC chips and reducing the patient-side leakage footprint. Single-chip instant-on from internal flash supports FDA-mandated device self-test sequences within 100 ms of power-on. The 169-UBGA 11x11 mm package fits handheld enclosures while 130 user I/Os accommodate display, keypad, and wireless module interfaces.
Recommended
Industrial I/O Expansion Module
The 10M08SAU169A7G acts as a standalone I/O expansion co-processor in PLC backplanes and modular industrial controllers, offloading high-speed digital I/O scanning from a host CPU. The 130 user I/Os handle opto-isolated 24V inputs and relay-driver outputs in parallel, while embedded flash stores the scan-programmable logic matrix for deterministic 1 ms cycle times. Internal ADC adds analog input channels (4-20 mA, 0-10 V) to digital I/O cards without external ADC ICs.
Recommended
LED Video Wall Controller
The 10M08SAU169A7G drives small-to-medium LED video walls at refresh rates above 1920 Hz, performing gamma correction, color depth reduction, and scan-multiplexing in real time. Embedded RAM and 130 LVDS-capable I/Os support scan-line buffering and parallel RGB data output to LED driver chains. Single-chip instant-on ensures clean boot without visible flashing artifacts in retail and broadcast installations. The 169-UBGA package's 0.65 mm pitch requires standard 4-layer PCB with microvia escape.
Recommended
Recommended Products Summary
Engineering reference data for 10M08SAU169A7G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08SCU169A7G | 10M08SAU169C7G | 10M08SAU169C8G | 10M08SAU169I7G | 10M16SAU169A7G | 10M04SAU169A7G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 169-UBGA (11x11 mm) | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 16,000 (+100%) | 4,000 (-50%) |
| Embedded RAM | 378 Kbits | 378 Kbits | 378 Kbits | 378 Kbits | 378 Kbits | 549 Kbits (+45%) | 189 Kbits (-50%) |
| User I/Os | 130 | 130 | 130 | 130 | 130 | 130 | 130 |
| DSP / 18x18 Multipliers | 16 | 16 | 16 | 16 | 16 | 32 (+100%) | 8 (-50%) |
| Temperature Grade | Automotive -40C to +125C | Commercial 0C to +85C | Automotive -40C to +125C | Commercial 0C to +85C | Industrial -40C to +100C | Automotive -40C to +125C | Automotive -40C to +125C |
| Speed Grade | 7 (fast) | 7 | 7 | 8 (slower) | 7 | 7 | 7 |
| Integrated ADC | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels | 12-bit, 1 MSPS, 17 channels |
Key Differentiators
- Integrated ADC reduces BOM cost (vs 10M08SAU169C7G (same part, slower speed grade))
- Scalable to 16K LEs on the same footprint (vs 10M04SAU169A7G)
- Automotive temperature grade (vs 10M08SCU169A7G (commercial grade))
- Same-package migration to higher-density 10M16 (vs 10M16SAU169A7G)
Design Notes
Estimated: at 85C ambient and full 8K LE utilization at 100 MHz toggle rate, the 10M08SAU169A7G dissipates approximately 1.2 W. The 169-UBGA package requires a thermal pad bonded to an inner ground plane with 4-6 thermal vias for a junction-to-ambient thermal resistance (theta_JA) of approximately 25 C/W on a 4-layer JEDEC test PCB. For continuous operation near +125C ambient, place thermal vias directly under the BGA thermal balls and maintain minimum 4-layer PCB with 1 oz copper on outer layers.
The 169-UBGA at 0.65 mm ball pitch requires laser-drilled microvias or staggered 0.2 mm via-in-pad escape on the top layer. Maintain a 4-layer stack-up with 0.5 oz copper on internal power planes (VCCINT 1.2V, VCCIO 1.2-3.3V). Decoupling per Intel MAX 10 reference: 0.1 uF X7R + 10 uF tantalum for every 10 LEs, placed within 2 mm of each power pin. Use impedance-controlled traces (50 ohm single-ended, 100 ohm differential) for LVDS pairs.
Common pitfalls: (1) Failing to enable the internal configuration mode in the Quartus Prime device options before generating the .pof/.sof bitstream - the device will not boot from internal flash if dual-boot mode is incorrectly set. (2) Not connecting all VCC and GND balls - the 169-UBGA has multiple power balls (VCCINT, VCCA, VCCD_PLL, VCCIO) that must all be decoupled; missing connections cause incremental failures at temperature. (3) Using 8-bit parallel flash memory patterns for configuration; MAX 10 uses internal flash only and does not accept external passive-mode configuration.
Place the 25 MHz or 50 MHz crystal within 5 mm of the CLK0 ball to minimize clock jitter, and guard the trace with a ground via fence on both sides. Route the JTAG chain (TCK, TMS, TDI, TDO) as a single-ended 50 ohm daisy-chain topology with 10K pull-ups on TCK and TMS to VCCIO1.2V. Reserve a 4-pin header on the PCB edge for USB-Blaster II connection during board bring-up. Per Intel AN-773, place configuration-related pull-ups (MSEL[3:0], nCONFIG, nSTATUS, CONF_DONE) close to the FPGA to avoid false reset events during power-up.
Compliance Information
RoHS and REACH compliance per distributor listings (DigiKey, Mouser). AEC-Q100 automotive grade indicated by A7G suffix per Vyrian listing. Lead-free manufacturing process. Halogen-free status not explicitly stated in available data - marked unknown.
