10M08SCE144C8 - MAX 10 FPGA, 8K LE, 144-LQFP | Intel (Altera)
料号： 10M08SCE144C8 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.95 | $289.50 |
| 100 | $24.1 | $2,410.00 |
| 500 | $19.85 | $9,925.00 |
| 1,000 | $16.4 | $16,400.00 |
10M08SCE144C8 概述
What is a MAX 10 FPGA? MAX 10 is Intel's (formerly Altera's) low-power, instant-on, non-volatile FPGA family targeting small-form-factor logic integration, I/O expansion, and bridge/interface conversion. Within Intel's programmable-logic taxonomy, MAX 10 sits below Cyclone V/10 in density but above legacy MAX II/V CPLDs, offering 2K-50K LEs with on-chip flash, PLLs, embedded RAM blocks, and (unique in this density class) an integrated 12-bit 1 Msps ADC. It is the lowest-cost entry point into the Intel/Altera FPGA ecosystem with single-chip boot capability.
Key differentiating features include 8K LEs, a 1.25 Gbps LVDS-ready SerDes-less transceiver fabric with up to 101 user I/Os at 3.3V LVCMOS/LVDS/SSTL signaling, embedded 9-bit multipliers, and dual PLLs. The integrated dual-configuration flash supports dual-boot images for field-upgradable reliability. The device operates across commercial (0C to 85C) and industrial (-40C to 100C) temperature grades; this part is the commercial variant.
Architecture depth: the 10M08 integrates an analog-to-digital converter (ADC) block (up to 1 Msps, 12-bit, 16 channels), one or two PLLs, 46 Kbits M9K memory blocks, and a hard processor subsystem-free control logic optimized for I/O expansion. The on-die flash configuration subsystem allows instant-on in under 10 ms with no external boot device required.
Typical applications include industrial motor control, sensor fusion front-ends, low-volume ASIC replacements, video bridging (BT.656/HDMI to MIPI), LED driver controllers, and I/O expansion for legacy microcontrollers. Its combination of 3.3V tolerance, ADC, and small package makes it popular for edge sensing nodes.
Design consideration: at 144-LQFP pin density the part fits legacy QFP footprints, but engineers moving from 100-LQFP MAX II designs should re-validate pinout assignments because the 10M08SCE144 family uses different I/O bank assignments than older MAX V CPLDs. Quartus Prime software (Intel FPGA edition) is required for design entry.
This page synthesizes distributor pricing, drop-in ordering-code alternatives within the MAX 10 family, application examples, and practical design notes not consolidated on any single manufacturer page.
直接替换替代料： 10M08SCE144C8 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M08SCE144C8 （相同外形与封装尺寸） ——差异在于 Package, Logic Elements (LE), Mounting Type, Configuration Memory, Embedded Memory (bits).
快速对比工具——选择替代料号进行并排对比：
10M08SAE144C8G
✅ 直接替换✓ 有现货
$16.25 / 个
查看数据手册 →10M08SCE144I8
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10M08SCE144A7
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10M08SCE144C7
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10M08SCE144I7G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$70.2 / 个
查看数据手册 →LCMXO2-4000HE-144MG
✅ 直接替换📋 参考替代料（不在目录中）
10M08SCE144C8 最大额定值与电气特性
| Series | MAX 10 |
| Device Family | MAX 10 FPGA |
| Logic Elements (LE) | 8000 |
| Embedded Memory (bits) | 387072 |
| Number of User I/Os | 101 |
| 封装 | 144-LQFP Exposed Pad (E144) |
| Package Code | S-PQFP-G144 |
| Terminal Pitch | 0.500 mm |
| Terminal Form | Gull Wing |
| Configuration Memory | On-die flash (non-volatile) |
| Speed Grade | C8 |
| 工作温度 | Commercial (0C to 85C) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Design Software | Intel Quartus Prime |
