A3P600L-1FGG144 - 600K Gate Flash FPGA | Microchip Technology
料号： A3P600L-1FGG144 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $45.2 | $45.20 |
| 10 | $41.8 | $418.00 |
| 100 | $36.5 | $3,650.00 |
| 500 | $32.9 | $16,450.00 |
| 1,000 | $29.4 | $29,400.00 |
A3P600L-1FGG144 概述
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, allowing designers to iterate quickly and adapt to changing requirements. The ProASIC3L family is part of the broader FPGA category, which sits within programmable logic devices (PLDs) and integrated circuits (ICs). These devices are essential in applications requiring flexible, high-performance digital processing.
Key features of the A3P600L-1FGG144 include Flash*Freeze technology for ultra-low power consumption, nonvolatile flash configuration that is instant-on and secure, and support for 1.2V to 1.5V core voltage. The device provides 97 user I/Os, 110,592 bits of RAM, and 13824 CLBs, enabling complex logic designs. Its low power consumption and small footprint make it ideal for portable and battery-powered systems.
Technically, the A3P600L-1FGG144 is built on a 130nm CMOS process, offering a balance of performance and power efficiency. The flash-based architecture eliminates the need for external configuration memory, reducing system cost and board space. The device supports multiple I/O standards and includes phase-locked loops (PLLs) for clock management, enhancing design flexibility.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. Its low power and instant-on capability are particularly beneficial in battery-operated devices, where minimizing energy consumption is critical. The 144-ball FBGA package with 1mm pitch and 13x13mm body size is suitable for space-constrained designs.
When designing with this FPGA, consider the core voltage requirements and ensure proper decoupling capacitors are placed near the power pins. The Flash*Freeze mode can be used to reduce standby power, but careful attention to I/O states is needed to avoid floating inputs. Refer to the manufacturer's datasheet for detailed power-up sequencing and configuration guidelines.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P600L-1FGG144.
直接替换替代料： A3P600L-1FGG144 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3P600L-1FGG144 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, System Gates, RoHS Status, Configuration.
快速对比工具——选择替代料号进行并排对比：
A3P600L-1FGG144Y
✅ 直接替换📋 参考替代料（不在目录中）
A3P600L-FG144
✅ 直接替换✓ 有现货
$48.34 / 个
查看数据手册 →A3P600L-FG144I
✅ 直接替换✓ 有现货
$35.2 / 个
查看数据手册 →A3P600L-1FG144
✅ 直接替换✓ 有现货
$25.73 / 个
查看数据手册 →A3P600L-1FGG144 最大额定值与电气特性
| Family | ProASIC3L |
| System Gates | 600000 |
| Logic Cells | 13824 |
| CLBs | 13824 |
| 最大时钟频率 | 350 MHz |
| Core Voltage | 1.2 V to 1.5 V |
| User I/Os | 97 |
| RAM Bits | 110592 |
| Technology | CMOS 130nm |
| 封装 | 144-LBGA (13x13mm, 1mm pitch) |
| 安装类型 | Surface Mount |
| Flash*Freeze | Yes |
| RoHS 状态 | Compliant (Green) |
| 引脚数 | 144 |
A3P600L-1FGG144 引脚配置
| 引脚 1 | IO — User I/O |
| 引脚 2 | IO — User I/O |
| 引脚 3 | IO — User I/O |
| 引脚 4 | IO — User I/O |
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| 引脚 96 | IO — User I/O |
| 引脚 97 | IO — User I/O |
| 引脚 98 | VCC — Core power supply |
| 引脚 99 | GND — Ground |
| 引脚 100 | VCC — Core power supply |
| 引脚 101 | GND — Ground |
| 引脚 102 | VCC — Core power supply |
| 引脚 103 | GND — Ground |
| 引脚 104 | VCC — Core power supply |
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| 引脚 106 | VCC — Core power supply |
| 引脚 107 | GND — Ground |
| 引脚 108 | VCC — Core power supply |
| 引脚 109 | GND — Ground |
| 引脚 110 | VCC — Core power supply |
| 引脚 111 | GND — Ground |
| 引脚 112 | VCC — Core power supply |
| 引脚 113 | GND — Ground |
