A3P600L-1FGG144I - ProASIC3L Flash FPGA 600K Gates | Microchip
料号： A3P600L-1FGG144I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $65.9 | $659.00 |
| 100 | $63.2 | $6,320.00 |
| 500 | $61.59 | $30,795.00 |
| 1,000 | $59.8 | $59,800.00 |
A3P600L-1FGG144I 概述
A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration device. Within the programmable logic hierarchy - FPGA -> programmable logic device -> semiconductor - flash FPGAs occupy the single-chip, instant-on niche, contrasting with SRAM FPGAs that require a boot flash and are vulnerable to configuration readback.
Key features include single-chip solution with on-chip flash (no external boot device, live at power-up), low total cost of ownership (TOC), a 1.2 V to 1.5 V core voltage range supporting low-power designs, and support for Level 0/1/2 security via FlashLock, which locks the device against readback and modification. The ProASIC3L family is the low-power variant of ProASIC3, using a 1.2 V core for reduced static and dynamic power.
Technically, the A3P600L uses CMOS flash switch technology with a sea-of-modules architecture of logic modules and VersaTiles, supporting clock frequencies suitable for the -1 (standard) speed grade. On-chip resources include embedded memory blocks and support for common I/O standards at 3.3 V, 2.5 V, 1.8 V, and 1.5 V banks.
Typical applications include industrial control, military/aerospace and secure systems needing configuration security, bridge logic, portable and low-power instrumentation, and ASIC prototyping where instant-on, single-chip operation matters.
Design consideration: budget power by estimating utilization in Libero SoC before fixing the core rail; the 1.14 V to 1.575 V supply tolerance allows margin but thermal design in the 13 x 13 mm BGA must still be verified.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet. Prices as of 2026-08-31.
直接替换替代料： A3P600L-1FGG144I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3P600L-1FGG144I （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, RoHS Status, Technology, Family.
快速对比工具——选择替代料号进行并排对比：
A3P600L-FGG144I
✅ 直接替换✓ 有现货
$33.95 / 个
查看数据手册 →A3P600L-1FGG144
✅ 直接替换✓ 有现货
$29.4 / 个
查看数据手册 →A3P600L-1FGG144YI
✅ 直接替换📋 参考替代料（不在目录中）
A3P600L-FG144I
✅ 直接替换✓ 有现货
$35.2 / 个
查看数据手册 →A3P600L-1FG144
✅ 直接替换✓ 有现货
$25.73 / 个
查看数据手册 →A3P600L-1FGG144I 最大额定值与电气特性
| Family | ProASIC3L |
| Number of Gates | 600000 |
| Logic Cells (CLBs) | 13824 |
| User I/O | 97 |
| RAM Bits | 110592 |
| Technology | CMOS Flash (non-volatile) |
| Supply Voltage (Core) | 1.14 V to 1.575 V |
| Speed Grade | -1 |
| 工作温度 | -40C to +100C (TJ), Industrial |
| 封装 | 144-LBGA (FBGA-144 / FGG144) |
| Package Dimensions | 13 x 13 mm, 1.45 mm height |
| Ball Pitch | 1 mm |
| 安装类型 | Surface Mount |
| Configuration | On-chip flash, single chip, instant-on |
| Security | FlashLock Level 0/1/2 security |
| Packaging | Tray |
| RoHS 状态 | ROHS3 Compliant, Green |
A3P600L-1FGG144I 13 x 13 mm, 1.45 mm height 引脚配置指南
A3P600L-1FGG144I（13 x 13 mm, 1.45 mm height 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3P600L-1FGG144I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3P600L-1FGG144I 适用于 6 应用s: Industrial Control and Automation, Secure Military and Aerospace Systems, Low-Power Portable Instrumentation, Bridge Logic and Bus Interface, ASIC Prototyping and Emulation, Secure Embedded Sensing and IoT Edge.
Industrial Control and Automation
The A3P600L-1FGG144I fits industrial control because its 13,824 logic cells and 97 user I/Os cover typical PLC glue logic, motor-control interfaces, and sensor aggregation, while the -40C to +100C industrial temperature range survives cabinet and floor environments. Its flash configuration is live at power-up, so the FPGA participates in power-on diagnostics within microseconds - important for safety interlocks that must not wait for a configuration load. In a typical design, the device bridges fieldbus PHYs to a host MCU with 110,592 RAM bits available for FIFO buffering, and the 1.2 V core keeps standby power low in always-on installations. FlashLock security also prevents process logic from being read out of deployed units on the factory floor.
推荐
Secure Military and Aerospace Systems
Defense and aerospace designers choose the A3P600L-1FGG144I because flash-based configuration eliminates the external boot flash readback attack surface inherent to SRAM FPGAs, and FlashLock Levels 0/1/2 lock the design against both readback and unauthorized reprogramming. The 600,000-gate fabric with 13,824 CLBs implements mission interfaces, custom bus protocols, and cryptographic wrappers, while the industrial -40C to +100C rating covers extended environmental requirements. Single-chip, instant-on operation matters for payloads that must be functional within milliseconds of power application. With no configuration device to fail, system reliability analysis also drops one component from the FIT budget, a quantified benefit in long-duration deployments.
推荐
Low-Power Portable Instrumentation
Battery-powered instruments benefit directly from the ProASIC3L low-power architecture: the 1.2 V nominal core (1.14 V to 1.575 V range) cuts static and dynamic power versus standard-core ProASIC3 devices, extending battery runtime without changing logic capacity. The 13 x 13 mm 144-ball package keeps board area compact for handheld enclosures. In a typical portable data-logger, the FPGA handles 97 I/O channels of sensor acquisition and timing, with 110,592 RAM bits buffering samples, while instant-on flash configuration lets the instrument be measurement-ready immediately after switch-on. The absence of a configuration PROM also removes one quiescent-load component from the power budget.
推荐
Bridge Logic and Bus Interface
As bridge logic, the A3P600L-1FGG144I implements protocol conversion between legacy and modern buses - for example, parallel peripheral buses to SPI/I2C, or custom backplanes to standard interfaces - using the 13,824 CLBs for state machines and the 110,592 RAM bits for elastic FIFOs. Flash configuration means the bridge is functional the moment power is applied, so upstream hosts never see a dead bus during a configuration window. The 97 I/Os are banked across 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards, letting one device talk to old 3.3 V peripherals and modern 1.8 V ASICs simultaneously. Timing is deterministic because no reconfiguration occurs in operation.
推荐
ASIC Prototyping and Emulation
For ASIC prototyping, the A3P600L-1FGG144I provides a reprogrammable, instant-on fabric where 600,000 gates accommodate moderate RTL blocks for early firmware bring-up. Flash programmability allows in-system design iteration without swapping configuration devices, and FlashLock secures pre-release IP on the prototype board. The -1 speed grade is adequate for functional prototyping where the target ASIC clock is replicated at a reduced ratio, and designers typically run the FPGA at a divided clock to relax timing closure in Libero SoC. The 97 I/Os expose internal nodes on test headers, giving hardware teams visibility that the final ASIC will not have - a core value of FPGA-based validation.
推荐
Secure Embedded Sensing and IoT Edge
In secure edge nodes, the A3P600L-1FGG144I combines sensing aggregation with anti-tamper configuration storage: the design bitstream lives in on-chip flash and is locked by FlashLock, so an attacker cannot extract or substitute the logic image. The 13,824 CLBs implement sensor front-end sequencing, CRC/authentication pipelines, and interface to a low-power MCU host, with the 1.2 V core minimizing standby draw for battery or energy-harvesting nodes. Instant-on operation means the node can authenticate itself to the network immediately at power-up without waiting for configuration load from external memory - closing the boot-time vulnerability window present in SRAM FPGA designs.
推荐
推荐产品汇总
工程参考数据： A3P600L-1FGG144I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3P600L-FGG144I | A3P600L-1FGG144 | A3P600L-1FGG144YI | A3P600L-1FG144 |
|---|---|---|---|---|---|
| Package | 144-LBGA (FGG144), 13 x 13 mm | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FG144) family - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Logic Cells (CLBs) | 13824 | 13824 | 13824 | 13824 | 13824 |
| User I/O | 97 | 97 | 97 | 97 | 97 |
| Core Supply Voltage | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V |
| Speed Grade | -1 | Standard (per suffix) | -1 | Y (slower/cost-optimized grade) | -1 |
| RoHS | ROHS3 Compliant | ROHS3 Compliant | Compliant (Green package) | Compliant | Compliant (Green package) |
关键差异点
- Single-chip flash configuration, instant-on （对比 SRAM FPGAs (Xilinx/Altera equivalents))
- FlashLock security with Level 0/1/2 lock （对比 A3P600L-1FGG144)
- Low-power 1.2 V core family (ProASIC3L) （对比 A3P600-FG144I (standard ProASIC3))
- Trade-off: -1 speed grade limits maximum clocking （对比 A3P600L-1FGG144YI)
设计说明
Power the ProASIC3L core from a rail within 1.14 V to 1.575 V, targeting the 1.2 V nominal point. Because this is a flash FPGA, static power is dominated by leakage rather than configuration-hold current, but dynamic power scales with clock frequency, toggle rate, and the square of core voltage - running at 1.14 V where timing permits measurably reduces consumption. Per Microchip's product page, the L-family's core voltage range is the main low-power lever; use Microchip's power estimator and Libero SoC SmartPower with your post-layout netlist rather than rule-of-thumb numbers before finalizing the regulator budget.
The FGG144 package uses a 1.0 mm ball pitch on a 13 x 13 mm body; specify a 0.5 mm pad, non-solder-mask-defined (NSMD) land pattern and follow the PCB land-pattern application note in the ProASIC3L family documentation. Fan out with via-in-pad or dogbone vias; with 97 user I/Os and distributed power/ground balls, a 4-layer stackup (SIG-GND-PWR-SIG) simplifies escape routing. Because I/O banks are powered independently, dedicate one plane section per bank voltage to avoid plane splits under high-speed signals.
Do not treat this like an SRAM FPGA: there is no external configuration flash to size, but programming must occur via JTAG or the specified programming interface before FlashLock is enabled - once Level 1/2 security is set, the device cannot be read back, so archive the programming file (STP/PDB) in configuration management. Also, mixing speed grades (e.g., substituting the Y grade) changes static timing results; always re-run timing-driven place-and-route in Libero SoC after any suffix change rather than assuming pin-compatibility implies timing-compatibility.
合规信息
Distributor data (Microchip USA) lists ROHS3 Compliant; Jotrin describes a GREEN PBGA144 package. REACH and conflict-minerals declarations not stated in provided data.
