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Microsemi

A54SX32-BG313M - SX FPGA 249 I/O 313-BBGA | Microsemi

MPN: A54SX32-BG313M ✗ End of Life
In Stock Ships in 1-3 business days
3 V to 3.6 V Vdss 313-BBGA Package [DATA_NEEDED: maximum toggle frequency] Speed None required (anti-fuse, instant-on) Memory
From $236 USD / Unit
MOQ: 1 |
Price updated: 2026-09-03
Volume Pricing
Qty Unit Price Extended
1 $295 $295.00
10 $280.25 $2,802.50
100 $265.5 $26,550.00
500 $251 $125,500.00
1,000 $236 $236,000.00
ℹ️ All prices are in USD

Drop-in alternatives for A54SX32-BG313M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

A54SX32-BG313

✅ Drop-In
📦 313-BBGA
identical 313-BBGA footprint, pinout and SX32 die; commercial temperature grade instead of M military grade

📋 Reference alternative (not in catalog)

A54SX32-BG313M

✅ Drop-In
Microsemi
📦 313-BBGA
Microsemi Corporation (now Microchip Technology) · SX (Actel SX family FPGA) · Anti-fuse, sea-of-modules · 249 · 3 V to 3.6 V · 4.75 V to 5.25 V · 313-BBGA · 313-PBGA (35x35 mm)

✓ In Stock

$236 / Unit

View Datasheet →

A54SX32-1BG329I

✅ Drop-In
Microchip Technology
📦 329-BGA
32,000 · 2880 · 249 · -1 · Up to 280 MHz · Antifuse (one-time programmable, non-volatile) · 329-BBGA · 1.27 mm

✓ In Stock

$628.26 / Unit

View Datasheet →

A54SX32-BG313M Maximum Ratings & Electrical Characteristics

Manufacturer Microsemi Corporation (now Microchip Technology)
Product Series SX (Actel SX family FPGA)
Logic Architecture Anti-fuse, sea-of-modules
User I/O 249
Supply Voltage Rail 1 3 V to 3.6 V
Supply Voltage Rail 2 4.75 V to 5.25 V
Package / Case 313-BBGA
Supplier Device Package 313-PBGA (35x35 mm)
Mounting Type Surface Mount
Programming Type One-Time Programmable (anti-fuse), non-volatile
Configuration Memory None required (anti-fuse, instant-on)
Temperature Grade M (military/extended grade, per M suffix)
Category Embedded - FPGAs (Field Programmable Gate Array)

A54SX32-BG313M 313-pbga (35x35 mm) Pin Configuration Guide

Complete pinout information for A54SX32-BG313M (313-pbga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

313-pbga (35x35 mm) package pinout diagram for A54SX32-BG313M

No detailed pinout data available for A54SX32-BG313M.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for A54SX32-BG313M Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

A54SX32-BG313M is suitable for 6 applications: Military and Avionics Control Logic, Industrial 5V Legacy Bus Bridging, High-Speed State Machines and Decoders, Telecom Line-Card Control, Space-Grade-Adjacent Non-Volatile Logic, Test and Measurement Instrument Logic.

✈️

Military and Avionics Control Logic

The A54SX32-BG313M fits military and avionics control logic because its anti-fuse configuration is non-volatile and immune to configuration-memory upsets, and the M suffix denotes the military temperature grade expected in such programs. With 249 user I/O on the 313-BBGA, a single device can consolidate bus control, status encoding, and discrete I/O handling that previously consumed multiple MIL-standard logic parts. In circuit terms the FPGA sits between a processor bus and backplane signals, implementing address decode and handshaking state machines with deterministic interconnect delays characteristic of the sea-of-modules routing. The one-time-programmable fabric removes the need for a configuration PROM and its attendant failure modes, reducing board complexity and improving power-up availability for flight-critical rails.

🏭

Industrial 5V Legacy Bus Bridging

The A54SX32-BG313M is well suited to industrial systems that still run 5V buses, thanks to its specified 4.75V-5.25V supply rail alongside the 3.0V-3.6V rail. Typical use places the FPGA between a modern 3.3V controller and legacy 5V PLC backplanes, where it performs level-compatible glue logic, address decoding, and parallel-to-serial adaptation without external level-shifting stages. The 249 user I/O provide enough pins to bridge wide parallel buses in one package on the 35x35 mm 313-BBGA footprint. Because configuration is anti-fuse, the bridge logic is active within nanoseconds of power-up, satisfying industrial equipment that expects instant operation at power application. Designers should budget both supply rails and verify I/O standards in the SX datasheet electrical tables.

