5CEBA2U15I7 - Cyclone V E FPGA, 25K LE, 324-BGA | Intel
料号： 5CEBA2U15I7 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $121.75 | $12,175.00 |
| 500 | $109.8 | $54,900.00 |
| 1,000 | $98.4 | $98,400.00 |
5CEBA2U15I7 概述
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks (LCLBs), programmable interconnect, and dedicated hard IP such as transceivers, PLLs, and memory controllers. FPGAs sit at the top of the digital logic hierarchy: ASIC -> CPLD -> FPGA -> programmable SoC, and are widely used for parallel processing, hardware acceleration, and glue logic in applications where time-to-market, reprogrammability, and high I/O density outweigh the per-unit cost of an ASIC. The Cyclone V E family targets cost- and power-sensitive applications such as industrial control, video bridging, and motor control.
Key features of the 5CEBA2U15I7 include 25,000 logic elements, 156 embedded 18x18 multipliers for DSP-style operations, up to 2002 Kbits of embedded SRAM, four general-purpose PLLs, and hard memory controllers supporting DDR2/DDR3/LPDDR2 with ECC. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards on the 176 user I/O pins, and integrates a Configuration via JTAG or Active Serial (AS) flash. Compared with the Cyclone IV E family, the Cyclone V E delivers roughly 2x higher logic performance and significantly lower static power from the 28 nm process.
Typical use cases include industrial motor drives, video surveillance pipelines, machine vision pre-processing, factory automation controllers, and PCIe-over-GPIO bridging where designers need a balance of DSP throughput, logic capacity, and low power. Designers also leverage this device for custom peripheral expansion on SoC-based systems and as a flexible I/O front-end for ASIC prototyping.
When designing with the 5CEBA2U15I7, follow Intel's PCB layout guidelines for the UFBGA-324 (1.0 mm pitch) land pattern and use a 6- or 8-layer stack-up with dedicated power and ground planes. The device requires 0.9 V, 1.1 V, 2.5 V, and 3.3 V supplies; use the Altera/Intel PowerPlay Early Power Estimator (EPE) spreadsheet to size decoupling and predict junction temperature before committing to layout.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes drawn from Cyclone V datasheets and Altera/Intel application notes, providing information not found in the manufacturer datasheet alone.
直接替换替代料： 5CEBA2U15I7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CEBA2U15I7 （相同外形与封装尺寸） ——差异在于 Embedded 18x18 Multipliers, Embedded Memory, Package, Process Technology, User I/O Pins.
快速对比工具——选择替代料号进行并排对比：
该产品暂无直接替换替代料。
请求替代料5CEBA2U15I7 最大额定值与电气特性
| Family | Cyclone V E |
| Logic Elements (LE) | 25,000 |
| Embedded Memory | 2002 Kbits |
| Embedded 18x18 Multipliers | 156 |
| User I/O Pins | 176 |
| 工作温度 | -40C to +100C (Industrial, 'I' suffix) |
| Core Voltage | 1.1 V |
| Process Technology | 28 nm TSMC low-power |
| 封装 | 324-ball UFBGA / 324-LFBGA |
| PLLs | 4 |
| Memory Controllers | DDR2/DDR3/LPDDR2 with ECC |
| Configuration Modes | JTAG, Active Serial (AS) |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount (BGA) |
| Speed Grade | 7 |
5CEBA2U15I7 324-ball ufbga / 324-lfbga 引脚配置指南
5CEBA2U15I7（324-ball ufbga / 324-lfbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CEBA2U15I7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CEBA2U15I7 适用于 6 应用s: Industrial Motor Control, Video Surveillance Pipelines, Machine Vision Pre-Processing, Industrial Communication Bridges, ASIC Prototyping Platform, Custom Peripheral Expansion for SoCs.
Industrial Motor Control
The 5CEBA2U15I7 fits industrial motor control because its 156 embedded 18x18 multipliers deliver the throughput required for field-oriented control (FOC) loops on three-phase BLDC and PMSM motors, while 176 user I/Os expose enough channels for incremental encoder, Hall sensor, and multi-axis PWM feedback. With hard DDR3 controllers and 2002 Kbits of embedded memory, the FPGA can buffer current-loop sample streams at 50-100 kHz without external SRAM. The Cyclone V E industrial temperature grade (-40C to +100C) and 28 nm low-power process keep junction temperature manageable in sealed IP54/IP67 drive enclosures.
推荐
Video Surveillance Pipelines
The 5CEBA2U15I7 suits video surveillance bridge applications because its 176 user I/Os accept parallel BT.656, MIPI-CSI2 (with external PHY), or LVDS video streams from cameras, while 25,000 logic elements handle Bayer-to-YUV color conversion, scaling, and motion-detection preprocessing before forwarding frames over Gigabit Ethernet. The hard DDR3 controller with ECC buffers frame buffers at 720p60 without data corruption, and 156 18x18 multipliers accelerate 2D convolution kernels for noise reduction. Industrial temperature grade ensures 24/7 outdoor NVR operation.