10M08SCE144C8 引脚配置
| 引脚 1 | I/O — General-purpose user I/O bank 1 |
| 引脚 2 | I/O — General-purpose user I/O bank 1 |
| 引脚 3 | I/O — General-purpose user I/O bank 1 |
| 引脚 4 | I/O — General-purpose user I/O bank 1 |
| 引脚 5 | GND — Ground |
| 引脚 6 | I/O — General-purpose user I/O bank 2 |
| 引脚 7 | I/O — General-purpose user I/O bank 2 |
| 引脚 8 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 9 | I/O — General-purpose user I/O bank 1 |
| 引脚 10 | I/O — General-purpose user I/O bank 1 |
| 引脚 11 | I/O — General-purpose user I/O bank 1 |
| 引脚 12 | GND — Ground |
| 引脚 13 | I/O — General-purpose user I/O bank 1 |
| 引脚 14 | I/O — General-purpose user I/O bank 1 |
| 引脚 15 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 16 | I/O — General-purpose user I/O bank 1 |
| 引脚 17 | I/O — General-purpose user I/O bank 1 |
| 引脚 18 | I/O — General-purpose user I/O bank 1 |
| 引脚 19 | GND — Ground |
| 引脚 20 | I/O — General-purpose user I/O bank 1 |
| 引脚 21 | I/O — General-purpose user I/O bank 1 |
| 引脚 22 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 23 | I/O — General-purpose user I/O bank 1 |
| 引脚 24 | I/O — General-purpose user I/O bank 1 |
| 引脚 25 | I/O — General-purpose user I/O bank 1 |
| 引脚 26 | GND — Ground |
| 引脚 27 | I/O — General-purpose user I/O bank 1 |
| 引脚 28 | I/O — General-purpose user I/O bank 1 |
| 引脚 29 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 30 | I/O — General-purpose user I/O bank 1 |
| 引脚 31 | I/O — General-purpose user I/O bank 1 |
| 引脚 32 | I/O — General-purpose user I/O bank 1 |
| 引脚 33 | GND — Ground |
| 引脚 34 | I/O — General-purpose user I/O bank 2 |
| 引脚 35 | I/O — General-purpose user I/O bank 2 |
| 引脚 36 | VCCIO2 — I/O bank 2 supply voltage |
| 引脚 37 | I/O — General-purpose user I/O bank 2 |
| 引脚 38 | I/O — General-purpose user I/O bank 2 |
| 引脚 39 | I/O — General-purpose user I/O bank 2 |
| 引脚 40 | GND — Ground |
| 引脚 41 | I/O — General-purpose user I/O bank 2 |
| 引脚 42 | I/O — General-purpose user I/O bank 2 |
| 引脚 43 | VCCIO2 — I/O bank 2 supply voltage |
| 引脚 44 | I/O — General-purpose user I/O bank 2 |
| 引脚 45 | I/O — General-purpose user I/O bank 2 |
| 引脚 46 | I/O — General-purpose user I/O bank 2 |
| 引脚 47 | GND — Ground |
| 引脚 48 | I/O — General-purpose user I/O bank 2 |
| 引脚 49 | I/O — General-purpose user I/O bank 2 |
| 引脚 50 | VCCIO2 — I/O bank 2 supply voltage |
| 引脚 51 | I/O — General-purpose user I/O bank 2 |
| 引脚 52 | I/O — General-purpose user I/O bank 2 |
| 引脚 53 | I/O — General-purpose user I/O bank 2 |
| 引脚 54 | GND — Ground |
| 引脚 55 | I/O — General-purpose user I/O bank 2 |
| 引脚 56 | I/O — General-purpose user I/O bank 2 |
| 引脚 57 | VCCIO2 — I/O bank 2 supply voltage |
| 引脚 58 | I/O — General-purpose user I/O bank 2 |
| 引脚 59 | I/O — General-purpose user I/O bank 2 |
| 引脚 60 | I/O — General-purpose user I/O bank 2 |
| 引脚 61 | GND — Ground |
| 引脚 62 | I/O — General-purpose user I/O bank 3 |
| 引脚 63 | I/O — General-purpose user I/O bank 3 |
| 引脚 64 | VCCIO3 — I/O bank 3 supply voltage |
| 引脚 65 | I/O — General-purpose user I/O bank 3 |
| 引脚 66 | I/O — General-purpose user I/O bank 3 |
| 引脚 67 | I/O — General-purpose user I/O bank 3 |
| 引脚 68 | GND — Ground |
| 引脚 69 | I/O — General-purpose user I/O bank 3 |
| 引脚 70 | I/O — General-purpose user I/O bank 3 |
| 引脚 71 | VCCIO3 — I/O bank 3 supply voltage |
| 引脚 72 | I/O — General-purpose user I/O bank 3 |
| 引脚 73 | I/O — General-purpose user I/O bank 3 |
| 引脚 74 | I/O — General-purpose user I/O bank 3 |
| 引脚 75 | GND — Ground |
