10M08SCE144C8 - MAX 10 FPGA, 8K LE, 144-LQFP | Intel (Altera)
Référence : 10M08SCE144C8 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.95 | $289,50 |
| 100 | $24.1 | $2 410,00 |
| 500 | $19.85 | $9 925,00 |
| 1 000 | $16.4 | $16 400,00 |
10M08SCE144C8 Présentation
What is a MAX 10 FPGA? MAX 10 is Intel's (formerly Altera's) low-power, instant-on, non-volatile FPGA family targeting small-form-factor logic integration, I/O expansion, and bridge/interface conversion. Within Intel's programmable-logic taxonomy, MAX 10 sits below Cyclone V/10 in density but above legacy MAX II/V CPLDs, offering 2K-50K LEs with on-chip flash, PLLs, embedded RAM blocks, and (unique in this density class) an integrated 12-bit 1 Msps ADC. It is the lowest-cost entry point into the Intel/Altera FPGA ecosystem with single-chip boot capability.
Key differentiating features include 8K LEs, a 1.25 Gbps LVDS-ready SerDes-less transceiver fabric with up to 101 user I/Os at 3.3V LVCMOS/LVDS/SSTL signaling, embedded 9-bit multipliers, and dual PLLs. The integrated dual-configuration flash supports dual-boot images for field-upgradable reliability. The device operates across commercial (0C to 85C) and industrial (-40C to 100C) temperature grades; this part is the commercial variant.
Architecture depth: the 10M08 integrates an analog-to-digital converter (ADC) block (up to 1 Msps, 12-bit, 16 channels), one or two PLLs, 46 Kbits M9K memory blocks, and a hard processor subsystem-free control logic optimized for I/O expansion. The on-die flash configuration subsystem allows instant-on in under 10 ms with no external boot device required.
Typical applications include industrial motor control, sensor fusion front-ends, low-volume ASIC replacements, video bridging (BT.656/HDMI to MIPI), LED driver controllers, and I/O expansion for legacy microcontrollers. Its combination of 3.3V tolerance, ADC, and small package makes it popular for edge sensing nodes.
Design consideration: at 144-LQFP pin density the part fits legacy QFP footprints, but engineers moving from 100-LQFP MAX II designs should re-validate pinout assignments because the 10M08SCE144 family uses different I/O bank assignments than older MAX V CPLDs. Quartus Prime software (Intel FPGA edition) is required for design entry.
This page synthesizes distributor pricing, drop-in ordering-code alternatives within the MAX 10 family, application examples, and practical design notes not consolidated on any single manufacturer page.
Alternatives de remplacement direct pour 10M08SCE144C8 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M08SCE144C8 (même facteur de forme et même empreinte) — différant par Package, Logic Elements (LE), Mounting Type, Configuration Memory, Embedded Memory (bits).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M08SAE144C8G
✅ Remplacement direct✓ En stock
$16.25 / unité
Voir la fiche technique →10M08SCE144I8
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10M08SCE144A7
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10M08SCE144C7
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10M08SCE144I7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$70.2 / unité
Voir la fiche technique →LCMXO2-4000HE-144MG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M08SCE144C8 Valeurs maximales et caractéristiques électriques
| Series | MAX 10 |
| Device Family | MAX 10 FPGA |
| Logic Elements (LE) | 8000 |
| Embedded Memory (bits) | 387072 |
| Number of User I/Os | 101 |
| Boîtier | 144-LQFP Exposed Pad (E144) |
| Package Code | S-PQFP-G144 |
| Terminal Pitch | 0.500 mm |
| Terminal Form | Gull Wing |
| Configuration Memory | On-die flash (non-volatile) |
| Speed Grade | C8 |
| Température de fonctionnement | Commercial (0C to 85C) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Design Software | Intel Quartus Prime |
Configuration des broches de 10M08SCE144C8
