A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
料号： A3PE3000L-1FGG896I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
A3PE3000L-1FGG896I 概述
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. This places the ProASIC3L family in the power management-oriented branch of the FPGA taxonomy: unlike SRAM FPGAs, it is single-chip, Instant On at power-up, and inherently secure because the bitstream never leaves the device. Its hierarchy runs: A3PE3000L -> ProASIC3L family -> flash FPGA -> field-programmable gate array -> programmable logic device.
Key features include 1.2 V to 1.5 V core voltage operation, Flash*Freeze technology that dramatically cuts dynamic and static power without losing register or SRAM state, six PLLs for clock management, and speed grade -1 performance up to approximately 272 MHz. The 130-nm, 7-layer metal (6 copper layers) flash-based CMOS process combines high logic density with live-at-power-up Level 0 support, eliminating the boot delay and configuration controller required by SRAM FPGAs.
The low-power architecture makes this device well suited to battery-powered and thermally constrained systems. Flash*Freeze mode allows the fabric to be frozen in microseconds while I/O states are held, resuming full-speed operation just as quickly, which is valuable in duty-cycled instruments and portable data acquisition units.
Typical applications include industrial automation controllers, portable medical and test instrumentation, aerospace and defense subsystems requiring secure single-chip configuration, and communication line-card glue logic.
Designers should budget board space and stack-up for the 1 mm pitch 896-ball FBGA and verify power sequencing across the core and I/O banks; the industrial -40C to +85C rating of the I-suffix part must be observed in thermal analysis.
This page synthesizes distributor availability data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3PE3000L-1FGG896I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE3000L-1FGG896I （相同外形与封装尺寸） ——差异在于 Package, Family, Configuration Memory, Process Technology, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
A3PE3000L-1FGG896
✅ 直接替换✓ 有现货
$255 / 个
查看数据手册 →A3PE3000L-FGG896I
✅ 直接替换✓ 有现货
$139.9 / 个
查看数据手册 →A3PE3000L-FG896
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3PE3000-1FGG896I
✅ 直接替换✓ 有现货
$219 / 个
查看数据手册 →M1A3PE3000L-1FGG896I
✅ 直接替换📋 参考替代料（不在目录中）
A3PE3000L-1FGG896I 最大额定值与电气特性
| Family | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| System Gates | 3000000 |
| User I/O | 620 |
| Embedded SRAM | 504 kbits true dual-port |
| 封装 | 896-ball FBGA, 1 mm pitch |
| Speed Grade | -1 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| PLLs | 6 |
| Maximum System Performance | Approx. 272 MHz |
| Configuration Technology | Nonvolatile flash, single-chip, Instant On |
| Low Power Feature | Flash*Freeze Technology |
| 工作温度 | -40C to +85C (industrial, I suffix) |
| Logic Family | CMOS |
| 安装类型 | Surface Mount |
| Power-Up Support | Live at Power-Up Level 0 |
A3PE3000L-1FGG896I 896-ball fbga, 1 mm pitch 引脚配置指南
A3PE3000L-1FGG896I（896-ball fbga, 1 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE3000L-1FGG896I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE3000L-1FGG896I 适用于 6 应用s: Industrial Automation and Control, Portable and Battery-Powered Instrumentation, Aerospace and Defense Subsystems, Communications Line Cards and Network Gear, Medical and Diagnostic Equipment, Secure Single-Chip Embedded Systems.
Industrial Automation and Control
The A3PE3000L-1FGG896I fits industrial controllers because its 3M system gates absorb motor sequencing, interlock logic, and multi-protocol interfaces in one chip, while the industrial -40C to +85C rating matches factory-floor environments. Six PLLs generate the multiple clock domains typical of fieldbus, encoder, and HMI subsystems without external clock tree devices. Flash*Freeze technology lets the controller drop into a microwatt-class standby between production cycles while holding all state, and the nonvolatile flash configuration survives power interruptions that would blank an SRAM FPGA, cutting reboot time to zero after a brown-out on the 24 V industrial rail.
推荐
Portable and Battery-Powered Instrumentation
Battery-operated test and data-acquisition instruments benefit directly from the L-suffix power optimizations. With 1.2 V to 1.5 V core operation and Flash*Freeze mode, dynamic power drops by orders of magnitude during idle periods while 504 kbits of SRAM preserve captured waveforms. The single-chip, Instant On flash configuration eliminates the external boot device and its standby current, an advantage over SRAM FPGAs in portable designs. With 620 user I/O available on the FGG896 package, one device can interface high-channel-count sensor arrays, display drivers, and USB or Ethernet bridges simultaneously, reducing board area and quiescent budget compared with multi-chip solutions.
推荐
Aerospace and Defense Subsystems
The ProASIC3L flash architecture is attractive in defense electronics because the configuration bitstream never leaves the chip, providing inherent protection against bitstream interception on untrusted interfaces, and the fabric is live at power-up Level 0, meeting strict time-to-first-data requirements in radar and avionics front ends. The 130-nm, 7-layer metal (6 copper) process supports approx. 272 MHz system performance for the -1 speed grade, enough for preprocessing pipelines, while six PLLs condition multiple mission clocks. Designers in this domain should pair the FPGA with Microchip radiation-tolerant power and support devices and confirm the specific program-level screening requirements beyond the standard industrial rating.
