1SG280HH2F55E2VG - Stratix 10 GX FPGA 2.8M Logic 1160 I/O | Altera
料号： 1SG280HH2F55E2VG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $14500 | $14,500.00 |
| 10 | $13800 | $138,000.00 |
| 100 | $12900 | $1,290,000.00 |
| 500 | $12100 | $6,050,000.00 |
| 1,000 | $11400 | $11,400,000.00 |
1SG280HH2F55E2VG 概述
An FPGA is a reprogrammable semiconductor device that implements digital logic through configurable lookup tables, registers, embedded memory blocks, and hard IP blocks such as transceivers and processor subsystems. Within the programmable logic hierarchy, the Stratix 10 GX sits at the high end: FPGA -> programmable logic device -> programmable SoC/system semiconductor, positioned above mid-range families like the Intel Agilex entry tiers and Cyclone families for bandwidth-intensive designs.
Key features include the 14nm process node delivering roughly 2x core performance over previous-generation 20nm FPGAs, embedded 28.3 Gbps (GX family) transceivers for high-speed serial links, and a rich fabric of adaptive logic modules, M20K memory blocks, and hardened DSP blocks for multiply-accumulate intensive processing. The E2 speed grade balances performance and static power, and the extended temperature option indicated by the OPN suffix targets demanding industrial and communications environments.
Architecturally, Stratix 10 uses the second-generation HyperFlex architecture with flip-flops distributed throughout the routing fabric, enabling core clock frequencies well beyond earlier high-end FPGAs and shortening critical paths for data-flow pipelines. The 1SG280 die density places it mid-range within the Stratix 10 GX lineup, offering a strong logic-to-transceiver ratio for protocol bridging, co-processing, and board-level integration.
Typical applications include 5G and wireless baseband, data center acceleration cards, broadcast video infrastructure, high-performance test and measurement instruments, and radar/signal-processing platforms where 1160 I/O and multi-hundred-Gbps serial bandwidth are required.
A key design consideration is power delivery and thermal management: a 2.8M-logic 14nm FPGA in a 2912-ball BGA typically requires multi-rail power sequencing, core-voltage regulators rated for tens of amps, and a thermal solution validated with Intel's power estimation tools before layout sign-off.
This page synthesizes distributor availability, same-family drop-in ordering-part-number alternatives, and practical design notes not consolidated in the manufacturer datasheet.
直接替换替代料： 1SG280HH2F55E2VG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
1SG280HH2F55E1VG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
1SG280HH2F55E3VG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
1SG280HU2F55E2VG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
1SG280HH1F55E2VG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
1SG280HH2F55E2LG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
1SG280HH2F55E2VG 最大额定值与电气特性
| Family | Stratix 10 GX |
| Logic Elements (Cells) | 2800000 |
| User I/O | 1160 |
| Number of Terminals (Balls) | 2912 |
| 封装 | 2912-BBGA, FCBGA |
| Ball Pitch | 1 mm |
| Package Shape | Square |
| Terminal Form | Ball |
| Process Technology | 14 nm FinFET |
| Supply Voltage (Auxiliary) | 1.8 V |
| Speed Grade | E2 |
| Package Code Designator | F55 |
| 安装类型 | Surface Mount |
| Packaging | Tray |
| Programmable Type | In-System Programmable (SRAM-based FPGA) |
1SG280HH2F55E2VG f55 引脚配置指南
1SG280HH2F55E2VG（f55 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 1SG280HH2F55E2VG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
1SG280HH2F55E2VG 适用于 6 应用s: 5G Wireless Baseband and Radio Units, Data Center Acceleration Cards, Broadcast and Pro AV Video Infrastructure, Test and Measurement Instruments, Radar, Electronic Warfare and Signal Intelligence, Industrial Vision and Machine Learning at the Edge.