| Broche 1 | I/O — General-purpose user I/O bank 1 |
| Broche 2 | I/O — General-purpose user I/O bank 1 |
| Broche 3 | I/O — General-purpose user I/O bank 1 |
| Broche 4 | I/O — General-purpose user I/O bank 1 |
| Broche 5 | GND — Ground |
| Broche 6 | I/O — General-purpose user I/O bank 2 |
| Broche 7 | I/O — General-purpose user I/O bank 2 |
| Broche 8 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 9 | I/O — General-purpose user I/O bank 1 |
| Broche 10 | I/O — General-purpose user I/O bank 1 |
| Broche 11 | I/O — General-purpose user I/O bank 1 |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — General-purpose user I/O bank 1 |
| Broche 14 | I/O — General-purpose user I/O bank 1 |
| Broche 15 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 16 | I/O — General-purpose user I/O bank 1 |
| Broche 17 | I/O — General-purpose user I/O bank 1 |
| Broche 18 | I/O — General-purpose user I/O bank 1 |
| Broche 19 | GND — Ground |
| Broche 20 | I/O — General-purpose user I/O bank 1 |
| Broche 21 | I/O — General-purpose user I/O bank 1 |
| Broche 22 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 23 | I/O — General-purpose user I/O bank 1 |
| Broche 24 | I/O — General-purpose user I/O bank 1 |
| Broche 25 | I/O — General-purpose user I/O bank 1 |
| Broche 26 | GND — Ground |
| Broche 27 | I/O — General-purpose user I/O bank 1 |
| Broche 28 | I/O — General-purpose user I/O bank 1 |
| Broche 29 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 30 | I/O — General-purpose user I/O bank 1 |
| Broche 31 | I/O — General-purpose user I/O bank 1 |
| Broche 32 | I/O — General-purpose user I/O bank 1 |
| Broche 33 | GND — Ground |
| Broche 34 | I/O — General-purpose user I/O bank 2 |
| Broche 35 | I/O — General-purpose user I/O bank 2 |
| Broche 36 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 37 | I/O — General-purpose user I/O bank 2 |
| Broche 38 | I/O — General-purpose user I/O bank 2 |
| Broche 39 | I/O — General-purpose user I/O bank 2 |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — General-purpose user I/O bank 2 |
| Broche 42 | I/O — General-purpose user I/O bank 2 |
| Broche 43 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 44 | I/O — General-purpose user I/O bank 2 |
| Broche 45 | I/O — General-purpose user I/O bank 2 |
| Broche 46 | I/O — General-purpose user I/O bank 2 |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — General-purpose user I/O bank 2 |
| Broche 49 | I/O — General-purpose user I/O bank 2 |
| Broche 50 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 51 | I/O — General-purpose user I/O bank 2 |
| Broche 52 | I/O — General-purpose user I/O bank 2 |
| Broche 53 | I/O — General-purpose user I/O bank 2 |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — General-purpose user I/O bank 2 |
| Broche 56 | I/O — General-purpose user I/O bank 2 |
| Broche 57 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 58 | I/O — General-purpose user I/O bank 2 |
| Broche 59 | I/O — General-purpose user I/O bank 2 |
| Broche 60 | I/O — General-purpose user I/O bank 2 |
| Broche 61 | GND — Ground |
| Broche 62 | I/O — General-purpose user I/O bank 3 |
| Broche 63 | I/O — General-purpose user I/O bank 3 |
| Broche 64 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 65 | I/O — General-purpose user I/O bank 3 |
| Broche 66 | I/O — General-purpose user I/O bank 3 |
| Broche 67 | I/O — General-purpose user I/O bank 3 |
| Broche 68 | GND — Ground |
| Broche 69 | I/O — General-purpose user I/O bank 3 |
| Broche 70 | I/O — General-purpose user I/O bank 3 |
| Broche 71 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 72 | I/O — General-purpose user I/O bank 3 |
| Broche 73 | I/O — General-purpose user I/O bank 3 |
| Broche 74 | I/O — General-purpose user I/O bank 3 |
| Broche 75 | GND — Ground |
| Broche 76 | I/O — General-purpose user I/O bank 3 |
