ATSAM3N1CB-CUR - Cortex-M3 48MHz 64KB MCU | Microchip
料号： ATSAM3N1CB-CUR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.21 | $4.21 |
| 10 | $3.9 | $39.00 |
| 100 | $3.58 | $358.00 |
| 500 | $3.25 | $1,625.00 |
| 1,000 | $2.98 | $2,980.00 |
ATSAM3N1CB-CUR 概述
A microcontroller unit (MCU) is a single-chip embedded computer combining a processor core, program memory, data memory, and peripherals on one die. Within the embedded systems hierarchy, the SAM3N family sits in Microchip (formerly Atmel) ARM-based flash MCU portfolio, positioned above 8-bit AVR parts and below the high-performance SAM E70 series, and belongs to the broader class of 32-bit RISC microcontrollers used in industrial and consumer control systems.
Key features include the high-performance ARM Cortex-M3 RISC core at up to 48 MHz, 64 KB (64K x 8) of embedded Flash for code storage, and rich analog integration: the 16-channel, 10-bit ADC supports multi-sensor acquisition without external front ends, while the on-chip 10-bit DAC enables audio cues and control references. Peripheral set covers Brown-out Detect/Reset, DMA, Power-on Reset, PWM channels, and a Watchdog Timer for fault-safe operation.
Technically, the Cortex-M3 core delivers deterministic interrupt handling via its nested vectored interrupt controller, and the DMA controller offloads data movement between peripherals and memory, freeing CPU cycles. The GREEN, halogen-conscious, MRL B qualified package targets industrial temperature environments, and the fine-pitch 0.8 mm ball TFBGA footprint yields a compact 9x9 mm solution for space-constrained boards requiring high I/O density.
Typical applications include industrial sensor hubs leveraging the 16-channel ADC, building automation and HVAC control nodes using PWM outputs, and battery-powered portable instruments exploiting the low-power 1.8V operation mode. The part also suits consumer appliance control panels where DAC-driven feedback tones add user-interface value.
When designing with the ATSAM3N1CB-CUR, budget the TFBGA layout carefully: the fine-pitch ball array requires via-in-pad or fan-out design rules, and multi-layer stackups are recommended to break out the 100-ball footprint. