10CX105YF672I6G - Cyclone 10 GX FPGA, 105K LE, 672-BGA | Intel
料号： 10CX105YF672I6G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $405 | $4,050.00 |
| 100 | $372 | $37,200.00 |
| 250 | $355 | $88,750.00 |
| 500 | $338 | $169,000.00 |
10CX105YF672I6G 概述
A Field Programmable Gate Array (FPGA) is a class of programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O protocols after PCB fabrication. Cyclone 10 GX FPGAs are positioned in Intel's mid-range portfolio for cost-sensitive applications requiring integrated transceivers (up to 12.5 Gbps), hard PCIe Gen2 controllers, and a rich DSP block fabric. They occupy a tier between low-power Cyclone 10 LP parts and high-end Stratix 10 devices, balancing logic density against power and unit cost.
Key features of the 10CX105YF672I6G include a 105K LE fabric optimized for parallel processing pipelines, hard memory controllers for DDR3/DDR4/LPDDR3 external memory interfaces, up to 3.75 Gbps LVDS-capable GPIO, and embedded PCI Express Gen2 x4 hard IP. The 672-pin FCBGA package exposes 236 general-purpose I/Os and 12 transceiver channels for high-speed serial connectivity. Configuration is supported via JTAG, AS, PS, and FPP modes through dedicated configuration pins.
Typical applications include industrial machine vision, video broadcasting, factory automation controllers, low-cost 10G Ethernet aggregation, software-defined radio front-ends, and PCIe-based accelerator cards. The combination of transceiver channels, hard PCIe cores, and DSP blocks makes it a versatile fabric for protocol bridging and parallel compute offload. The industrial temperature grade supports deployment in factory floor and outdoor enclosures without additional thermal derating.
When designing with the 10CX105YF672I6G, ensure PCB design follows Intel's FCBGA land pattern and high-speed transceiver routing guidelines. Power supply sequencing requires careful ramp coordination between core and I/O rails to avoid in-rush current damage. Use Intel Quartus Prime software for synthesis, place-and-route, and bitstream generation. Thermal management relies primarily on PCB copper and forced airflow; the package does not integrate a discrete heatsink.
This page synthesizes distributor pricing, drop-in Cyclone 10 GX alternatives, and PCB layout considerations not consolidated on the manufacturer product page. All specifications are sourced from the verified Intel/Altera Cyclone 10 GX device datasheet and current distributor listings as of 2026-09-05.
直接替换替代料： 10CX105YF672I6G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10CX105YF672I6G （相同外形与封装尺寸） ——差异在于 Package, Logic Elements (LE), Operating Temperature, Adaptive Logic Modules (ALM), Speed Grade.
快速对比工具——选择替代料号进行并排对比：
10CX105YF672I5G
✅ 直接替换✓ 有现货
$108 / 个
查看数据手册 →10CX105YF672E6G
✅ 直接替换✓ 有现货
$100.547 / 个
查看数据手册 →10CX105YF672E5G
✅ 直接替换✓ 有现货
$310 / 个
查看数据手册 →10CX085YF672I6G
✅ 直接替换✓ 有现货
$255 / 个
查看数据手册 →10CX150YF672I5G
✅ 直接替换✓ 有现货
$278.4 / 个
查看数据手册 →10CX105YF672I6G 最大额定值与电气特性
| Series | Cyclone® 10 GX |
| Logic Elements (LE) | 104,000 |
| Adaptive Logic Modules (ALM) | 3,800 ALM |
| Embedded Memory | 7.46 Mbit |
| Embedded Memory Bits | 8,641,536 bits |
| Number of User I/Os | 236 |
| 封装 | 672-BBGA, FCBGA (F672) |
| 安装类型 | Surface Mount |
| Operating Supply Voltage (Core) | 900 mV |
| 工作温度 | -40°C to +85°C (Industrial) |
| Temperature Grade | Industrial (I) |
| Speed Grade | 6 |
| Process Technology | TSMC 20 nm |
| Lead Free / RoHS | Yes (RoHS compliant) |
| Configuration Method | JTAG / AS / PS / FPP |
10CX105YF672I6G 672-bbga, fcbga (f672) 引脚配置指南
10CX105YF672I6G（672-bbga, fcbga (f672) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10CX105YF672I6G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10CX105YF672I6G 适用于 6 应用s: Industrial Machine Vision, Video Broadcasting and Encoding, Factory Automation Controllers, 10 Gigabit Ethernet Aggregation, Software-Defined Radio Front-Ends, PCIe-Based Accelerator Cards.