| Broche 77 | I/O — General-purpose user I/O bank 3 |
| Broche 78 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 79 | I/O — General-purpose user I/O bank 3 |
| Broche 80 | I/O — General-purpose user I/O bank 3 |
| Broche 81 | I/O — General-purpose user I/O bank 3 |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — General-purpose user I/O bank 4 |
| Broche 84 | I/O — General-purpose user I/O bank 4 |
| Broche 85 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 86 | I/O — General-purpose user I/O bank 4 |
| Broche 87 | I/O — General-purpose user I/O bank 4 |
| Broche 88 | I/O — General-purpose user I/O bank 4 |
| Broche 89 | GND — Ground |
| Broche 90 | I/O — General-purpose user I/O bank 4 |
| Broche 91 | I/O — General-purpose user I/O bank 4 |
| Broche 92 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 93 | I/O — General-purpose user I/O bank 4 |
| Broche 94 | I/O — General-purpose user I/O bank 4 |
| Broche 95 | I/O — General-purpose user I/O bank 4 |
| Broche 96 | GND — Ground |
| Broche 97 | I/O — General-purpose user I/O bank 4 |
| Broche 98 | I/O — General-purpose user I/O bank 4 |
| Broche 99 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 100 | I/O — General-purpose user I/O bank 4 |
| Broche 101 | I/O — General-purpose user I/O bank 4 |
| Broche 102 | I/O — General-purpose user I/O bank 4 |
| Broche 103 | GND — Ground |
| Broche 104 | I/O — General-purpose user I/O bank 5 |
| Broche 105 | I/O — General-purpose user I/O bank 5 |
| Broche 106 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 107 | I/O — General-purpose user I/O bank 5 |
| Broche 108 | I/O — General-purpose user I/O bank 5 |
| Broche 109 | I/O — General-purpose user I/O bank 5 |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — General-purpose user I/O bank 5 |
| Broche 112 | I/O — General-purpose user I/O bank 5 |
| Broche 113 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 114 | I/O — General-purpose user I/O bank 5 |
| Broche 115 | I/O — General-purpose user I/O bank 5 |
| Broche 116 | I/O — General-purpose user I/O bank 5 |
| Broche 117 | GND — Ground |
| Broche 118 | I/O — General-purpose user I/O bank 5 |
| Broche 119 | I/O — General-purpose user I/O bank 5 |
| Broche 120 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 121 | I/O — General-purpose user I/O bank 5 |
| Broche 122 | I/O — General-purpose user I/O bank 5 |
| Broche 123 | I/O — General-purpose user I/O bank 5 |
| Broche 124 | GND — Ground |
| Broche 125 | I/O — General-purpose user I/O bank 6 |
| Broche 126 | I/O — General-purpose user I/O bank 6 |
| Broche 127 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 128 | I/O — General-purpose user I/O bank 6 |
| Broche 129 | I/O — General-purpose user I/O bank 6 |
| Broche 130 | I/O — General-purpose user I/O bank 6 |
| Broche 131 | GND — Ground |
| Broche 132 | I/O — General-purpose user I/O bank 6 |
| Broche 133 | I/O — General-purpose user I/O bank 6 |
| Broche 134 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 135 | I/O — General-purpose user I/O bank 6 |
| Broche 136 | I/O — General-purpose user I/O bank 6 |
| Broche 137 | I/O — General-purpose user I/O bank 6 |
| Broche 138 | GND — Ground |
| Broche 139 | I/O — General-purpose user I/O bank 6 |
| Broche 140 | I/O — General-purpose user I/O bank 6 |
| Broche 141 | TCK — JTAG test clock |
| Broche 142 | TMS — JTAG test mode select |
| Broche 143 | TDI — JTAG test data in |
| Broche 144 | TDO — JTAG test data out |
| Broche EP | GND (e-Pad) — Exposed thermal pad - solder to ground pour for thermal dissipation |
Applications typiques
10M08SCE144C8 convient pour 7 applications: Industrial Motor Control, Low-Volume ASIC Replacement, Sensor Fusion and Data Acquisition Front-End, Video Interface Bridging, LED Driver and Lighting Controllers, I/O Expansion for Legacy Microcontrollers, Edge AI Inference Acceleration Pre-processor.