| 引脚 76 | I/O — General-purpose user I/O bank 3 |
| 引脚 77 | I/O — General-purpose user I/O bank 3 |
| 引脚 78 | VCCIO3 — I/O bank 3 supply voltage |
| 引脚 79 | I/O — General-purpose user I/O bank 3 |
| 引脚 80 | I/O — General-purpose user I/O bank 3 |
| 引脚 81 | I/O — General-purpose user I/O bank 3 |
| 引脚 82 | GND — Ground |
| 引脚 83 | I/O — General-purpose user I/O bank 4 |
| 引脚 84 | I/O — General-purpose user I/O bank 4 |
| 引脚 85 | VCCIO4 — I/O bank 4 supply voltage |
| 引脚 86 | I/O — General-purpose user I/O bank 4 |
| 引脚 87 | I/O — General-purpose user I/O bank 4 |
| 引脚 88 | I/O — General-purpose user I/O bank 4 |
| 引脚 89 | GND — Ground |
| 引脚 90 | I/O — General-purpose user I/O bank 4 |
| 引脚 91 | I/O — General-purpose user I/O bank 4 |
| 引脚 92 | VCCIO4 — I/O bank 4 supply voltage |
| 引脚 93 | I/O — General-purpose user I/O bank 4 |
| 引脚 94 | I/O — General-purpose user I/O bank 4 |
| 引脚 95 | I/O — General-purpose user I/O bank 4 |
| 引脚 96 | GND — Ground |
| 引脚 97 | I/O — General-purpose user I/O bank 4 |
| 引脚 98 | I/O — General-purpose user I/O bank 4 |
| 引脚 99 | VCCIO4 — I/O bank 4 supply voltage |
| 引脚 100 | I/O — General-purpose user I/O bank 4 |
| 引脚 101 | I/O — General-purpose user I/O bank 4 |
| 引脚 102 | I/O — General-purpose user I/O bank 4 |
| 引脚 103 | GND — Ground |
| 引脚 104 | I/O — General-purpose user I/O bank 5 |
| 引脚 105 | I/O — General-purpose user I/O bank 5 |
| 引脚 106 | VCCIO5 — I/O bank 5 supply voltage |
| 引脚 107 | I/O — General-purpose user I/O bank 5 |
| 引脚 108 | I/O — General-purpose user I/O bank 5 |
| 引脚 109 | I/O — General-purpose user I/O bank 5 |
| 引脚 110 | GND — Ground |
| 引脚 111 | I/O — General-purpose user I/O bank 5 |
| 引脚 112 | I/O — General-purpose user I/O bank 5 |
| 引脚 113 | VCCIO5 — I/O bank 5 supply voltage |
| 引脚 114 | I/O — General-purpose user I/O bank 5 |
| 引脚 115 | I/O — General-purpose user I/O bank 5 |
| 引脚 116 | I/O — General-purpose user I/O bank 5 |
| 引脚 117 | GND — Ground |
| 引脚 118 | I/O — General-purpose user I/O bank 5 |
| 引脚 119 | I/O — General-purpose user I/O bank 5 |
| 引脚 120 | VCCIO5 — I/O bank 5 supply voltage |
| 引脚 121 | I/O — General-purpose user I/O bank 5 |
| 引脚 122 | I/O — General-purpose user I/O bank 5 |
| 引脚 123 | I/O — General-purpose user I/O bank 5 |
| 引脚 124 | GND — Ground |
| 引脚 125 | I/O — General-purpose user I/O bank 6 |
| 引脚 126 | I/O — General-purpose user I/O bank 6 |
| 引脚 127 | VCCIO6 — I/O bank 6 supply voltage |
| 引脚 128 | I/O — General-purpose user I/O bank 6 |
| 引脚 129 | I/O — General-purpose user I/O bank 6 |
| 引脚 130 | I/O — General-purpose user I/O bank 6 |
| 引脚 131 | GND — Ground |
| 引脚 132 | I/O — General-purpose user I/O bank 6 |
| 引脚 133 | I/O — General-purpose user I/O bank 6 |
| 引脚 134 | VCCIO6 — I/O bank 6 supply voltage |
| 引脚 135 | I/O — General-purpose user I/O bank 6 |
| 引脚 136 | I/O — General-purpose user I/O bank 6 |
| 引脚 137 | I/O — General-purpose user I/O bank 6 |
| 引脚 138 | GND — Ground |
| 引脚 139 | I/O — General-purpose user I/O bank 6 |
| 引脚 140 | I/O — General-purpose user I/O bank 6 |
| 引脚 141 | TCK — JTAG test clock |
| 引脚 142 | TMS — JTAG test mode select |
| 引脚 143 | TDI — JTAG test data in |
| 引脚 144 | TDO — JTAG test data out |
| 引脚 EP | GND (e-Pad) — Exposed thermal pad - solder to ground pour for thermal dissipation |
典型应用
10M08SCE144C8 适用于 7 应用s: Industrial Motor Control, Low-Volume ASIC Replacement, Sensor Fusion and Data Acquisition Front-End, Video Interface Bridging, LED Driver and Lighting Controllers, I/O Expansion for Legacy Microcontrollers, Edge AI Inference Acceleration Pre-processor.