🔧

High-Speed State Machines and Decoders

The SX family's sea-of-modules architecture gives the A54SX32-BG313M predictable, gate-array-like routing delays, which makes it a strong fit for high-speed synchronous state machines, address decoders, and pipelined control paths. Unlike SRAM FPGA architectures whose interconnect delays vary with routing, the SX fabric's deterministic timing simplifies static timing closure on critical paths - valuable in telecom line cards and test equipment with tight setup/hold budgets. Implementation follows the standard Libero/Designer flow: HDL entry, place-and-route, timing verification, then one-time anti-fuse programming via Silicon Sculptor. The 32-kilo-class gate capacity and 249 I/O accommodate both the control core and its peripheral interface on a single 313-BBGA device, replacing dozens of discrete TTL/CMOS parts.

🌐

Telecom Line-Card Control

Telecom line cards require control logic that is operational immediately when a card is hot-inserted and remains configured through power glitches; the A54SX32-BG313M's anti-fuse, instant-on fabric satisfies both requirements without a boot PROM. Its dual 3.0V-3.6V and 4.75V-5.25V rails match mixed-voltage backplanes common in older central-office equipment. The 249 user I/O map efficiently to per-channel control signals across high-density line cards, implementing per-channel supervision, alarm latching, and ring/relay drive sequencing. Sea-of-modules routing keeps per-channel logic timing uniform, so channel-to-channel skew stays predictable. Designers typically place the FPGA between the backplane connector and the card's line-interface devices, decoupling both supply rails with ceramic capacitors close to the 313-BBGA balls.

🧩

Space-Grade-Adjacent Non-Volatile Logic

While not itself a rad-tolerant part number, the A54SX32-BG313M's anti-fuse architecture is the heritage technology behind Actel's space-famous FPGA lines: configuration stored in permanent metallic links cannot suffer configuration-memory single-event upsets, and there is no external configuration memory to fail. Programs migrating from this device to rad-tolerant siblings keep the same design methodology. In practice the device serves ground-support and low-orbit-adjacent equipment where instant-on behavior matters: payload controllers, telemetry formatters, and instrument sequencing. The 249 I/O in a 35x35 mm 313-BBGA allow dense single-FPGA implementations. Non-volatile, one-time programming also simplifies lot traceability - the programmed netlist is physically fixed in the device and can be verified, which many quality systems require.

🖥️

Test and Measurement Instrument Logic

Test instruments benefit from the A54SX32-BG313M's deterministic timing and instant power-up behavior. Bench and rack instruments often gate measurements from the instant power is applied; with anti-fuse configuration there is no multi-hundred-millisecond bitstream load before the control fabric is live. Typical roles include trigger-sequencer state machines, counter/timer front-end control, and address decoding across modular instrument backplanes, using the 249 user I/O to reach every module slot from one device. The dual supply range supports instruments mixing 5V analog sections with 3.3V digital sections. Because the programmed design is permanently fused, instrument calibration-related logic cannot be corrupted by a corrupted configuration file in the field - an advantage over SRAM FPGAs for instruments shipped to uncontrolled environments.

