Altera

1SG280HH2F55E2VG - Stratix 10 GX FPGA 2.8M Logic 1160 I/O | Altera

Name: 1SG280HH2F55E2VG - Stratix 10 GX FPGA 2.8M Logic 1160 I/O | Altera
Brand: Altera
Price: 11400 USD
Availability: InStock

부품 번호: 1SG280HH2F55E2VG ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

1.8 V Vdss 2912-BBGA, FCBGA Package E2 Speed

시작가 $11400 USD / 개

MOQ: 1 |

가격 업데이트: 2026-10-09

볼륨 가격

수량	단가	합계
1	$14500	$14,500.00
10	$13800	$138,000.00
100	$12900	$1,290,000.00
500	$12100	$6,050,000.00
1,000	$11400	$11,400,000.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

1SG280HH2F55E2VG 개요

The Altera (Intel) 1SG280HH2F55E2VG is a Stratix 10 GX field-programmable gate array (FPGA) with 2,800,000 logic elements (2.8M cells), 1160 user I/O, and Intel 14nm Tri-Gate FinFET technology, housed in a 2912-ball FCBGA (2912-BBGA) package with 1 mm ball pitch operating from a 1.8V auxiliary supply.

An FPGA is a reprogrammable semiconductor device that implements digital logic through configurable lookup tables, registers, embedded memory blocks, and hard IP blocks such as transceivers and processor subsystems. Within the programmable logic hierarchy, the Stratix 10 GX sits at the high end: FPGA -> programmable logic device -> programmable SoC/system semiconductor, positioned above mid-range families like the Intel Agilex entry tiers and Cyclone families for bandwidth-intensive designs.

Key features include the 14nm process node delivering roughly 2x core performance over previous-generation 20nm FPGAs, embedded 28.3 Gbps (GX family) transceivers for high-speed serial links, and a rich fabric of adaptive logic modules, M20K memory blocks, and hardened DSP blocks for multiply-accumulate intensive processing. The E2 speed grade balances performance and static power, and the extended temperature option indicated by the OPN suffix targets demanding industrial and communications environments.

Architecturally, Stratix 10 uses the second-generation HyperFlex architecture with flip-flops distributed throughout the routing fabric, enabling core clock frequencies well beyond earlier high-end FPGAs and shortening critical paths for data-flow pipelines. The 1SG280 die density places it mid-range within the Stratix 10 GX lineup, offering a strong logic-to-transceiver ratio for protocol bridging, co-processing, and board-level integration.

Typical applications include 5G and wireless baseband, data center acceleration cards, broadcast video infrastructure, high-performance test and measurement instruments, and radar/signal-processing platforms where 1160 I/O and multi-hundred-Gbps serial bandwidth are required.

A key design consideration is power delivery and thermal management: a 2.8M-logic 14nm FPGA in a 2912-ball BGA typically requires multi-rail power sequencing, core-voltage regulators rated for tens of amps, and a thermal solution validated with Intel's power estimation tools before layout sign-off.

This page synthesizes distributor availability, same-family drop-in ordering-part-number alternatives, and practical design notes not consolidated in the manufacturer datasheet.

드롭인 대체품: 1SG280HH2F55E2VG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

1SG280HH2F55E1VG

✅ 드롭인 ⚠️ 사양 미검증

📦 2912-BBGA, FCBGA (F55)

Same die/package, faster E1 speed grade (+~10-15% core fmax vs E2), higher static power and price

📋 참조 대체품 (카탈로그에 없음)

1SG280HH2F55E3VG

✅ 드롭인 ⚠️ 사양 미검증

📦 2912-BBGA, FCBGA (F55)

Same die/package, slower E3 speed grade (-~10-15% core fmax vs E2), lower cost

📋 참조 대체품 (카탈로그에 없음)

1SG280HU2F55E2VG

✅ 드롭인 ⚠️ 사양 미검증

📦 2912-BBGA, FCBGA (F55)

Same die/package/E2 speed, different feature-suffix (HU2) indicating different transceiver/power feature option set - verify feature codes before swap