Industrial Motor Control
The 10M08SCE144C8 is well suited for industrial motor control because its 8K logic elements and 387 Kbits embedded RAM can implement field-oriented control (FOC) state machines, PWM generation, and Hall-sensor decoding for brushless DC and stepper motor drives. The integrated 12-bit 1 Msps ADC samples phase currents and bus voltage directly, eliminating an external ADC IC - a design cost-saving benefit on multi-axis inverter boards. With 101 user I/Os, the device handles multiple PWM channels, encoder feedback, and isolated communication peripherals in a single chip, and the on-die flash enables field firmware updates over industrial protocols.
推荐
Low-Volume ASIC Replacement
The 10M08SCE144C8 functions as a low-NRE ASIC replacement for production runs of 100-10000 units where mask costs of a structured ASIC are prohibitive. The 8K LEs, 387 Kbits RAM, dual PLLs, and 101 I/Os cover the gate-count range of typical glue-logic ASICs from 50K to 200K gates, while the on-die flash allows design revisions without re-spinning silicon. Engineers migrate ASIC netlists through Quartus Prime's synthesis flow, achieving time-to-market savings of 3-6 months over a full ASIC spin and avoiding mask costs of $300K+ for similar density at modern process nodes.
推荐
Sensor Fusion and Data Acquisition Front-End
The 10M08SCE144C8's integrated 12-bit ADC and 101 I/Os make it a natural fit for sensor-fusion front-ends that aggregate I2C/SPI sensor data, perform local filtering, and forward results to a host processor. The ADC supports up to 16 single-ended analog inputs sampled at 1 Msps, capturing temperature, pressure, and current signals simultaneously. Combined with 387 Kbits of embedded RAM for FIFO buffering, the MAX 10 serves as a complete sensor hub that offloads real-time data processing from the main application processor, reducing system BOM by 1-2 ICs.
推荐
Video Interface Bridging
The 10M08SCE144C8 bridges legacy video interfaces (BT.656, RGB parallel, LVDS display) to modern MIPI DSI/CSI-2 sinks, replacing costly video bridge ASICs. Its 387 Kbits embedded memory acts as a video line buffer (one or two video lines of 720p resolution fits comfortably), and 8K LEs handle pixel multiplexing, timing generation, and protocol conversion. The 144-LQFP pin count exposes sufficient I/Os to drive 24-bit parallel RGB plus control signals while receiving a 4-lane MIPI physical layer, with the on-die flash allowing field upgrades as display panels change.
推荐
LED Driver and Lighting Controllers
Architectural and stage lighting systems use the 10M08SCE144C8 as a multi-channel LED controller with per-pixel dimming, gamma correction, and protocol fan-out for DMX512, Art-Net, or sACN inputs. The 101 I/Os drive 30+ LED channels directly with PWM, while 8K LEs implement 16-bit color depth and frame buffering. The commercial 0-85C temperature range covers indoor installations, and the on-die flash supports over-the-air firmware updates over Ethernet for staged-rep lighting programs in venues and outdoor installations.
推荐
I/O Expansion for Legacy Microcontrollers
Designers use the 10M08SCE144C8 as an I/O expander when an existing microcontroller runs out of pins - the FPGA adds 101 user I/Os with custom protocol mapping (PWM, quadrature, UART, SPI bridges) over a single SPI or parallel host interface. With 8K LEs and 387 Kbits RAM, the MAX 10 implements full custom peripherals that an off-the-shelf I/O expander IC cannot match. This is a common application for upgrading legacy 8-bit and 16-bit MCU designs without redesigning the host board, leveraging the MAX 10's instant-on flash configuration.
推荐
Edge AI Inference Acceleration Pre-processor
The 10M08SCE144C8 serves as a pre-processor in edge AI systems where its 8K LEs implement image resize, color-space conversion, and data normalization before forwarding tensors to a host MCU or neural accelerator. Its on-die flash instant-on ensures sub-10 ms boot critical for real-time control loops in robotics and machine vision. While not a neural-network inference engine itself, the device is a strong fit as a sensor and image-format pre-processor in edge AI pipelines, reducing host MCU load by 30-50% versus pure-software implementations.
