A3P1000-FG484M - 1M-Gate ProASIC3 Flash FPGA | Microchip
料号： A3P1000-FG484M ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.2 | $632.00 |
| 100 | $57.8 | $5,780.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $47.95 | $47,950.00 |
A3P1000-FG484M 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) and programmable interconnects that designers configure in the field. The ProASIC3 family sits within the broader FPGA hierarchy as a nonvolatile, flash-based alternative to SRAM FPGAs, eliminating the need for external configuration PROM and enabling true single-chip, secure, instant-on system solutions.
Key features include one million system gates (15 k to 1 M system gate family range), up to 144 kbits of true dual-port SRAM, a maximum system frequency of 231 MHz, and 130 nm flash-based fabrication technology. Because configuration data resides in on-chip flash cells, the device powers up instantly without a boot sequence and offers inherent resistance to bit-stream interception - a key advantage over SRAM FPGAs.
The A3P1000 fabric is organized as 24,576 CLBs and supports the Optimal Soft ARM core option, allowing embedded processor integration. Four I/O banks with dedicated VCCIBx supplies support mixed-voltage I/O standards, so only I/Os with compatible voltage standards should be assigned to the same bank. Industrial temperature operation from -55C to +125C suits harsh-environment deployments.
Typical applications include industrial automation, communications infrastructure, aerospace and defense control logic, medical instrumentation, and secure embedded systems where single-chip, reprogrammable logic with instant-on startup is required.
Design consideration: plan I/O bank assignments early, since VCCIBx pins route through dedicated banks and mixed-voltage assignments constrain floorplanning. Microchip application note on ProASIC3 migration from higher-density to mid-density devices documents bank-level constraints.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3P1000-FG484M ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3P1000-FG484M （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Package / Case, Technology, Total RAM Bits.
快速对比工具——选择替代料号进行并排对比：
A3P1000-2FG484M
✅ 直接替换✓ 有现货
$40.5 / 个
查看数据手册 →A3P1000-1FGG484T
✅ 直接替换✓ 有现货
$33.9 / 个
查看数据手册 →A3P1000-2FGG484M
✅ 直接替换✓ 有现货
$75.44 / 个
查看数据手册 →A3P1000-1FG484T
✅ 直接替换✓ 有现货
$160 / 个
查看数据手册 →A3P1000L-1FGG484I
✅ 直接替换✓ 有现货
$28.8 / 个
查看数据手册 →A3P600L-1FGG484I
✅ 直接替换✓ 有现货
$17.1 / 个
查看数据手册 →A3P1000-FG484M 最大额定值与电气特性
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| Logic Elements | 11 KLEs |
| CLBs | 24576 |
| User I/O | 300 |
| Embedded SRAM | 147456 bits |
| Max Dual-Port SRAM | 144 kbits |
| Core Voltage | 1.425 V to 1.575 V (nominal 1.5 V) |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm CMOS flash |
| Configuration Memory | On-chip flash (nonvolatile, reprogrammable) |
| 封装 | 484-ball FBGA (PBGA484), 23 x 23 mm, 1 mm pitch, 2.23 mm height |
| 安装类型 | Surface Mount |
| 工作温度 | -55C to +125C |
| Number of I/O Banks | 4 |
| Soft CPU Support | Optimal Soft ARM |
| Packaging | Tray |
A3P1000-FG484M 484-ball fbga (pbga484), 23 x 23 mm, 1 mm pitch, 2.23 mm height 引脚配置指南
A3P1000-FG484M（484-ball fbga (pbga484), 23 x 23 mm, 1 mm pitch, 2.23 mm height 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3P1000-FG484M.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3P1000-FG484M 适用于 6 应用s: Industrial Automation and Control, Aerospace and Defense Logic, Communications Infrastructure, Secure Embedded Systems, Medical Instrumentation, Test and Measurement Equipment.
Industrial Automation and Control
The A3P1000-FG484M fits industrial automation because its 1M gates and 300 user I/O absorb the many parallel interfaces (PLCs, motor encoders, fieldbus bridges) typical of factory floor equipment, while the 231 MHz system performance handles deterministic control loops. Flash configuration means the controller is live at power-up - important for machinery that must resume state after brownouts without a configuration download cycle. With four VCCIBx I/O banks, mixed 3.3V field I/O and 1.8V backplane logic coexist on one device. Use the FPGA between an industrial MCU and high-density I/O, implementing glue logic, PWM engines, and protocol bridges; the wide -55C to +125C range also tolerates hot cabinets near drives.
推荐
Aerospace and Defense Logic
The M temperature suffix gives -55C to +125C operation, making the A3P1000-FG484M appropriate for avionics controllers, satellite payload interfaces, and defense electronics. Its nonvolatile on-chip flash removes the external configuration PROM - a common failure point and single-board inventory item in high-reliability programs - and the flash cells resist bitstream interception, protecting mission IP. The 484-ball 23 x 23 mm FBGA provides 300 I/O for redundant sensor buses and telemetry interfaces while keeping a single-chip footprint. Designs should still follow program-level derating and SEE analysis; consult Microchip military product briefs for radiation performance of the ProASIC3 process before flight qualification.
