A3P600L-FG484 - ProASIC3L Low Power FPGA 600K Gates | Microchip
料号： A3P600L-FG484 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $118.5 | $118.50 |
| 10 | $109.2 | $1,092.00 |
| 100 | $98.6 | $9,860.00 |
| 500 | $91.4 | $45,700.00 |
| 1,000 | $85.9 | $85,900.00 |
A3P600L-FG484 概述
A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable interconnects. Unlike SRAM-based FPGAs, the ProASIC3L family uses non-volatile flash technology, meaning the configuration is stored on-chip and no external boot flash or configuration controller is required - simplifying the bill of materials and improving system boot security. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and are used to implement digital logic, glue logic, interfaces, and accelerators.
Key features of the A3P600L include 110,592 bits of embedded flash RAM, a core supply range of 1.14 V to 1.575 V (1.2 V nominal), support for up to 350 MHz internal performance per the device family datasheet, and Microsemi Flash*Freeze technology that allows near-zero-power standby without losing state. The L-suffix denotes the low-power 1.2 V core variant of the ProASIC3 family, reducing static power significantly compared with the standard A3P600.
Architecturally, the device integrates VersTiles (fine-grained logic tiles), embedded block RAM, and I/O banks supporting multiple single-ended and differential standards. The flash-based fabric also provides inherent security advantages because the bitstream is not exposed at power-up, unlike SRAM FPGAs that download configuration from external memory.
Typical applications include portable and battery-powered instrumentation, industrial control, aerospace and defense subsystems, secure embedded controllers, and low-power bridging logic where single-chip, non-volatile configuration is valuable.
Design consideration: the verified distributor data lists RoHS status as non-compliant for this exact ordering code, so confirm environmental requirements and consider the lead-free FGG484 sibling where regulations demand it.
This page adds value beyond the datasheet by synthesizing distributor pricing tiers, drop-in family alternatives, package compatibility notes, and practical design guidance in one place.
直接替换替代料： A3P600L-FG484 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3P600L-FG484 （相同外形与封装尺寸） ——差异在于 Package, Core Supply Voltage, Family, System Gates, Configuration Memory.
快速对比工具——选择替代料号进行并排对比：
A3P600L-FG484I
✅ 直接替换✓ 有现货
$45.6 / 个
查看数据手册 →A3P600L-FGG484I
✅ 直接替换✓ 有现货
$41.35 / 个
查看数据手册 →A3P600L-1FGG484I
✅ 直接替换✓ 有现货
$17.1 / 个
查看数据手册 →A3P1000-FG484M
✅ 直接替换✓ 有现货
$47.95 / 个
查看数据手册 →A3P1000-1FGG484T
✅ 直接替换✓ 有现货
$33.9 / 个
查看数据手册 →A3P1000-2FGG484M
✅ 直接替换✓ 有现货
$75.44 / 个
查看数据手册 →A3P600L-FG484 最大额定值与电气特性
| Family | ProASIC3L (Flash FPGAs) |
| System Gates | 600000 |
| Logic Cells / CLBs | 13824 |
| Total RAM Bits | 110592 |
| User I/Os | 235 |
| Core Supply Voltage | 1.14 V to 1.575 V |
| Max Operating Frequency | 350 MHz (family rating) |
| Technology | CMOS, non-volatile flash based |
| 封装 | 484-FBGA (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) |
| 安装类型 | Surface Mount |
| 工作温度 | 0C to +85C (TJ) |
| Special Features | Flash*Freeze low-power standby technology |
| Configuration | Single-chip, on-chip flash (no external boot device) |
| Packaging | Tray |
| RoHS 状态 | Non-compliant (per Microchip USA listing) |
| Manufacturer Lead Time | 8 weeks |
| Product Status | Active |
A3P600L-FG484 484-fbga (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) 引脚配置指南
A3P600L-FG484（484-fbga (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3P600L-FG484.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3P600L-FG484 适用于 6 应用s: Portable and Battery-Powered Instruments, Industrial Control and Automation, Secure Embedded Controllers, Aerospace and Defense Subsystems, Low-Power Bridge and Glue Logic, Test and Measurement Equipment.
Portable and Battery-Powered Instruments
The A3P600L-FG484 fits battery-powered instruments because its 1.2 V low-power core and Flash*Freeze technology cut static consumption dramatically versus 1.5 V ProASIC3 parts and SRAM FPGAs that must retain configuration continuously. With 600,000 gates, 13,824 logic cells, and 235 user I/Os, one device can integrate measurement sequencing, display interfacing, and sensor buses that would otherwise need several ASICs or microcontrollers. Flash*Freeze lets the design idle with state retained and wake in milliseconds for a spot measurement, which suits handheld test gear, portable medical analyzers, and field data loggers where duty cycling directly extends battery life.
推荐
Industrial Control and Automation
In industrial controllers, the A3P600L-FG484 provides deterministic glue logic, machine-safe I/O expansion, and protocol bridging with 235 user I/Os - enough for parallel fieldbus interfaces, encoder channels, and multiple UART/SPI/I2C banks in one chip. The non-volatile flash configuration means the PLC or drive board powers up functional instantly with no external boot device, improving uptime and eliminating a common single point of failure. The 0C to +85C (TJ) commercial grade covers typical cabinet environments; for unheated outdoor panels specify the A3P600L-FG484I industrial variant, which shares the identical footprint and lets one PCB layout serve both temperature grades.