Industrial Machine Vision
The 10CX105YF672I6G is well-suited for industrial machine vision systems requiring real-time image processing on multiple parallel video streams. With 104K logic elements, 3,800 ALMs, and 12 transceiver channels up to 12.5 Gbps, the FPGA can ingest data from MIPI CSI-2, Camera Link, or CoaXPress sensors while running pipeline-parallel image processing (filtering, blob detection, optical flow). The industrial -40°C to +85°C temperature grade allows deployment in factory floor enclosures without active thermal management beyond PCB copper. Its 236 user I/Os support multiple parallel sensor interfaces simultaneously, while the hard PCIe Gen2 x4 IP enables host-side data transfer with minimal CPU overhead. Compared to discrete GPU solutions, this FPGA offers deterministic latency critical for vision-based quality control in high-speed production lines.
推荐
Video Broadcasting and Encoding
Broadcast video encoding applications (e.g., JPEG2000, H.264, HEVC mezzanine compression) benefit from the 10CX105YF672I6G's combination of logic density, DSP blocks, and serial transceiver channels. The 12 transceivers support SDI (3G/12G-SDI over coax), HDMI 2.0 bridging, or 10 Gigabit Ethernet for IP-based video transport. Hard PCIe Gen2 enables direct host offload in server-class encoders. The 105K LE fabric comfortably hosts multiple encoder cores, audio embedding, and ancillary data processing simultaneously. Industrial temperature rating supports operation in outdoor broadcast trucks and stadium control rooms. Power consumption is significantly lower than equivalent Stratix 10 implementations, fitting the cost-sensitive mid-tier of the broadcast equipment market where the 10CX105YF672I6G's price point is competitive.
推荐
Factory Automation Controllers
Programmable logic controllers and industrial Ethernet gateways leverage the 10CX105YF672I6G to consolidate multiple industrial protocols (EtherCAT, PROFINET, EtherNet/IP) onto a single FPGA fabric. Its 104K logic elements can host multiple industrial slave stacks concurrently, while the 236 user I/Os handle real-time digital I/O, encoder feedback, and motor control PWM. The industrial -40°C to +85°C temperature grade is mandatory for factory cabinet deployment. The 12 transceiver channels support multiple GbE links or one 10G uplinks to supervisory networks. Compared to multi-chip solutions, this single FPGA reduces BOM count, simplifies firmware qualification, and provides deterministic sub-microsecond latency required for closed-loop servo control. The hard PCIe Gen2 IP also enables compact vision-in-the-loop and edge analytics integration.
推荐
10 Gigabit Ethernet Aggregation
The 10CX105YF672I6G is ideal for low-cost 10 Gigabit Ethernet aggregation switches and protocol converters at the network edge. Its 12 transceiver channels support up to six 10G SFP+ uplinks or twelve 1G SFP ports with line-rate processing. The hard PCIe Gen2 x4 IP allows tight integration with host CPUs or SoCs in hybrid switching platforms. With 7.46 Mbit of embedded memory, the device can buffer multiple 10G line-rate streams while running MAC, VLAN, and basic ACL processing in fabric. Industrial temperature grade suits outdoor telecom cabinets and small-cell backhaul applications. The cost/performance point positions this FPGA between discrete PHY/MCU solutions and full merchant switch silicon, ideal for custom OEM networking equipment with mixed layer-2/3 functionality.
推荐
Software-Defined Radio Front-Ends
Software-defined radio (SDR) platforms leverage the 10CX105YF672I6G's transceiver channels and DSP blocks for digital down-conversion, channelization, and baseband processing. The 12 transceivers up to 12.5 Gbps can digitize wide-band RF signals directly from high-speed ADCs, supporting LTE, 5G NR sub-6, and proprietary waveform protocols. The 104K logic elements host multiple DDC/DUC chains, channel filters, and FFT cores. Hard PCIe Gen2 x4 enables direct connection to host processors for protocol stack implementation. The industrial temperature grade supports outdoor SDR deployments (private LTE base stations, military communications, spectrum monitoring). Compared to dedicated DSP processors, this FPGA offers 5-10x higher sample-rate throughput at comparable power, while providing flexibility to support evolving waveforms.
推荐
PCIe-Based Accelerator Cards
The 10CX105YF672I6G's hard PCIe Gen2 x4 IP makes it a strong choice for low-cost accelerator cards targeting financial computing, genomics, machine learning inference, and database acceleration. The 105K logic elements can host custom compute pipelines (e.g., Smith-Waterman alignment, AES encryption, neural-network inference engines) that offload work from host CPUs. The 12 transceivers support both the PCIe link and additional high-speed I/O to host (DMA) or to other cards (peer-to-peer). Industrial temperature rating supports server-room and edge data center deployment. Compared to GPU accelerators, this FPGA offers deterministic latency and significantly lower power per operation for fixed-function workloads. The 7.46 Mbit embedded memory is sufficient for caching intermediate results in streaming pipelines.
推荐
推荐产品汇总
工程参考数据： 10CX105YF672I6G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10CX105YF672I5G | 10CX105YF672E6G | 10CX105YF672E5G | 10CX085YF672I6G | 10CX150YF672I5G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BBGA, FCBGA (F672) | 672-BBGA, FCBGA (F672) - same | 672-BBGA, FCBGA (F672) - same | 672-BBGA, FCBGA (F672) - same | 672-BBGA, FCBGA (F672) - same | 672-BBGA, FCBGA (F672) - same |
| Logic Elements | 104,000 LE | 104,000 LE - same | 104,000 LE - same | 104,000 LE - same | 85,000 LE (-19%) | 150,000 LE (+44%) |
| Speed Grade | -6 | -5 (faster) | -6 - same | -5 (faster) | -6 - same | -5 (faster) |
| Temperature Grade | Industrial (-40°C to +85°C) | Industrial - same | Enhanced (E) | Enhanced (E) | Industrial - same | Industrial - same |
| Embedded Memory | 7.46 Mbit | 7.46 Mbit - same | 7.46 Mbit - same | 7.46 Mbit - same | 6.62 Mbit | 8.47 Mbit |
| User I/Os | 236 | 236 - same | 236 - same | 236 - same | 236 - same | 236 - same |
| RoHS / Lead-Free | Yes (RoHS compliant) | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
关键差异点
- Higher logic density than 10CX085 family variants （对比 10CX085YF672I6G)
- Industrial temperature grade at -6 speed grade （对比 10CX105YF672E6G)
- Lower cost than 10CX150 family variants （对比 10CX150YF672I5G)
设计说明
The 672-ball FCBGA package requires a high-density PCB with 1.0 mm ball pitch and matched-impedance traces for the transceiver channels. Intel provides reference PCB stack-ups in the Cyclone 10 GX Hardware Reference Manual. Use 0.5 oz copper in the core and 1 oz on outer layers; 6-8 layer stack-up is recommended. Decoupling requires 10-22 μF bulk + 0.1 μF + 1 nF per power pin per Intel's pin connection guidelines.
Estimated: at typical Cyclone 10 GX utilization (60% LEs, 80% transceivers active), core power is approximately 4-6 W. The FCBGA package has a θJA of approximately 14-18 °C/W with adequate PCB thermal vias and copper pour. Industrial temperature design must keep junction below 85°C ambient; recommend 200-400 LFM airflow or large thermal copper pad with 25-50 thermal vias under the BGA.
Do not mix core and I/O power ramp sequences arbitrarily - Intel requires specific power sequencing (VCC core first, then VCCIO, then transceivers) per AN692. The MSEL[2:0] pins must be set correctly to select the configuration mode (JTAG/AS/PS/FPP) at board reset. Differential transceiver channels require DC-blocking capacitors and matched-length routing within 0.025 mm tolerance. Misconfigured MSEL or missing reference-clock termination is a common first-prototype failure.
合规信息
RoHS compliant per 'G' suffix in MPN. Lead-free FCBGA assembly. AEC-Q100 not applicable for FPGAs. Halogen-free status not confirmed in verified data - set to 'unknown'.