📋 참조 대체품 (카탈로그에 없음)

1SG280HH1F55E2VG

✅ 드롭인 ⚠️ 사양 미검증

📦 2912-BBGA, FCBGA (F55)

Same die/package/E2 speed, HH1 vs HH2 feature suffix denotes reduced hard-IP/transceiver feature set

📋 참조 대체품 (카탈로그에 없음)

1SG280HH2F55E2LG

✅ 드롭인 ⚠️ 사양 미검증

📦 2912-BBGA, FCBGA (F55)

Same die/package/E2, LG vs VG grading suffix (lead-free/material grading variant), verify availability

📋 참조 대체품 (카탈로그에 없음)

1SG280HH2F55E2VG 최대 정격 & 전기적 특성

Family	Stratix 10 GX
Logic Elements (Cells)	2800000
User I/O	1160
Number of Terminals (Balls)	2912
패키지	2912-BBGA, FCBGA
Ball Pitch	1 mm
Package Shape	Square
Terminal Form	Ball
Process Technology	14 nm FinFET
Supply Voltage (Auxiliary)	1.8 V
Speed Grade	E2
Package Code Designator	F55
실장 유형	Surface Mount
Packaging	Tray
Programmable Type	In-System Programmable (SRAM-based FPGA)

1SG280HH2F55E2VG f55 핀 구성 가이드

1SG280HH2F55E2VG(f55 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

다음에 대한 상세 핀아웃 데이터 없음: 1SG280HH2F55E2VG.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

1SG280HH2F55E2VG 적합 용도: 6 애플리케이션s: 5G Wireless Baseband and Radio Units, Data Center Acceleration Cards, Broadcast and Pro AV Video Infrastructure, Test and Measurement Instruments, Radar, Electronic Warfare and Signal Intelligence, Industrial Vision and Machine Learning at the Edge.

🌐

5G Wireless Baseband and Radio Units

Stratix 10 GX FPGAs are widely deployed in 5G massive-MIMO baseband and remote radio unit designs because the 1SG280's 2.8M logic elements absorb channel coding (LDPC/polar), beamforming math in hardened DSP blocks, and fronthaul framer logic simultaneously. The GX-family multi-gigabit transceivers implement CPRI/eCPRI and 25G Ethernet links at line rate, while the 1160 user I/O connect JESD204B/C data converters and antenna control paths. Running the datapath pipeline with the HyperFlex register-rich fabric allows core clocks well above legacy FPGA baselines, meeting strict latency budgets for TDD slot timing. Thermal design with the F55 2912-ball package and validated power estimation is essential since baseband loads are sustained and continuous.

추천

AD9371 (Wideband RF transceiver feeding JESD204B data to the FPGA) 8V79S680 (Low-noise jitter clock for FPGA transceivers) LTC3886 (PMBus digital power regulator for FPGA core rail)

🖥️

Data Center Acceleration Cards

PCIe form-factor accelerator cards use the 1SG280 as a reconfigurable compute engine for search, genomic alignment, financial risk modeling, and AI inference pre/post-processing. The 2.8M logic elements implement wide parallel datapaths, M20K RAMs stage streaming data, and hardened floating-point-capable DSP blocks deliver high TFLOPS-class arithmetic throughput. GX transceivers provide PCIe Gen4-class host connectivity plus 25G/100G Ethernet networking offload on the same die, enabling line-rate streaming architectures that GPUs cannot match for fixed deterministic latency. The E2 speed grade typically closes timing for these pipelines while consuming less static power than E1, improving card-level thermal envelopes in constrained server airflow.

추천

PI3DPX1202A1ZB · Diodes Incorporated TPS53681 (Dual-output multiphase controller for core voltage rail) QSFP28 cage assembly (100G Ethernet front-panel optics interface)

📺

Broadcast and Pro AV Video Infrastructure

SDI routers, 8K format converters, and vision-processing chassis use the 1SG280HH2F55E2VG to bridge legacy SDI transports to IP-based ST 2110 workflows. The large fabric implements multiple parallel 12G-SDI PHYs, video format converters, scalers, and color-space engines in DSP blocks, while GX transceivers carry 25G Ethernet Media Fabric links. 1160 I/O support many simultaneous video channels with I/O-bank-level voltage flexibility for mixed 3.3V/1.8V/1.2V interfaces. Deterministic sub-frame latency - a hallmark of FPGA pipelines versus CPU/GPU processing - is maintained by pipelining through HyperFlex registers, making the device a fit for live production where dropped frames are unacceptable.

추천

LMH1219 (12G-SDI cable driver/equalizer companion) SI5341 (Jitter attenuator for video reference clocks)

🔧

Test and Measurement Instruments

High-channel-count oscilloscopes, protocol analyzers, and semiconductor test equipment embed the 1SG280 for real-time triggering, data reduction, and protocol decode at multi-hundred-Gbps aggregate rates. The 2.8M-logic fabric processes ADC sample streams in parallel, applying FIR decimation and comparisons faster than any host CPU, while hardened transceivers monitor PCIe/MIPI/Ethernet buses under test. The 1160 general-purpose I/O directly capture parallel bus states, and abundant M20K memory buffers provide deep capture before offload over transceivers. The E2 speed grade generally meets trigger-timing closure, keeping instrument cost lower than E1 builds while the 14nm process controls power in benchtop chassis.

추천

ADC12DJ5200RF (Multi-GSPS ADC streaming samples into the FPGA fabric) LMK04832 (Clock distribution/jitter cleaner for synchronous sampling)

✈️

Radar, Electronic Warfare and Signal Intelligence

Defense radar processors and SIGINT platforms use the 1SG280 to perform pulse compression, FFT-based spectrum sensing, and direction-finding correlation on wideband receiver data. The hardened DSP blocks sustain the multiply-accumulate load of large FFTs across hundreds of channels, while 14nm integration replaces multiple legacy boards with one FCBGA, reducing SWaP (size, weight and power). GX transceivers deliver JESD204B/C links from multi-GSPS ADCs and high-speed backhaul to mission processors. The 2912-ball F55 package supports dense multilayer boards needed for hundreds of controlled-impedance high-speed nets, and the E2 grading balances throughput requirements against the strict power budgets of airborne and vehicle-mounted platforms.

추천

AD9680 · Analog Devices TPS7A4701RGWR · Texas Instruments TPS7A4701RGWR · Texas Instruments

🏭

Industrial Vision and Machine Learning at the Edge

High-end machine-vision controllers and industrial inspection systems apply the 1SG280 for real-time image pre-processing (defect detection, OCR, blob analysis) ahead of host inference. The 2.8M logic elements run convolution kernels and streaming pipeline stages at frame rate with deterministic latency, while DSP blocks accelerate quantized neural-network layers. GX transceivers interface CoaXPress 2.0 cameras and 10G/25G Ethernet to plant networks, and the 1160 I/O drive encoders, lighting strobes, and motion-control interfaces through appropriate I/O standards. The 14nm process and E2 speed grade deliver this throughput within passively cooled industrial enclosures, where fanless reliability across extended temperature ranges is a purchase criterion.

추천

NCP3170BDR2G · onsemi PCA9535RGER · Texas Instruments

추천 제품 요약

AD9371 Wideband RF transceiver feeding JESD204B data to the FPGA 사용처: 5G Wireless Baseband and Radio Units 8V79S680 Low-noise jitter clock for FPGA transceivers 사용처: 5G Wireless Baseband and Radio Units LTC3886 PMBus digital power regulator for FPGA core rail 사용처: 5G Wireless Baseband and Radio Units PI3DPX1202A1ZB Diodes Incorporated 사용처: Data Center Acceleration Cards TPS53681 Dual-output multiphase controller for core voltage rail 사용처: Data Center Acceleration Cards QSFP28 cage assembly 100G Ethernet front-panel optics interface 사용처: Data Center Acceleration Cards LMH1219 12G-SDI cable driver/equalizer companion 사용처: Broadcast and Pro AV Video Infrastructure SI5341 Jitter attenuator for video reference clocks 사용처: Broadcast and Pro AV Video Infrastructure ADC12DJ5200RF Multi-GSPS ADC streaming samples into the FPGA fabric 사용처: Test and Measurement Instruments LMK04832 Clock distribution/jitter cleaner for synchronous sampling 사용처: Test and Measurement Instruments AD9680 Analog Devices 사용처: Radar, Electronic Warfare and Signal Intelligence TPS7A4701RGWR Texas Instruments 사용처: Radar, Electronic Warfare and Signal Intelligence, Radar, Electronic Warfare and Signal Intelligence NCP3170BDR2G onsemi 사용처: Industrial Vision and Machine Learning at the Edge PCA9535RGER Texas Instruments 사용처: Industrial Vision and Machine Learning at the Edge