5G Wireless Baseband and Radio Units
Stratix 10 GX FPGAs are widely deployed in 5G massive-MIMO baseband and remote radio unit designs because the 1SG280's 2.8M logic elements absorb channel coding (LDPC/polar), beamforming math in hardened DSP blocks, and fronthaul framer logic simultaneously. The GX-family multi-gigabit transceivers implement CPRI/eCPRI and 25G Ethernet links at line rate, while the 1160 user I/O connect JESD204B/C data converters and antenna control paths. Running the datapath pipeline with the HyperFlex register-rich fabric allows core clocks well above legacy FPGA baselines, meeting strict latency budgets for TDD slot timing. Thermal design with the F55 2912-ball package and validated power estimation is essential since baseband loads are sustained and continuous.
推荐
Data Center Acceleration Cards
PCIe form-factor accelerator cards use the 1SG280 as a reconfigurable compute engine for search, genomic alignment, financial risk modeling, and AI inference pre/post-processing. The 2.8M logic elements implement wide parallel datapaths, M20K RAMs stage streaming data, and hardened floating-point-capable DSP blocks deliver high TFLOPS-class arithmetic throughput. GX transceivers provide PCIe Gen4-class host connectivity plus 25G/100G Ethernet networking offload on the same die, enabling line-rate streaming architectures that GPUs cannot match for fixed deterministic latency. The E2 speed grade typically closes timing for these pipelines while consuming less static power than E1, improving card-level thermal envelopes in constrained server airflow.
推荐
Broadcast and Pro AV Video Infrastructure
SDI routers, 8K format converters, and vision-processing chassis use the 1SG280HH2F55E2VG to bridge legacy SDI transports to IP-based ST 2110 workflows. The large fabric implements multiple parallel 12G-SDI PHYs, video format converters, scalers, and color-space engines in DSP blocks, while GX transceivers carry 25G Ethernet Media Fabric links. 1160 I/O support many simultaneous video channels with I/O-bank-level voltage flexibility for mixed 3.3V/1.8V/1.2V interfaces. Deterministic sub-frame latency - a hallmark of FPGA pipelines versus CPU/GPU processing - is maintained by pipelining through HyperFlex registers, making the device a fit for live production where dropped frames are unacceptable.
推荐
Test and Measurement Instruments
High-channel-count oscilloscopes, protocol analyzers, and semiconductor test equipment embed the 1SG280 for real-time triggering, data reduction, and protocol decode at multi-hundred-Gbps aggregate rates. The 2.8M-logic fabric processes ADC sample streams in parallel, applying FIR decimation and comparisons faster than any host CPU, while hardened transceivers monitor PCIe/MIPI/Ethernet buses under test. The 1160 general-purpose I/O directly capture parallel bus states, and abundant M20K memory buffers provide deep capture before offload over transceivers. The E2 speed grade generally meets trigger-timing closure, keeping instrument cost lower than E1 builds while the 14nm process controls power in benchtop chassis.
推荐
Radar, Electronic Warfare and Signal Intelligence
Defense radar processors and SIGINT platforms use the 1SG280 to perform pulse compression, FFT-based spectrum sensing, and direction-finding correlation on wideband receiver data. The hardened DSP blocks sustain the multiply-accumulate load of large FFTs across hundreds of channels, while 14nm integration replaces multiple legacy boards with one FCBGA, reducing SWaP (size, weight and power). GX transceivers deliver JESD204B/C links from multi-GSPS ADCs and high-speed backhaul to mission processors. The 2912-ball F55 package supports dense multilayer boards needed for hundreds of controlled-impedance high-speed nets, and the E2 grading balances throughput requirements against the strict power budgets of airborne and vehicle-mounted platforms.