推荐
Communications Infrastructure
Line cards and backplane adapters need flexible, reprogrammable interface logic - exactly the role of the A3P1000-FG484M. With 300 I/O in mixed-voltage banks, it can bridge 3.3V legacy backplanes to 1.8V serial PHYs, and the 231 MHz fabric clock supports framing, serialization, and protocol adaptation functions. Instant-on flash startup lets boards respond to backplane power without waiting for a bootloader, reducing bring-up time in redundant systems. Place the FPGA between backplane connectors and the system processor, offloading status registers, interrupts, and hot-swap sequencing logic; pair with a 1.5V LDO or buck with clean sequencing for the 1.425V to 1.575V core rail.
推荐
Secure Embedded Systems
Because the A3P1000-FG484M stores its bitstream in on-chip flash rather than loading it from an external device, the configuration data never appears on a readable bus - a structural security advantage over SRAM FPGAs for anti-cloning and IP protection. The 1M-gate fabric can host cryptographic wrappers, secure key storage logic, and authentication state machines alongside the user design, and the Optimal Soft ARM capability allows an embedded processor within the same secure fabric. Typical uses are licensed peripherals, payment terminals, and protected industrial controllers. Combine with secure elements and verify programming-file handling with Libero SoC security features.
推荐
Medical Instrumentation
Medical devices benefit from the A3P1000-FG484M's reprogrammability across product revisions and regulatory audits: logic corrections ship as a firmware update without board respins. The 300 I/O interface patient-isolation barriers, sensor arrays, and display subsystems across multiple voltage domains using the four I/O banks, while 147,456 bits of dual-port SRAM buffer waveform data. Instant-on behavior ensures the instrument is ready immediately when powered - relevant in point-of-care and surgical settings. The -55C to +125C rating exceeds medical requirements, providing margin for autoclave-adjacent or high-density rack environments; the FG package finish should be matched to the manufacturer's assembly process.
推荐
Test and Measurement Equipment
Bench instruments and automated test equipment require large pin counts for channel multiplexing, timing generators, and trigger logic - the A3P1000-FG484M's 300 user I/O and 231 MHz fabric cover these needs in a single 23 x 23 mm chip. The 24,576 CLBs implement per-channel calibration, pattern generators, and capture FIFOs using the 147,456-bit embedded dual-port SRAM. Field reprogrammability lets vendors add instrument features post-sale. Power the 1.5V core from a dedicated low-noise buck, and keep VCCIBx banks grouped by signal standard (TTL control vs fast logic) to preserve signal integrity on the measurement path.
推荐
推荐产品汇总
工程参考数据： A3P1000-FG484M ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3P1000-2FG484M | A3P1000-1FGG484T | A3P1000L-1FGG484I | A3P600L-1FGG484I |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (PBGA484, 1 mm pitch) | 484-ball FBGA - same | 484-ball FBGA (FGG finish) - same | 484-ball FBGA (FGG finish) - same | 484-ball FBGA (FGG finish) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 600,000 |
| User I/O | 300 | 300 | 300 | 300 | 300 |
| Speed Grade | Base (dash) | Grade 2 (faster) | Grade 1 | Grade 1 | Grade 1 |
| Configuration Memory | On-chip flash (nonvolatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
关键差异点
- Extended -55C to +125C temperature range （对比 A3P1000-1FGG484T)
- Full 1M-gate density at lower cost than speed-upgrade parts （对比 A3P1000-2FG484M)
- Maximum density in the same 484 footprint （对比 A3P600L-1FGG484I)
设计说明
Supply the 1.425V to 1.575V core rail (nominal 1.5V) with a dedicated regulator capable of the full switching transient current of the fabric, and provide each of the four VCCIBx I/O banks from its own supply per the assigned voltage standard. Estimated: core current depends on utilization and toggle rate - size the regulator from Libero SoC power estimation reports, not rule-of-thumb. Decouple VCC and each bank with bulk capacitance plus 0.1 uF ceramics at ball-side vias. Microchip power calculation tools (SmartPower in Libero) give per-bank current estimates for the -2 grade worst case.
The 484-ball FBGA uses a 1 mm pitch on a 23 x 23 mm body; use a standard 0.5 mm via-in-pad or dog-bone escape with 0.25 mm microvias for inner-layer fan-out. Route the JTAG ball to a programming header for FlashPro access - do not share JTAG with user logic unless your flash programming flow supports it. Reserve testpoints for VCC and each VCCIBx bank. Microchip application notes on ProASIC3 migration detail bank-level pin routing that constrains breakout planning.
Assign I/Os respecting bank voltage compatibility: package VCCIBx pins route through their corresponding banks, so mixing incompatible standards (e.g., 3.3V LVCMOS with 1.8V HSTL) in one bank violates the datasheet bank rules and can overstress I/O cells. Plan bank assignment before pin locking in Libero SoC. Also note that per the ProASIC3 datasheet, detailed device/package thermal information does not apply to the A3P1000 the same way as other family members - request Microchip thermal data for the FG484 package before finalizing heatsinking decisions.
合规信息
The FG484M package (M temperature variant) compliance status was not stated in the provided data. The FGG package suffix in this family denotes lead-free options - consult Microchip product pages for the A3P1000-FG484M RoHS/REACH certificate.