What is the Altera 1SG280HH2F55E2VG FPGA?

The 1SG280HH2F55E2VG is an Intel/Altera Stratix 10 GX FPGA with 2,800,000 logic elements, 1160 user I/O, and a 2912-ball FCBGA package with 1 mm ball pitch. It is fabricated in 14nm FinFET technology and runs from a 1.8V auxiliary supply. According to the Altera product page for this OPN, it belongs to the Stratix 10 GX 1SG280 (F55) device variant family used in high-bandwidth communications and compute applications.

How many logic elements and I/O does the 1SG280HH2F55E2VG have?

The device provides 2,800,000 logic elements (cells) and 1160 user I/O, per DigiKey's listing. The 2912-ball FCBGA package exposes these I/O plus power, ground, configuration, and transceiver pins. This logic density places the 1SG280 in the mid-range of the Stratix 10 GX family, suitable for protocol bridging, baseband processing, and acceleration workloads that need both high fabric capacity and many general-purpose I/O.

What package does the 1SG280HH2F55E2VG use?

The 1SG280HH2F55E2VG uses a 2912-ball fine-pitch BGA (2912-BBGA, FCBGA) with a square body and 1 mm terminal pitch. The 'F55' code in the OPN denotes this package option. Because it is a fine-pitch, high-ball-count BGA, the PCB requires sequential lamination with sufficient signal layers and microvia or via-in-pad technology; rework after assembly is extremely difficult, so pre-production inspection and X-ray verification are strongly recommended.

What is the difference between 1SG280HH2F55E2VG and 1SG280HH2F55E1VG?

Both are Stratix 10 GX 1SG280 devices in the same F55 (2912-ball) package and are pin-compatible; the difference is the speed grade. The E1 suffix indicates a faster timing grade than the E2 part, delivering higher achievable core clock frequencies and transceiver margins at the cost of higher static power and typically higher unit price. Designs meeting timing at E2 can keep the lower-cost E2; timing-critical designs migrating up to E1 require no PCB change.

What is the price of 1SG280HH2F55E2VG?

High-density Stratix 10 devices are premium FPGAs typically quoted above the ten-thousand-dollar range per unit at low volume, with pricing from 5 authorized distributors aggregated on Octopart as of 2026-10-10. XAIPART lists quantity breaks at 1/10/100/500/1000 units with volume discounts. Because pricing for this class of device fluctuates with allocation and configuration, we recommend requesting a formal quote for production quantities rather than relying on listed e-commerce prices.

Where can I buy 1SG280HH2F55E2VG online?

The 1SG280HH2F55E2VG is available through authorized distributors including DigiKey, Mouser, and TrustedParts.com, and through global brokers such as Octopart-listed sellers, Ampheo, Vyrian, and Partstack as of 2026-10-10. DigiKey's listing shows 'buy now, ships today' status for authorized stock. For high-value FPGAs, purchasing from authorized channels is strongly advised to guarantee traceability, since counterfeit risk on gray-market high-end FPGAs is significant.

Is 1SG280HH2F55E2VG in stock and what is the lead time?