推荐
Industrial Vision and Machine Learning at the Edge
High-end machine-vision controllers and industrial inspection systems apply the 1SG280 for real-time image pre-processing (defect detection, OCR, blob analysis) ahead of host inference. The 2.8M logic elements run convolution kernels and streaming pipeline stages at frame rate with deterministic latency, while DSP blocks accelerate quantized neural-network layers. GX transceivers interface CoaXPress 2.0 cameras and 10G/25G Ethernet to plant networks, and the 1160 I/O drive encoders, lighting strobes, and motion-control interfaces through appropriate I/O standards. The 14nm process and E2 speed grade deliver this throughput within passively cooled industrial enclosures, where fanless reliability across extended temperature ranges is a purchase criterion.
推荐
推荐产品汇总
工程参考数据： 1SG280HH2F55E2VG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 1SG280HH2F55E1VG | 1SG280HH2F55E3VG | 1SG280HU2F55E2VG | 1SG280HH1F55E2VG |
|---|---|---|---|---|---|
| Package | 2912-BBGA, FCBGA (F55), 1 mm pitch | 2912-BBGA, FCBGA (F55) - same | 2912-BBGA, FCBGA (F55) - same | 2912-BBGA, FCBGA (F55) - same | 2912-BBGA, FCBGA (F55) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 2800000 | 2800000 | 2800000 | 2800000 | 2800000 |
| User I/O | 1160 | 1160 | 1160 | 1160 | 1160 |
| Speed Grade | E2 | E1 (faster) | E3 (slower) | E2 | E2 |
| Process Node | 14 nm FinFET | 14 nm FinFET | 14 nm FinFET | 14 nm FinFET | 14 nm FinFET |
| Toolchain | Quartus Prime Pro | Quartus Prime Pro | Quartus Prime Pro | Quartus Prime Pro | Quartus Prime Pro |
关键差异点
- Balanced speed/power operating point （对比 1SG280HH2F55E1VG)
- Maximum timing headroom within the same footprint （对比 1SG280HH2F55E3VG)
- Full default feature set of the 1SG280 family （对比 1SG280HH1F55E2VG)
设计说明
Estimated: a 2.8M-logic Stratix 10 GX under typical full-activity conditions draws tens of amps on the core rail; size the core VRM for peak current from the Intel Early Power Estimator output plus 30% margin, and refine with Quartus Prime power analysis after place-and-route. Implement the Stratix 10 power-up sequencing order (per the device datasheet) with a PMBus sequencer, since out-of-sequence rails can damage the 14nm die. Provide bulk capacitance plus per-rail ceramic decoupling per the Stratix 10 power delivery network (PDN) design guidelines.
The 2912-ball FCBGA with 1 mm pitch requires a high-layer-count PCB (typically 14-22 layers) with via-in-pad or microvia escape routing. Plan breakout for the transceiver banks with controlled-impedance 100-ohm differential pairs, length-matched within the tolerances given in the Stratix 10 pin connection guidelines. Reserve F55 ballout documentation early: I/O bank assignments, reference-clock placement, and transceiver quadrant selection constrain the whole board netlist and are costly to change after routing.
Estimated: at 20-30W+ typical dynamic power, the F55 package needs a bonded heatsink with a calculated theta_CA achieving junction temperatures below the datasheet maximum at worst-case ambient. Verify using the package thermal resistance data in Intel's thermal documentation and the final power report, not estimates. Include a thermal interface material qualified for reflow-adjacent temperatures and consider airflow simulation for convection-limited enclosures; derate for altitude if deployed in airborne platforms.
Do not treat all 1SG280 OPNs as interchangeable: speed grades (E1/E2/E3) and feature suffixes (HH1/HH2/HU2/LN2) encode transceiver count, hard-IP features, and temperature options. Selecting a mismatched replacement compiles in Quartus but may lack required transceiver channels or fail at temperature extremes. Always cross-check the OPN feature code matrix on the Altera product page, and re-run timing sign-off with the replacement OPN's timing models before approving the swap.
合规信息
Compliance data not stated in the retrieved distributor snippets; consult the official Intel/Alterra product compliance page for this OPN.