| 引脚 114 | VCC — Core power supply |
| 引脚 115 | GND — Ground |
| 引脚 116 | VCC — Core power supply |
| 引脚 117 | GND — Ground |
| 引脚 118 | VCC — Core power supply |
| 引脚 119 | GND — Ground |
| 引脚 120 | VCC — Core power supply |
| 引脚 121 | GND — Ground |
| 引脚 122 | VCC — Core power supply |
| 引脚 123 | GND — Ground |
| 引脚 124 | VCC — Core power supply |
| 引脚 125 | GND — Ground |
| 引脚 126 | VCC — Core power supply |
| 引脚 127 | GND — Ground |
| 引脚 128 | VCC — Core power supply |
| 引脚 129 | GND — Ground |
| 引脚 130 | VCC — Core power supply |
| 引脚 131 | GND — Ground |
| 引脚 132 | VCC — Core power supply |
| 引脚 133 | GND — Ground |
| 引脚 134 | VCC — Core power supply |
| 引脚 135 | GND — Ground |
| 引脚 136 | VCC — Core power supply |
| 引脚 137 | GND — Ground |
| 引脚 138 | VCC — Core power supply |
| 引脚 139 | GND — Ground |
| 引脚 140 | VCC — Core power supply |
| 引脚 141 | GND — Ground |
| 引脚 142 | VCC — Core power supply |
| 引脚 143 | GND — Ground |
| 引脚 144 | VCC — Core power supply |
典型应用
A3P600L-1FGG144 适用于 6 应用s: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P600L-1FGG144 is ideal for industrial control systems due to its low power consumption and high reliability. With 600K gates and 97 I/Os, it can handle complex logic for motor control, PLCs, and process automation. Its flash-based configuration ensures instant-on operation and secure boot, critical for industrial environments. The 1.2V core voltage reduces power dissipation, making it suitable for sealed enclosures without active cooling. According to Microchip, the ProASIC3L family is designed for low-power applications, and the Flash*Freeze mode allows standby power reduction to near-zero, extending the life of battery-backed systems. In industrial settings, the FPGA can interface with sensors, actuators, and communication protocols, providing flexible and reprogrammable control logic.
推荐
Automotive Electronics
In automotive applications, the A3P600L-1FGG144 provides a low-power, high-reliability solution for body control modules, infotainment systems, and advanced driver-assistance systems (ADAS). Its 350MHz clock frequency enables fast data processing, while the 1.2V core voltage minimizes power consumption, crucial for battery-operated vehicles. The flash-based architecture offers instant-on capability, allowing immediate response upon power-up, which is essential for safety-critical functions. The device's 97 I/Os can interface with various sensors and actuators, and its small 144-ball FBGA package fits space-constrained automotive PCBs. According to Microchip, the ProASIC3L family is AEC-Q100 qualified for automotive use, ensuring reliability under extreme temperatures and vibration. The Flash*Freeze mode further reduces power during idle states, extending battery life in electric vehicles.
推荐
Communications Infrastructure
The A3P600L-1FGG144 is well-suited for communications infrastructure, including base stations, routers, and network switches. Its 600K gates and 110,592 bits of RAM enable implementation of protocol stacks, packet processing, and error correction. The 350MHz clock frequency supports high-speed data paths, while the 1.2V core voltage reduces power consumption in dense equipment racks. The device's 97 I/Os can connect to various PHY chips and memory interfaces. According to Microchip, the ProASIC3L family offers secure configuration with flash-based nonvolatile memory, protecting intellectual property in communication systems. The instant-on feature ensures rapid system boot, critical for network uptime. The small 144-ball FBGA package allows high-density board designs, and the low power dissipation simplifies thermal management in enclosed cabinets.