Stock status changes frequently for high-end FPGAs. As of the latest distributor check (2026-10-10), DigiKey's listing indicates in-stock, ships-today availability for at least part of the inventory, while Octopart aggregates 5 distributor sources for this MPN. For volume requirements, lead times on Stratix 10 devices can extend to several months due to 14nm wafer allocation; we recommend confirming real-time stock and factory lead time with XAIPART sales before committing to a production schedule.

Is 1SG280HH2F55E2VG the same as a Xilinx equivalent?

No direct pin-compatible cross-brand equivalent exists. The closest architectural competitor to the Stratix 10 GX 1SG280 is the AMD/Xilinx Virtex UltraScale+ family (e.g., VU9P-class devices), but these use entirely different packages, ballouts, and configuration schemes, so migration requires a PCB redesign and RTL/flow changes. According to the cross-reference searches performed, no drop-in cross-brand replacement was found; only pin-compatible Stratix 10 same-family OPN variants can be swapped without board changes.

What is the best drop-in replacement for 1SG280HH2F55E2VG?

The best drop-in replacements are same-family Stratix 10 GX 1SG280 OPNs in the identical F55 2912-ball package, such as the faster-speed-grade 1SG280HH2F55E1VG or other 1SG280 variants differing only in speed grade, temperature grade, or transceiver-count feature set. Because the die and package are identical, these swap with no PCB or footprint change - only bitstream recompilation in Intel Quartus Prime with the new OPN selected. Always verify the transceiver and I/O feature set of the replacement OPN against your design.

Which Altera 1SG280 OPN should I choose over the 1SG280HH2F55E2VG?

Choose a faster speed grade (E1) 1SG280 OPN if your design fails static timing analysis on the E2 device; the same footprint means zero hardware change. Choose an extended-temperature or different feature-suffix OPN (denoted by the HH2/HU2/LN2-style feature codes) if your environment requires wider temperature or different power options. Stay on the E2 when timing closes, since it offers the best balance of cost and static power for the 2.8M-logic 1SG280 die.

Where can I download the 1SG280HH2F55E2VG datasheet PDF?

The authoritative documentation is the Stratix 10 device datasheet and pin-out files available from Altera (Intel). The product-specific page at altera.com for the 1SG280 (F55) OPN links to electrical specifications, packaging attributes, and the Stratix 10 GX device family datasheet PDF. Distributors DigiKey, Mouser, and Ampheo also host datasheet PDF download links for this MPN. Pinout files are distributed per-package (F55) rather than per-OPN, since all 1SG280 F55 parts share the same 2912-ball ballout.

What are the key specifications of the 1SG280HH2F55E2VG engineers should know?

Key specifications: Stratix 10 GX family, 2,800,000 logic elements, 1160 user I/O, 2912-ball FCBGA (F55) with 1 mm pitch, 14nm FinFET process, 1.8V auxiliary supply, E2 speed grade, tray packaging. The GX family adds multi-gigabit serial transceivers for PCI Express, Ethernet, and CPRI protocols. These parameters come from the DigiKey and Altera product listings for this OPN and define the device's fit for high-bandwidth wired communications and compute-acceleration designs.

How should power be designed for the 1SG280HH2F55E2VG?

Plan a multi-rail power tree (core, auxiliary, transceiver, I/O banks) with the core rail rated for tens of amps, and use the Intel Early Power Estimator and final Quartus Prime power analysis to size regulators and thermal solutions. The 1.8V auxiliary input shown in listings is only one of several rails the BGA requires. Power-up sequencing per the Stratix 10 datasheet is mandatory to avoid latch-up; use power-supply supervisors or sequencers and validate junction temperature with the F55 package thermal resistance data before layout sign-off.

What tools are used to develop for the Stratix 10 1SG280HH2F55E2VG?

Development uses Intel Quartus Prime Pro Edition software, which is the only toolchain supporting Stratix 10 synthesis, place-and-route, timing analysis, and bitstream generation. The target OPN (1SG280HH2F55E2VG) must be selected during new-project setup so the fitter uses the correct E2 speed-grade timing models. Simulation, SoC/embedded flows, and transceiver IP (PCIe, 100G Ethernet, JESD204) are delivered through Quartus and the Intel FPGA IP catalog; no third-party toolchain synthesizes for Stratix 10.