推荐
Machine Vision Pre-Processing
The 5CEBA2U15I7 fits machine vision front-ends because its 25,000 logic elements run Sobel, Laplacian, and Gaussian convolution filters at line-scan camera rates (up to 80 MHz), while the DDR3 controller buffers full-resolution frames for downstream SoC or CPU-based classification. With 156 18x18 multipliers, the FPGA delivers up to 12.5 GMACS of DSP throughput at moderate clock rates, sufficient for 1-3 megapixel industrial cameras. Industrial temperature rating suits factory floor installations.
推荐
Industrial Communication Bridges
The 5CEBA2U15I7 works as a flexible industrial communication bridge because its 176 user I/Os interface simultaneously to Ethernet PHYs, RS-485/RS-422 transceivers, CAN-FD controllers, and SPI/QSPI peripherals, while the 25,000 logic elements implement Profinet, EtherCAT, or Modbus-TCP slaves in firmware. The hard DDR3 controller supports frame buffering for PROFINET IRT (isochronous real-time) traffic, and the four PLLs derive independent clocks for each protocol domain. Industrial temperature grade covers harsh factory automation environments.
推荐
ASIC Prototyping Platform
The 5CEBA2U15I7 functions as an ASIC prototyping substrate because its 25,000 logic elements can map hundreds of thousands of ASIC gates, while 176 user I/Os expose enough test points for chip-level bring-up. With hard memory controllers, engineers can prototype DDR3 interfaces before taping out, and 156 18x18 multipliers validate DSP blocks at full clock speed. The Quartus Prime design suite from Intel supports synthesized ASIC netlists and TLF-based timing constraints.
推荐
Custom Peripheral Expansion for SoCs
The 5CEBA2U15I7 supplements SoC-based designs as a peripheral expansion chip because its 176 user I/Os accept legacy or specialty interfaces that the SoC does not expose natively, while 25,000 logic elements implement custom DMA engines, glue logic, or accelerator blocks. The hard DDR3 controller can serve as a shared external memory for both SoC and FPGA in heterogeneous architectures, and four PLLs generate domain-crossing clocks for inter-chip handshaking.
推荐
推荐产品汇总
工程参考数据： 5CEBA2U15I7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CEBA2F17I7N |
|---|---|---|
| Brand | Intel (formerly Altera) | Intel |
| Family | Cyclone V E | Cyclone V E |
| Package | 324-ball UFBGA / 324-LFBGA | FBGA-484 (different footprint) |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory | 2002 Kbits | 2002 Kbits |
| User I/O Pins | 176 | 224 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial |
| Speed Grade | 7 | 7 |
| Embedded 18x18 Multipliers | 156 | 156 |
| Process Technology | 28 nm TSMC low-power | 28 nm TSMC low-power |
关键差异点
- Optimal balance of logic density, I/O count, and package size for cost-sensitive industrial designs （对比 5CEBA2F17I7N)
- Industrial temperature grade certified at the silicon level for harsh environments （对比 5CEBA2U15C8 (commercial grade))
设计说明
The 5CEBA2U15I7 requires four supply rails: VCCINT (1.1 V core), VCCA (2.5 V PLL analog), VCCIO (1.2-3.3 V per bank), and VCCPD (2.5/3.3 V configuration). Use Intel's PowerPlay Early Power Estimator (EPE) spreadsheet before PCB commitment to size decoupling and predict junction temperature. Estimated: at 50 percent toggle rate and 100 MHz logic speed, the device dissipates approximately 1.0-1.5 W; the UFBGA-324 thermal resistance (theta_JA) requires a minimum 4-layer stack-up with a dedicated ground plane for thermal dissipation.
The 324-ball UFBGA / LFBGA package uses a 1.0 mm ball pitch requiring laser-drilled microvia PCB technology for inner-row escape routing. Per Intel AN 583 (Designing with Fine-Pitch BGA Packages), use a 6- or 8-layer stack-up with HDI microvias (8-mil pad, 4-mil drill), fan-out routing on inner layers, and a continuous ground plane directly beneath the BGA. Leave at least 1.0 mm of copper pour around the package perimeter for thermal spreading.
Place decoupling capacitors as close as possible to each supply ball: 0.1 uF X7R per VCCINT/VCCIO ball, plus 4.7 uF bulk capacitors every 10-15 balls. According to the Cyclone V pin connection guidelines, leave unused I/O pins configured as input tri-stated with weak pull-up enabled to avoid floating input oscillations that consume unnecessary power and can inject noise into adjacent banks.
Do not connect VCCA (PLL analog supply) directly to VCCINT or VCCA_FPLL without an LC filter (typically 2.2 uH inductor and 10 uF + 0.1 uF capacitors) - this is a common design mistake that introduces PLL jitter. The configuration pins (MSEL0/MSEL1) must be tied to VCCPD or GND through 1-10 kohm resistors to select Active Serial or JTAG mode at power-up. Estimated: missing MSEL pull resistors are a top cause of first-board bring-up failures.
合规信息
RoHS and lead-free compliant per distributor product pages (DigiKey 5226611). REACH compliance status confirmed by Altera/Intel product documentation. Not AEC-Q100 qualified (industrial-grade FPGAs are not automotive-qualified unless explicitly listed in the -Q suffix ordering code).