推荐
Communications Line Cards and Network Gear
In networking equipment the A3PE3000L-1FGG896I serves as glue logic and preprocessing fabric between MACs, PHYs, and backplane interfaces. The 620 user I/O on a 1 mm pitch 896-ball FBGA supports wide parallel buses and multiple gigabit interfaces on one die, and six PLLs generate the line-card clock architecture from a single reference. Flash*Freeze allows unused line cards to enter a low-power standby that resumes in microseconds when traffic arrives, cutting rack-level power draw. True dual-port SRAM of 504 kbits implements deep FIFOs and statistics buffers, while single-chip Instant On configuration means a line card is fully operational as soon as shelf power is applied.
推荐
Medical and Diagnostic Equipment
Medical imaging front ends and patient-monitoring systems use the A3PE3000L-1FGG896I to sequence sensor arrays, filter streaming data, and drive display and communication interfaces. The 3M-gate fabric and 504 kbits dual-port SRAM handle multi-channel acquisition pipelines, while single-chip nonvolatile configuration supports the deterministic power-up behavior expected in certified medical devices - there is no configuration download window during which the system is in an undefined state. Flash*Freeze reduces heat and battery drain in portable ultrasound and handheld diagnostic units, and the industrial -40C to +85C rating covers sterilization-adjacent and cold-chain storage environments that exceed commercial temperature limits.
推荐
Secure Single-Chip Embedded Systems
For embedded systems where firmware security matters, the flash-based ProASIC3L stores its configuration entirely on-chip and supports design locking against readback, eliminating the external configuration flash that is a common attack surface on SRAM FPGAs. The 3M-gate capacity implements encryption wrappers, secure boot state machines, and tamper-response logic alongside user logic, with six PLLs and approx. 272 MHz -1 speed grade performance for symmetric cipher pipelines. Instant On, live-at-power-up Level 0 operation ensures security functions are active from the first clock edge. This makes the device a fit for secure industrial gateways, payment terminals, and government communications equipment.
推荐
推荐产品汇总
工程参考数据： A3PE3000L-1FGG896I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE3000L-1FGG896 | A3PE3000L-FGG896I | A3PE3000-1FGG896I | M1A3PE3000L-1FGG896I |
|---|---|---|---|---|---|
| Package | 896-ball FBGA (FGG896), 1 mm pitch | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3000000 | 3000000 | 3000000 | 3000000 | 3000000 |
| Embedded SRAM | 504 kbits dual-port | 504 kbits dual-port | 504 kbits dual-port | 504 kbits dual-port | 504 kbits dual-port |
| User I/O | 620 | 620 | 620 | 616 | 620 |
| Temperature Range | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | No (standard ProASIC3E) | Yes |
| Embedded ARM Cortex-M1 | No | No | No | No | Yes |
| PLLs | 6 | 6 | 6 | 6 | 6 |
关键差异点
- Flash*Freeze low-power mode with state retention （对比 A3PE3000-1FGG896I)
- Industrial temperature rating （对比 A3PE3000L-1FGG896)
- Pure fabric design at lower cost than Cortex-M1 version （对比 M1A3PE3000L-1FGG896I)
设计说明
The A3PE3000L operates from a 1.2 V to 1.5 V core supply with separate I/O bank supplies. Power each I/O bank according to the standards it must interface (2.5 V, 3.3 V, etc.) and verify per-bank current limits against your I/O utilization - with up to 620 user I/O simultaneously switching, ground bounce and di/dt on the core rail become the dominant supply concerns. Use wide planes and bulk capacitance at each supply, and consult Microchip power estimation tools in Libero for fabric current before fixing the regulator sizing.
The 896-ball FBGA with 1 mm pitch requires a minimum of via-in-pad or dogbone fanout on at least the outer two ball rows; plan layer count early - typically 8 or more layers are needed to escape 620 I/O while preserving power planes. Follow the ballout in the ProASIC3L datasheet (DS50003268) during pin planning in Libero so that power/ground ball assignments match the board split. Do not swap supply balls; the flash-based die has fixed power ball positions.
Estimated: with a 3M-gate fabric running at moderate utilization, dynamic power can reach several hundred milliwatts to over a watt depending on clock rates; combine this with your actual Libero power report. The FGG896 package dissipates largely through the ball array into the PCB, so solid ground planes and adequate airflow matter for the -40C to +85C industrial rating. Verify junction temperature stays within the datasheet maximum at your worst-case ambient, especially in sealed enclosures.
Do not substitute a commercial-grade A3PE3000L-1FGG896 for the industrial -40C to +85C I-suffix part in extended-temperature designs. Also remember that flash FPGAs are live at power-up: input logic levels during board bring-up are applied to a running device, so add pull resistors on critical control inputs to define safe states before firmware control is established. Finally, re-run timing closure in Libero when changing speed grades - the -1 grade limits maximum system frequency.
合规信息
Compliance status was not stated in the retrieved web data; consult the Microchip product page or environmental datasheet for RoHS/REACH status. The FGG suffix conventionally denotes lead-free balls, but this must be confirmed against official Microchip documentation.