엔지니어링 참조 데이터: 1SG280HH2F55E2VG — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the 1SG280HH2F55E2VG when your design needs 2.8M logic elements, 1160 I/O, and GX-family serial transceivers with a balanced speed grade - the typical choice for 5G baseband, data center acceleration, and high-end test instruments. If Quartus timing closure fails on E2, move to 1SG280HH2F55E1VG: identical 2912-ball F55 footprint, no PCB change, only faster timing models and higher cost/power. If cost pressure dominates and timing closes easily, 1SG280HH2F55E3VG saves budget on the same die. For different transceiver or temperature feature requirements, compare HU2/HH1/LN2-suffixed OPNs against the Altera feature matrix - all remain drop-in on the same board. A cross-brand move to Xilinx Virtex UltraScale+ only makes sense for new designs, since no pin-compatible alternative exists and migration requires a full PCB redesign.

대체품과의 비교

파라미터	이 제품	1SG280HH2F55E1VG	1SG280HH2F55E3VG	1SG280HU2F55E2VG	1SG280HH1F55E2VG
Package	2912-BBGA, FCBGA (F55), 1 mm pitch	2912-BBGA, FCBGA (F55) - same	2912-BBGA, FCBGA (F55) - same	2912-BBGA, FCBGA (F55) - same	2912-BBGA, FCBGA (F55) - same
Brand	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
Logic Elements	2800000	2800000	2800000	2800000	2800000
User I/O	1160	1160	1160	1160	1160
Speed Grade	E2	E1 (faster)	E3 (slower)	E2	E2
Process Node	14 nm FinFET	14 nm FinFET	14 nm FinFET	14 nm FinFET	14 nm FinFET
Toolchain	Quartus Prime Pro	Quartus Prime Pro	Quartus Prime Pro	Quartus Prime Pro	Quartus Prime Pro

주요 차별점

Balanced speed/power operating point (vs 1SG280HH2F55E1VG)
Maximum timing headroom within the same footprint (vs 1SG280HH2F55E3VG)
Full default feature set of the 1SG280 family (vs 1SG280HH1F55E2VG)

설계 노트

Estimated: a 2.8M-logic Stratix 10 GX under typical full-activity conditions draws tens of amps on the core rail; size the core VRM for peak current from the Intel Early Power Estimator output plus 30% margin, and refine with Quartus Prime power analysis after place-and-route. Implement the Stratix 10 power-up sequencing order (per the device datasheet) with a PMBus sequencer, since out-of-sequence rails can damage the 14nm die. Provide bulk capacitance plus per-rail ceramic decoupling per the Stratix 10 power delivery network (PDN) design guidelines.

The 2912-ball FCBGA with 1 mm pitch requires a high-layer-count PCB (typically 14-22 layers) with via-in-pad or microvia escape routing. Plan breakout for the transceiver banks with controlled-impedance 100-ohm differential pairs, length-matched within the tolerances given in the Stratix 10 pin connection guidelines. Reserve F55 ballout documentation early: I/O bank assignments, reference-clock placement, and transceiver quadrant selection constrain the whole board netlist and are costly to change after routing.

Estimated: at 20-30W+ typical dynamic power, the F55 package needs a bonded heatsink with a calculated theta_CA achieving junction temperatures below the datasheet maximum at worst-case ambient. Verify using the package thermal resistance data in Intel's thermal documentation and the final power report, not estimates. Include a thermal interface material qualified for reflow-adjacent temperatures and consider airflow simulation for convection-limited enclosures; derate for altitude if deployed in airborne platforms.

Do not treat all 1SG280 OPNs as interchangeable: speed grades (E1/E2/E3) and feature suffixes (HH1/HH2/HU2/LN2) encode transceiver count, hard-IP features, and temperature options. Selecting a mismatched replacement compiles in Quartus but may lack required transceiver channels or fail at temperature extremes. Always cross-check the OPN feature code matrix on the Altera product page, and re-run timing sign-off with the replacement OPN's timing models before approving the swap.