A54SX32-BG313M - SX FPGA 249 I/O 313-BBGA | Microsemi
料号： A54SX32-BG313M ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $280.25 | $2,802.50 |
| 100 | $265.5 | $26,550.00 |
| 500 | $251 | $125,500.00 |
| 1,000 | $236 | $236,000.00 |
A54SX32-BG313M 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks and interconnects that the designer programs after manufacturing. The SX family belongs to the anti-fuse FPGA branch of the programmable logic hierarchy: unlike SRAM FPGAs (Xilinx, Altera), anti-fuse devices are one-time programmable, so their configuration is non-volatile, resistant to radiation-induced configuration upsets, and available immediately at power-up without an external boot device.
Key features of the A54SX32-BG313M include the SX sea-of-modules architecture, which delivers gate-array-like routing efficiency and timing predictability; 249 user-input/output pins brought out on the 313-ball footprint; dual-rail operation supporting both 3.3V-class logic and 5.0V-tolerant legacy systems; and the M-grade temperature offering for extended-temperature and defense-oriented programs.
Technically, the sea-of-modules fabric combines combinational and sequential modules with segmented routing, giving deterministic interconnect delays that simplify high-performance synchronous design closure compared with SRAM FPGA architectures. Because configuration is stored in anti-fuse elements, there is no configuration bitstream to load, no configuration controller to design, and a dramatically reduced single-event-upset exposure - the reason SX parts persist in avionics, space, and industrial systems designed around them.
Typical applications include glueless bus bridging in 5V industrial systems, military and avionics control logic, high-speed state machines and address decoders, and telecom line-card control where non-volatile, instant-on programmable logic is required.
When designing with this device, verify that both supply rails meet the 3.0V-3.6V and 4.75V-5.25V windows and confirm the -M grade against your program temperature requirement before layout.
This page synthesizes distributor stock data, the manufacturer datasheet, drop-in alternative analysis, and practical design notes not found on any single distributor page.
直接替换替代料： A54SX32-BG313M ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A54SX32-BG313M （相同外形与封装尺寸） ——差异在于 Supplier Device Package, Temperature Grade.
快速对比工具——选择替代料号进行并排对比：
A54SX32-BG313
✅ 直接替换📋 参考替代料（不在目录中）
A54SX32-BG313M
✅ 直接替换✓ 有现货
$236 / 个
查看数据手册 →A54SX32-1BG329I
✅ 直接替换✓ 有现货
$628.26 / 个
查看数据手册 →A54SX32-BG313M 最大额定值与电气特性
| Manufacturer | Microsemi Corporation (now Microchip Technology) |
| Product Series | SX (Actel SX family FPGA) |
| Logic Architecture | Anti-fuse, sea-of-modules |
| User I/O | 249 |
| Supply Voltage Rail 1 | 3 V to 3.6 V |
| Supply Voltage Rail 2 | 4.75 V to 5.25 V |
| 封装 / 外壳 | 313-BBGA |
| Supplier Device Package | 313-PBGA (35x35 mm) |
| 安装类型 | Surface Mount |
| Programming Type | One-Time Programmable (anti-fuse), non-volatile |
| Configuration Memory | None required (anti-fuse, instant-on) |
| Temperature Grade | M (military/extended grade, per M suffix) |
| 分类 | Embedded - FPGAs (Field Programmable Gate Array) |
A54SX32-BG313M 313-pbga (35x35 mm) 引脚配置指南
A54SX32-BG313M（313-pbga (35x35 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A54SX32-BG313M.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A54SX32-BG313M 适用于 6 应用s: Military and Avionics Control Logic, Industrial 5V Legacy Bus Bridging, High-Speed State Machines and Decoders, Telecom Line-Card Control, Space-Grade-Adjacent Non-Volatile Logic, Test and Measurement Instrument Logic.
Military and Avionics Control Logic
The A54SX32-BG313M fits military and avionics control logic because its anti-fuse configuration is non-volatile and immune to configuration-memory upsets, and the M suffix denotes the military temperature grade expected in such programs. With 249 user I/O on the 313-BBGA, a single device can consolidate bus control, status encoding, and discrete I/O handling that previously consumed multiple MIL-standard logic parts. In circuit terms the FPGA sits between a processor bus and backplane signals, implementing address decode and handshaking state machines with deterministic interconnect delays characteristic of the sea-of-modules routing. The one-time-programmable fabric removes the need for a configuration PROM and its attendant failure modes, reducing board complexity and improving power-up availability for flight-critical rails.
推荐
Industrial 5V Legacy Bus Bridging
The A54SX32-BG313M is well suited to industrial systems that still run 5V buses, thanks to its specified 4.75V-5.25V supply rail alongside the 3.0V-3.6V rail. Typical use places the FPGA between a modern 3.3V controller and legacy 5V PLC backplanes, where it performs level-compatible glue logic, address decoding, and parallel-to-serial adaptation without external level-shifting stages. The 249 user I/O provide enough pins to bridge wide parallel buses in one package on the 35x35 mm 313-BBGA footprint. Because configuration is anti-fuse, the bridge logic is active within nanoseconds of power-up, satisfying industrial equipment that expects instant operation at power application. Designers should budget both supply rails and verify I/O standards in the SX datasheet electrical tables.