What is the A54SX32-BG313M?
The A54SX32-BG313M is a Microsemi (Actel) SX family anti-fuse FPGA with 249 user I/O in a 313-ball BGA package. According to the manufacturer SX family datasheet, it operates from dual supply rails of 3.0V-3.6V and 4.75V-5.25V and uses a one-time-programmable sea-of-modules fabric, making it non-volatile and instant-on at power-up.
What are the key specifications of A54SX32-BG313M that engineers should know?
Key specifications are: SX family anti-fuse FPGA architecture; 249 user I/O; 313-BBGA / 313-PBGA (35x35 mm) package; dual supply operation 3.0V-3.6V and 4.75V-5.25V; one-time programmable non-volatile configuration with no external boot device; and M temperature-grade suffix per Microsemi ordering convention. Source: Microsemi/Microchip SX family datasheet and distributor specification pages.
Is the A54SX32-BG313M still in production?
The SX family is a legacy product line; the A54SX32-BG313M is effectively end-of-life for new designs, with availability driven by distributor and broker stock. Heisener listed 6,416 pieces in stock with lead time to be confirmed (as of 2026-09-03). For new designs Microchip recommends migrating to current FPGA families; for legacy sustains, buy remaining authorized stock early.
What is the price of A54SX32-BG313M?
A54SX32-BG313M pricing is quote-based at most distributors because it is a legacy military-grade FPGA. As of 2026-09-03, XAIPART lists reference tier pricing starting at 295.00 USD at qty 1, declining to approximately 236.00 USD at qty 1000; request a formal quotation for exact, current pricing since broker stock varies significantly.
Where to buy A54SX32-BG313M online?
You can buy A54SX32-BG313M from XAIPART and from independent distributors such as Heisener (6,416 pieces listed in stock), Nantian Electronics, YIC Electronics, and Richard Electronics (as of 2026-09-03). Because the part is legacy/EOL, always verify date codes and request certificates of conformance when ordering from brokers rather than authorized channels.
What is the lead time for A54SX32-BG313M?
Lead time for A54SX32-BG313M is listed as to be confirmed at Heisener (as of 2026-09-03), meaning it depends on existing stock rather than factory production. Distributor stock was 6,416 pieces at that date. Because Microsemi (now Microchip) no longer actively promotes the SX family, plan procurement around available stock and secure enough supply for the lifetime of your program.
What is the best drop-in replacement for A54SX32-BG313M?
The closest drop-in replacement is the commercial-grade A54SX32-BG313, which shares the identical 313-BBGA footprint, pinout, and SX32 die, differing only in temperature grade. Other SX32 package variants such as the BG329M use a 329-ball footprint and are not drop-in on the same PCB land pattern. Full cross-brand drop-in equivalents do not exist because SX anti-fuse architecture is proprietary to Actel/Microsemi.
Can A54SX32-BG313 replace A54SX32-BG313M?
Yes, electrically the A54SX32-BG313 can replace the BG313M because both use the same 313-BBGA footprint and the same SX32 die. The critical difference is the temperature grade: the M suffix denotes the military/extended grade, so substitution is only acceptable if your operating environment fits the commercial temperature window. Verify your program's environmental qualification requirements before substituting grades.
What is the difference between A54SX32-BG313M and A54SX32-BG313?
The only difference is the temperature grade. According to Microsemi ordering-code convention, the M suffix in A54SX32-BG313M designates the military/extended temperature version, while the plain BG313 is the commercial grade. Package (313-BBGA), pinout (249 I/O), supply rails (3.0-3.6V and 4.75-5.25V), and logic fabric are identical, making them pin-compatible substitutions subject to temperature qualification.
A54SX32-BG313M vs A54SX32-BG329M - which should I choose?
Choose the BG313M if your PCB already has the 313-ball land pattern; the BG329M uses a different 329-ball footprint and is not drop-in compatible. Both are SX32 family devices with comparable logic capacity and the M grade. The decision is purely board-footprint driven: for an existing A54SX32-BG313M socket, the only true drop-in is the 313-ball version in the grade you need.
What is the best cross-brand equivalent for A54SX32-BG313M?
There is no true cross-brand drop-in equivalent for the A54SX32-BG313M. The anti-fuse sea-of-modules architecture is proprietary to Actel/Microsemi, and no other manufacturer offers a pin-compatible 313-BBGA anti-fuse FPGA. A functional replacement would require selecting a non-volatile FPGA (for example Microchip PolarFire or Lattice iCE40/iM families), recompiling your design, and redesigning the PCB - not a drop-in swap.
Is A54SX32-BG313M suitable for new designs?
No, the A54SX32-BG313M is not recommended for new designs because the SX family is legacy and supply depends on diminishing distributor stock (6,416 pieces at Heisener as of 2026-09-03). It remains suitable for sustaining existing defense, avionics, and industrial boards designed around its anti-fuse, instant-on architecture. For new designs, Microchip recommends current FPGA families with active lifecycle status.
Where to download the A54SX32-BG313M datasheet PDF?
You can download the SX family (54SX) FPGA datasheet PDF from Microchip Technology at ww1.microchip.com/downloads/aemdocuments/documents/fpga/ProductDocuments/DataSheets/a54sx_ds.pdf. The A54SX32-BG313M-specific datasheet document was published 2006-07-14 per FindIC indexing. XAIPART also hosts the datasheet link on this product page for direct download.
Where can I find the A54SX32-BG313M pinout?
The complete 313-ball pinout for the A54SX32-BG313M is defined in the Microchip SX family datasheet package tables. XAIPART does not reproduce the full 313-ball table on this page to avoid transcription errors; consult the official datasheet package section, which lists every ball assignment for the 313-BBGA (35x35 mm) footprint and its 249 user I/O.
Why is the A54SX32-BG313M non-volatile and instant-on?
The A54SX32-BG313M uses Actel anti-fuse programmable interconnect: each programmed link is a permanent, one-time metallic connection rather than a SRAM configuration cell. Per the SX family datasheet, this means no configuration bitstream is loaded at power-up - logic is functional within nanoseconds of supply ramp - and there is no configuration memory susceptible to single-event upsets, a key advantage in space and avionics applications.
Does A54SX32-BG313M work with 5V systems?
Yes. The A54SX32-BG313M specifies dual supply operation of 3.0V-3.6V and 4.75V-5.25V, which supports interfacing with 5.0V legacy bus systems alongside 3.3V logic. According to the manufacturer specification pages, this dual-rail capability is a defining feature of the SX-A/SX family and is a common reason legacy industrial and defense boards selected this device.
How do I program an A54SX32-BG313M?
The A54SX32-BG313M is programmed once via anti-fuse programming hardware - Actel/Microsemi Silicon Sculptor programmers - using a design compiled in the Libero/Designer toolchain. Because programming is one-time and irreversible, verify your design completely on an equivalent device or via simulation before committing the final part; a programming error cannot be erased or reprogrammed, unlike SRAM-based FPGAs.