推荐
推荐产品汇总
工程参考数据： 10M08SCE144C8 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M08SAE144C8G | 10M08SCE144I8 | 10M08SCE144C7 | 10M08SCE144A7 | LCMXO2-4000HE-144MG |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Lattice Semiconductor |
| Package | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP - same |
| Logic Elements | 8000 | 8000 | 8000 | 8000 | 8000 | 4000 (-50%) |
| Embedded Memory (bits) | 387072 | 387072 | 387072 | 387072 | 387072 | 92700 (-76%) |
| User I/Os | 101 | 101 | 101 | 101 | 101 | 114 (+13%) |
| Speed Grade | C8 | C8 | C8 | C7 (faster) | A7 (slower) | HE |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Industrial (-40C to 100C) | Commercial | Commercial | Industrial |
| Integrated ADC | Yes (12-bit, 1 Msps) | Yes | Yes | Yes | Yes | No |
| On-die Configuration Flash | Yes (non-volatile) | Yes | Yes | Yes | Yes | Yes (Flash*Freeze) |
关键差异点
- Integrated 12-bit ADC unique in this density class （对比 LCMXO2-4000HE-144MG)
- 2x logic element density versus 50% in same package （对比 LCMXO2-4000HE-144MG)
- 4x embedded memory versus MachXO2 （对比 LCMXO2-4000HE-144MG)
- On-die flash configuration without external boot device （对比 10M02SCE144I7 (MAX 10 smaller variant))
设计说明
The 144-LQFP Exposed Pad must be soldered to a continuous ground copper pour on the PCB - at minimum 1 square inch of 2 oz copper. Per the Intel MAX 10 EQFP-144 package thermal model, theta_JA drops from ~35 C/W (no e-Pad copper) to ~22 C/W (with recommended copper pour). Estimating junction rise: at 1 W total power dissipation the delta T is 22C above ambient with proper e-Pad soldering but 35C without. Omitting the e-Pad solder connection is a common field-failure root cause.
MAX 10 FPGAs require multiple supply rails: VCCINT (core, typically 1.2V), VCCIO (per-bank, 1.2V-3.3V depending on I/O standard), VCCA (PLL analog, typically 2.5V), and VCCD_PLL (PLL digital). Each bank can run at an independent VCCIO. Decoupling: place one 0.1 uF X7R ceramic per VCC pin within 100 mils of the pin, plus bulk 10-47 uF tantalum or polymer caps per supply rail at the PCB entry. Estimated total bulk capacitance for the E144 package: 6x 10 uF ceramics plus 2x 47 uF polymer caps.
Route all JTAG signals (TCK, TMS, TDI, TDO) with 50-ohm microstrip or stripline and keep them under 2 inches if possible. Add a 4.7k pull-up to TCK, TMS, TDI and a 4.7k pull-up to TDO to prevent floating JTAG during power-up. The e-Pad should be a single contiguous ground pour with thermal vias (8-16 vias in a 3x3 grid, 0.3 mm drill, 0.5 mm pitch) connecting it to inner ground planes. Never route signals under the e-Pad - it creates signal-integrity issues.
Three common pitfalls for MAX 10 designs: (1) Forgetting to power VCCA (PLL supply) - the device will not configure if PLLs are unpowered. (2) Using LVDS signaling without a 100-ohm differential termination near the receiver - this causes signal-integrity failures at >200 Mbps. (3) Configuring MSEL pins incorrectly - MSEL[3:0] select between AS, PS, JTAG, and dual-boot modes; incorrect setting results in configuration failure with no error indicator. Per the Intel MAX 10 configuration handbook, always verify MSEL with the datasheet pinout for your specific OPN.
MAX 10 I/O banks must be powered with the same VCCIO voltage for all pins within a bank - mixing 1.8V and 3.3V pins in one bank is forbidden. Route high-speed differential pairs (LVDS, SSTL) with matched lengths within 25 mils and 90-ohm differential impedance. Use the Quartus Prime pin planner to specify pin assignments and I/O standards; the Fitter will warn about bank-voltage violations. Place configuration-mode pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) close to the device to minimize stubs.
合规信息
RoHS compliant per DigiKey listing. Lead-free reflow profile per JEDEC J-STD-020. Counterfeit threat in open market flagged at 57% by GlobalSpec - source from authorized distributors only.