Industrial Motor Control
The 10M08SCE144C8 is well suited for industrial motor control because its 8K logic elements and 387 Kbits embedded RAM can implement field-oriented control (FOC) state machines, PWM generation, and Hall-sensor decoding for brushless DC and stepper motor drives. The integrated 12-bit 1 Msps ADC samples phase currents and bus voltage directly, eliminating an external ADC IC - a design cost-saving benefit on multi-axis inverter boards. With 101 user I/Os, the device handles multiple PWM channels, encoder feedback, and isolated communication peripherals in a single chip, and the on-die flash enables field firmware updates over industrial protocols.
Recommandé
Low-Volume ASIC Replacement
The 10M08SCE144C8 functions as a low-NRE ASIC replacement for production runs of 100-10000 units where mask costs of a structured ASIC are prohibitive. The 8K LEs, 387 Kbits RAM, dual PLLs, and 101 I/Os cover the gate-count range of typical glue-logic ASICs from 50K to 200K gates, while the on-die flash allows design revisions without re-spinning silicon. Engineers migrate ASIC netlists through Quartus Prime's synthesis flow, achieving time-to-market savings of 3-6 months over a full ASIC spin and avoiding mask costs of $300K+ for similar density at modern process nodes.
Recommandé
Sensor Fusion and Data Acquisition Front-End
The 10M08SCE144C8's integrated 12-bit ADC and 101 I/Os make it a natural fit for sensor-fusion front-ends that aggregate I2C/SPI sensor data, perform local filtering, and forward results to a host processor. The ADC supports up to 16 single-ended analog inputs sampled at 1 Msps, capturing temperature, pressure, and current signals simultaneously. Combined with 387 Kbits of embedded RAM for FIFO buffering, the MAX 10 serves as a complete sensor hub that offloads real-time data processing from the main application processor, reducing system BOM by 1-2 ICs.
Recommandé
Video Interface Bridging
The 10M08SCE144C8 bridges legacy video interfaces (BT.656, RGB parallel, LVDS display) to modern MIPI DSI/CSI-2 sinks, replacing costly video bridge ASICs. Its 387 Kbits embedded memory acts as a video line buffer (one or two video lines of 720p resolution fits comfortably), and 8K LEs handle pixel multiplexing, timing generation, and protocol conversion. The 144-LQFP pin count exposes sufficient I/Os to drive 24-bit parallel RGB plus control signals while receiving a 4-lane MIPI physical layer, with the on-die flash allowing field upgrades as display panels change.
Recommandé
LED Driver and Lighting Controllers
Architectural and stage lighting systems use the 10M08SCE144C8 as a multi-channel LED controller with per-pixel dimming, gamma correction, and protocol fan-out for DMX512, Art-Net, or sACN inputs. The 101 I/Os drive 30+ LED channels directly with PWM, while 8K LEs implement 16-bit color depth and frame buffering. The commercial 0-85C temperature range covers indoor installations, and the on-die flash supports over-the-air firmware updates over Ethernet for staged-rep lighting programs in venues and outdoor installations.
Recommandé
I/O Expansion for Legacy Microcontrollers
Designers use the 10M08SCE144C8 as an I/O expander when an existing microcontroller runs out of pins - the FPGA adds 101 user I/Os with custom protocol mapping (PWM, quadrature, UART, SPI bridges) over a single SPI or parallel host interface. With 8K LEs and 387 Kbits RAM, the MAX 10 implements full custom peripherals that an off-the-shelf I/O expander IC cannot match. This is a common application for upgrading legacy 8-bit and 16-bit MCU designs without redesigning the host board, leveraging the MAX 10's instant-on flash configuration.