Engineering reference data for A54SX32-BG313M — comparison, design guidance, and compliance information.

Selection Guide

Choose the A54SX32-BG313M when you are sustaining an existing defense, avionics, or industrial board designed around the 313-BBGA footprint and your environment requires the military temperature grade. Choose the commercial A54SX32-BG313 for identical functionality at lower cost and better availability when temperature permits - it is a true drop-in on the same PCB. If your board is new, do not select either: the SX family is EOL, and a current Microchip FPGA gives you an active lifecycle. If you need more I/O and can redesign the board, the BG329/BG329M (329-ball) offers a superset footprint of the same SX32 die. There is no cross-brand drop-in: the anti-fuse sea-of-modules architecture is proprietary, so any non-Microsemi migration requires recompilation and PCB redesign. Budget supply rails of 3.0-3.6V and 4.75-5.25V regardless of variant chosen.

Comparison with Alternatives

Parameter This Product A54SX32-BG313 A54SX32-1BG329I
Package 313-BBGA (35x35 mm) 313-BBGA - same 329-BGA - larger footprint
Brand Microsemi Microsemi Microsemi
User I/O 249 249 [DATA_NEEDED]
Supply Voltage 3V~3.6V, 4.75V~5.25V 3V~3.6V, 4.75V~5.25V [DATA_NEEDED]
Temperature Grade M (military/extended) Commercial I (industrial)
Configuration Anti-fuse OTP, non-volatile Anti-fuse OTP, non-volatile Anti-fuse OTP, non-volatile
Architecture SX sea-of-modules SX sea-of-modules SX sea-of-modules
Drop-in on Same PCB N/A Yes - identical 313-ball footprint No - 329-ball land pattern differs

Key Differentiators

  • Military temperature grade (vs A54SX32-BG313)
  • Dual-rail 5V compatibility (vs A54SX32-1BG329I)
  • Non-volatile anti-fuse fabric (vs A54SX32-BG313)

Design Notes

The A54SX32-BG313M requires two supply rails: 3.0V-3.6V for the core/3.3V-class I/O and 4.75V-5.25V for the 5V-tolerant I/O bank. Decouple each rail with at least 0.1uF ceramic capacitors placed within 2-3 mm of the corresponding 313-BBGA balls, plus bulk 10uF per rail. Verify power sequencing in the SX family datasheet; because configuration is anti-fuse, the device is live as soon as rails are valid, so ensure the 5V rail ramp does not over-drive 3.3V-referenced circuitry during startup.

The 313-BBGA (35x35 mm) uses a 1.27 mm ball pitch, which permits conventional via-in-pad or dog-bone breakout on standard PCB processes. Plan inner-layer fanout symmetrically to keep ball-to-ball trace lengths matched for wide buses. Allocate a solid ground plane under the die area for signal return. Since the M-grade part is used in harsh environments, specify a higher-peak-temperature reflow profile compatible with your board qualification and verify BGA ball material against your solder alloy before production.

Anti-fuse programming is irreversible. Complete full simulation and, ideally, validate on a commercial-grade socketed device (e.g., A54SX32-BG313 or a TQ176 variant) before committing the M-grade BG313M. Do not attempt to substitute the BG329 (329-ball) footprint onto a 313-ball land pattern - ball maps differ. Finally, this is an EOL family: purchase lifetime quantities in one lot where possible to avoid date-code mixing across broker stock.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data not present in verified web sources for this legacy military-grade part; M-suffix military program parts are frequently exempt from RoHS. Verify with Microchip quality documentation for your specific date code.

Data verified on: 2026-09-03 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Microsemi Microchip Technology Actel A54SX32-BG313M A54SX32-BG313 A54SX32-BG329M SX family FPGA anti-fuse FPGA Field Programmable Gate Array sea-of-modules architecture one-time programmable non-volatile configuration 313-BBGA 313-PBGA (35x35 mm) BGA package family 249 user I/O dual supply voltage 3.0-3.6V / 4.75-5.25V Silicon Sculptor programmer Libero/Designer toolchain military temperature grade (M suffix) avionics control logic industrial 5V bus bridging instant-on power-up RoHS single-event upset immunity
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