推荐
Secure Embedded Controllers
Flash-based ProASIC3L devices are favored for secure embedded controllers because the bitstream never appears on an external bus: unlike SRAM FPGAs that download configuration at every power-up (an interception point), the A3P600L stores its configuration in on-chip flash and boots as a single chip. The 600,000-gate capacity implements custom encryption interfaces, tamper-response logic, and secure boot glue around a host processor. The 1.14 V to 1.575 V core tolerance eases power-supply design in racks with shared rails, and 110,592 embedded RAM bits buffer sensitive data on-chip rather than in external memory, shrinking the physical attack surface of point-of-sale terminals, access-control panels, and authentication modules.
推荐
Aerospace and Defense Subsystems
ProASIC3L flash FPGAs have a long heritage in aerospace and defense payloads, avionics glue logic, and secure communications boards. The single-chip, non-volatile configuration reduces component count and improves reliability predictions compared to SRAM FPGA solutions requiring external configuration PROMs. The A3P600L-FG484's 484-FBGA offers abundant I/O for redundant bus interfaces (MIL-STD-style parallel links, ARINC-style channels implemented in logic), and Flash*Freeze supports duty-cycled satellite or UAV payloads. For flight programs, select the temperature-qualified variants of the same die and consult Microchip hi-rel flows; this commercial-grade MPN suits prototyping, lab validation, and ground equipment where 0C to +85C suffices.
推荐
Low-Power Bridge and Glue Logic
Many modern boards must bridge legacy parallel interfaces to serial buses, or voltage domains between processor and peripherals. The A3P600L-FG484 handles this class of work with 13,824 logic cells - ample for bus translators, arbitration logic, FIFOs using the 110,592-bit embedded RAM, and timing adaptation up to the family's 350 MHz performance class. Because configuration is on-chip, a bridge implemented in this device appears live at power-up with no loader software, simplifying bring-up on mixed-vendor platforms. Its low 1.2 V core also keeps bridge quiescent power low in always-on infrastructure such as network line cards, storage backplanes, and test-fixture interfacing.
推荐
Test and Measurement Equipment
Bench and rack instruments exploit the A3P600L-FG484 for timing generation, trigger logic, pattern generators, and data-path formatting. The 235 user I/Os enable dense channel counts for digital pattern capture, while the flash fabric supports field-updatable instrument personalities without external boot infrastructure. Family performance up to 350 MHz covers high-rate counting and data formatting, and the 484-FBGA's 1.0 mm pitch eases routing of wide buses on 8-12 layer instrument boards. Combined with precision analog front ends, one FPGA consolidates control-plane and data-plane logic, cutting BOM cost in oscilloscope front-end modules, logic analyzers, and automated test fixtures.
推荐
推荐产品汇总
工程参考数据： A3P600L-FG484 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3P600L-FG484I | A3P600L-FGG484I | A3P600L-1FGG484I | A3P1000-FG484M | A3P1000-2FGG484M |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (23 x 23 mm) | 484-FBGA - same | 484-FBGA (FGG) - same footprint | 484-FBGA (FGG) - same footprint | 484-FBGA - same | 484-FBGA (FGG) - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 1000000 | 1000000 |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V low-power) | 1.14 V to 1.575 V (1.2 V) | 1.14 V to 1.575 V (1.2 V) | 1.14 V to 1.575 V (1.2 V) | 1.5 V core (standard family) | 1.5 V core (standard family) |
| Speed Grade | Standard | Standard | Standard | -1 (slower) | Standard | -2 (faster) |
| Flash*Freeze Technology | Yes | Yes (ProASIC3L) | Yes (ProASIC3L) | Yes (ProASIC3L) | No (standard ProASIC3) | No (standard ProASIC3) |
关键差异点
- Low-power 1.2 V core with Flash*Freeze （对比 A3P1000-FG484M)
- Identical footprint with industrial temperature option （对比 A3P600L-FG484I)
- Lead-free compliance path without respin （对比 A3P600L-FGG484I)
设计说明
Power the 1.2 V core from a rail held within 1.14 V to 1.575 V under all load transients. The A3P600L differs from standard A3P600 parts (1.5 V core), so never swap the L and non-L parts on a fixed 1.5 V rail without re-verifying the regulator - doing so can exceed the low-power core rating. Sequence core, I/O, and auxiliary rails per the family datasheet power-up requirements, and use Flash*Freeze in duty-cycled systems to cut standby power while retaining state.
The 484-FBGA uses a 1.0 mm ball pitch on a 23 x 23 mm body. Use an via-in-pad or dog-bone breakout on at least a 10-layer board for 235 user I/Os, and dedicate solid planes for core and I/O bank returns. The exposed die requires the land pattern from the manufacturer's package drawing - do not rescale. For x-ray inspection and rework, follow BGA reflow profiles from IPC-recommended practice and confirm ball composition, since the FGG variants use lead-free balls with different reflow peak temperatures.
Three common mistakes: (1) ordering the base FG484 code when RoHS compliance is mandatory - the verified listing marks this exact MPN non-compliant, so specify FGG484 for lead-free builds; (2) assuming drop-in substitution across the family without checking the speed-grade suffix (-1 parts are slower, -2 parts faster) and temperature suffix (I = industrial); (3) ignoring I/O banking rules - assign standards per bank as documented in the ProASIC3L datasheet before pin-locking the design in Libero SoC.
Estimated: thermal performance of the 484-FBGA on a typical board is adequate for low-power ProASIC3L designs because the 1.2 V core reduces dynamic power roughly in proportion to V squared versus 1.5 V operation (about 36% less). Still, compute junction temperature as TJ = TA + P_total x theta_JA using the theta_JA value for your stackup from the family datasheet package chapter, and verify TJ stays within the 0C to +85C (TJ) commercial rating or choose the -I grade.
合规信息
Microchip USA listing states RoHS non-compliant for this exact ordering code; product status Active, packaging Tray, manufacturer lead time 8 weeks. Select FGG484 suffix variants for lead-free builds.