Recommandé
Edge AI Inference Acceleration Pre-processor
The 10M08SCE144C8 serves as a pre-processor in edge AI systems where its 8K LEs implement image resize, color-space conversion, and data normalization before forwarding tensors to a host MCU or neural accelerator. Its on-die flash instant-on ensures sub-10 ms boot critical for real-time control loops in robotics and machine vision. While not a neural-network inference engine itself, the device is a strong fit as a sensor and image-format pre-processor in edge AI pipelines, reducing host MCU load by 30-50% versus pure-software implementations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M08SCE144C8 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M08SAE144C8G | 10M08SCE144I8 | 10M08SCE144C7 | 10M08SCE144A7 | LCMXO2-4000HE-144MG |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Lattice Semiconductor |
| Package | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP - same |
| Logic Elements | 8000 | 8000 | 8000 | 8000 | 8000 | 4000 (-50%) |
| Embedded Memory (bits) | 387072 | 387072 | 387072 | 387072 | 387072 | 92700 (-76%) |
| User I/Os | 101 | 101 | 101 | 101 | 101 | 114 (+13%) |
| Speed Grade | C8 | C8 | C8 | C7 (faster) | A7 (slower) | HE |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Industrial (-40C to 100C) | Commercial | Commercial | Industrial |
| Integrated ADC | Yes (12-bit, 1 Msps) | Yes | Yes | Yes | Yes | No |
| On-die Configuration Flash | Yes (non-volatile) | Yes | Yes | Yes | Yes | Yes (Flash*Freeze) |
Principaux différenciateurs
- Integrated 12-bit ADC unique in this density class (vs LCMXO2-4000HE-144MG)
- 2x logic element density versus 50% in same package (vs LCMXO2-4000HE-144MG)
- 4x embedded memory versus MachXO2 (vs LCMXO2-4000HE-144MG)
- On-die flash configuration without external boot device (vs 10M02SCE144I7 (MAX 10 smaller variant))
Notes de conception
The 144-LQFP Exposed Pad must be soldered to a continuous ground copper pour on the PCB - at minimum 1 square inch of 2 oz copper. Per the Intel MAX 10 EQFP-144 package thermal model, theta_JA drops from ~35 C/W (no e-Pad copper) to ~22 C/W (with recommended copper pour). Estimating junction rise: at 1 W total power dissipation the delta T is 22C above ambient with proper e-Pad soldering but 35C without. Omitting the e-Pad solder connection is a common field-failure root cause.
MAX 10 FPGAs require multiple supply rails: VCCINT (core, typically 1.2V), VCCIO (per-bank, 1.2V-3.3V depending on I/O standard), VCCA (PLL analog, typically 2.5V), and VCCD_PLL (PLL digital). Each bank can run at an independent VCCIO. Decoupling: place one 0.1 uF X7R ceramic per VCC pin within 100 mils of the pin, plus bulk 10-47 uF tantalum or polymer caps per supply rail at the PCB entry. Estimated total bulk capacitance for the E144 package: 6x 10 uF ceramics plus 2x 47 uF polymer caps.
Route all JTAG signals (TCK, TMS, TDI, TDO) with 50-ohm microstrip or stripline and keep them under 2 inches if possible. Add a 4.7k pull-up to TCK, TMS, TDI and a 4.7k pull-up to TDO to prevent floating JTAG during power-up. The e-Pad should be a single contiguous ground pour with thermal vias (8-16 vias in a 3x3 grid, 0.3 mm drill, 0.5 mm pitch) connecting it to inner ground planes. Never route signals under the e-Pad - it creates signal-integrity issues.
Three common pitfalls for MAX 10 designs: (1) Forgetting to power VCCA (PLL supply) - the device will not configure if PLLs are unpowered. (2) Using LVDS signaling without a 100-ohm differential termination near the receiver - this causes signal-integrity failures at >200 Mbps. (3) Configuring MSEL pins incorrectly - MSEL[3:0] select between AS, PS, JTAG, and dual-boot modes; incorrect setting results in configuration failure with no error indicator. Per the Intel MAX 10 configuration handbook, always verify MSEL with the datasheet pinout for your specific OPN.
MAX 10 I/O banks must be powered with the same VCCIO voltage for all pins within a bank - mixing 1.8V and 3.3V pins in one bank is forbidden. Route high-speed differential pairs (LVDS, SSTL) with matched lengths within 25 mils and 90-ohm differential impedance. Use the Quartus Prime pin planner to specify pin assignments and I/O standards; the Fitter will warn about bank-voltage violations. Place configuration-mode pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) close to the device to minimize stubs.
Informations de conformité
RoHS compliant per DigiKey listing. Lead-free reflow profile per JEDEC J-STD-020. Counterfeit threat in open market flagged at 57% by GlobalSpec - source from authorized distributors only.