推荐
High-Speed State Machines and Decoders
The SX family's sea-of-modules architecture gives the A54SX32-BG313M predictable, gate-array-like routing delays, which makes it a strong fit for high-speed synchronous state machines, address decoders, and pipelined control paths. Unlike SRAM FPGA architectures whose interconnect delays vary with routing, the SX fabric's deterministic timing simplifies static timing closure on critical paths - valuable in telecom line cards and test equipment with tight setup/hold budgets. Implementation follows the standard Libero/Designer flow: HDL entry, place-and-route, timing verification, then one-time anti-fuse programming via Silicon Sculptor. The 32-kilo-class gate capacity and 249 I/O accommodate both the control core and its peripheral interface on a single 313-BBGA device, replacing dozens of discrete TTL/CMOS parts.
推荐
Telecom Line-Card Control
Telecom line cards require control logic that is operational immediately when a card is hot-inserted and remains configured through power glitches; the A54SX32-BG313M's anti-fuse, instant-on fabric satisfies both requirements without a boot PROM. Its dual 3.0V-3.6V and 4.75V-5.25V rails match mixed-voltage backplanes common in older central-office equipment. The 249 user I/O map efficiently to per-channel control signals across high-density line cards, implementing per-channel supervision, alarm latching, and ring/relay drive sequencing. Sea-of-modules routing keeps per-channel logic timing uniform, so channel-to-channel skew stays predictable. Designers typically place the FPGA between the backplane connector and the card's line-interface devices, decoupling both supply rails with ceramic capacitors close to the 313-BBGA balls.
推荐
Space-Grade-Adjacent Non-Volatile Logic
While not itself a rad-tolerant part number, the A54SX32-BG313M's anti-fuse architecture is the heritage technology behind Actel's space-famous FPGA lines: configuration stored in permanent metallic links cannot suffer configuration-memory single-event upsets, and there is no external configuration memory to fail. Programs migrating from this device to rad-tolerant siblings keep the same design methodology. In practice the device serves ground-support and low-orbit-adjacent equipment where instant-on behavior matters: payload controllers, telemetry formatters, and instrument sequencing. The 249 I/O in a 35x35 mm 313-BBGA allow dense single-FPGA implementations. Non-volatile, one-time programming also simplifies lot traceability - the programmed netlist is physically fixed in the device and can be verified, which many quality systems require.
推荐
Test and Measurement Instrument Logic
Test instruments benefit from the A54SX32-BG313M's deterministic timing and instant power-up behavior. Bench and rack instruments often gate measurements from the instant power is applied; with anti-fuse configuration there is no multi-hundred-millisecond bitstream load before the control fabric is live. Typical roles include trigger-sequencer state machines, counter/timer front-end control, and address decoding across modular instrument backplanes, using the 249 user I/O to reach every module slot from one device. The dual supply range supports instruments mixing 5V analog sections with 3.3V digital sections. Because the programmed design is permanently fused, instrument calibration-related logic cannot be corrupted by a corrupted configuration file in the field - an advantage over SRAM FPGAs for instruments shipped to uncontrolled environments.
推荐
推荐产品汇总
工程参考数据： A54SX32-BG313M ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A54SX32-BG313 | A54SX32-1BG329I |
|---|---|---|---|
| Package | 313-BBGA (35x35 mm) | 313-BBGA - same | 329-BGA - larger footprint |
| Brand | Microsemi | Microsemi | Microsemi |
| Temperature Grade | M (military/extended) | Commercial | I (industrial) |
| Configuration | Anti-fuse OTP, non-volatile | Anti-fuse OTP, non-volatile | Anti-fuse OTP, non-volatile |
| Architecture | SX sea-of-modules | SX sea-of-modules | SX sea-of-modules |
| Drop-in on Same PCB | N/A | Yes - identical 313-ball footprint | No - 329-ball land pattern differs |
关键差异点
- Military temperature grade （对比 A54SX32-BG313)
- Dual-rail 5V compatibility （对比 A54SX32-1BG329I)
- Non-volatile anti-fuse fabric （对比 A54SX32-BG313)
设计说明
The A54SX32-BG313M requires two supply rails: 3.0V-3.6V for the core/3.3V-class I/O and 4.75V-5.25V for the 5V-tolerant I/O bank. Decouple each rail with at least 0.1uF ceramic capacitors placed within 2-3 mm of the corresponding 313-BBGA balls, plus bulk 10uF per rail. Verify power sequencing in the SX family datasheet; because configuration is anti-fuse, the device is live as soon as rails are valid, so ensure the 5V rail ramp does not over-drive 3.3V-referenced circuitry during startup.
The 313-BBGA (35x35 mm) uses a 1.27 mm ball pitch, which permits conventional via-in-pad or dog-bone breakout on standard PCB processes. Plan inner-layer fanout symmetrically to keep ball-to-ball trace lengths matched for wide buses. Allocate a solid ground plane under the die area for signal return. Since the M-grade part is used in harsh environments, specify a higher-peak-temperature reflow profile compatible with your board qualification and verify BGA ball material against your solder alloy before production.
Anti-fuse programming is irreversible. Complete full simulation and, ideally, validate on a commercial-grade socketed device (e.g., A54SX32-BG313 or a TQ176 variant) before committing the M-grade BG313M. Do not attempt to substitute the BG329 (329-ball) footprint onto a 313-ball land pattern - ball maps differ. Finally, this is an EOL family: purchase lifetime quantities in one lot where possible to avoid date-code mixing across broker stock.
合规信息
Compliance data not present in verified web sources for this legacy military-grade part; M-suffix military program parts are frequently exempt from RoHS. Verify with Microchip quality documentation for your specific date code.