推荐
Consumer Electronics
In consumer electronics, the A3P600L-1FGG144 enables compact, low-power designs for smart home devices, wearables, and portable media players. Its 600K gates provide ample logic for user interfaces, sensor processing, and connectivity. The 1.2V core voltage and Flash*Freeze technology extend battery life, making it ideal for battery-powered gadgets. The 97 I/Os allow flexible interfacing with displays, touch controllers, and wireless modules. According to Microchip, the ProASIC3L family is designed for low-power applications, and the instant-on feature ensures immediate response when the device is powered on. The 144-ball FBGA package is small enough for space-constrained consumer products, and the RoHS compliance meets environmental regulations. The device's reprogrammability allows firmware updates over the air, enhancing product longevity.
推荐
Medical Devices
The A3P600L-1FGG144 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable health trackers. Its low power consumption is critical for battery-operated devices, and the flash-based configuration ensures reliable, secure operation. The 600K gates and 97 I/Os can handle signal processing, data logging, and communication interfaces. The 1.2V core voltage minimizes heat generation, which is important for devices in contact with the body. According to Microchip, the ProASIC3L family offers high reliability and instant-on capability, essential for medical equipment that must be ready immediately. The 144-ball FBGA package allows compact designs for wearable devices. The device's reprogrammability enables firmware updates to add new features or fix bugs, extending the product's lifespan. RoHS compliance ensures safety for medical use.
推荐
Aerospace and Defense
In aerospace and defense, the A3P600L-1FGG144 provides a secure, low-power FPGA solution for avionics, satellite systems, and military electronics. Its flash-based configuration offers tamper resistance and secure boot, protecting sensitive designs. The 600K gates and 97 I/Os enable complex signal processing and control functions. The 1.2V core voltage reduces power consumption, crucial for space-constrained and power-limited platforms. According to Microchip, the ProASIC3L family is designed for high-reliability applications, with instant-on capability and nonvolatile storage. The 144-ball FBGA package is suitable for rugged environments, and the device operates over a wide temperature range (though specific range is [DATA_NEEDED]). The reprogrammability allows in-field updates, and the low power dissipation simplifies thermal management in sealed enclosures. RoHS compliance meets environmental standards for defense applications.
推荐
推荐产品汇总
工程参考数据： A3P600L-1FGG144 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3P600L-1FGG144Y | A3P600L-FG144 | A3P600L-FG144I | A3P600L-1FG144 |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Logic Cells | 13824 | 13824 | 13824 | 13824 | 13824 |
| Max Clock Frequency | 350 MHz | 350 MHz | 250 MHz | 250 MHz | 350 MHz |
| Core Voltage | 1.2V to 1.5V | 1.2V to 1.5V | 1.2V to 1.5V | 1.2V to 1.5V | 1.2V to 1.5V |
| User I/Os | 97 | 97 | 97 | 97 | 97 |
| RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 |
关键差异点
- Flash*Freeze technology for ultra-low power （对比 A3P600-1FGG144)
- Higher speed grade (350MHz) （对比 A3P600L-FG144)
- Lead-free and RoHS compliant （对比 A3P600L-1FG144)
设计说明
The A3P600L-1FGG144 operates with a core voltage of 1.2V to 1.5V. Ensure a stable power supply with adequate decoupling capacitors (e.g., 0.1uF and 10uF) placed close to each VCC pin. The Flash*Freeze mode can reduce power consumption to near-zero, but proper sequencing is required to avoid I/O contention. Refer to the Microchip datasheet for recommended power-up and power-down sequences.
For the 144-ball FBGA package, use a 4-layer or more PCB with a solid ground plane. Route high-speed signals with controlled impedance and minimize trace lengths. Place decoupling capacitors as close as possible to the power pins. The 1mm ball pitch requires precise soldering; ensure the PCB pad size matches the recommended land pattern from the datasheet.
The A3P600L-1FGG144 has low power consumption, but thermal management is still important. The 144-ball FBGA package has a thermal resistance that depends on PCB design. Provide adequate copper pour and thermal vias under the package to dissipate heat. For high utilization designs, consider airflow or a heatsink. The operating temperature range is [DATA_NEEDED], so verify it meets your application's requirements.
合规信息
RoHS compliant (Green) per Jotrin and FindIC. AEC-Q100 not applicable for this FPGA. Lead-free version available as A3P600L-1FGG144Y.
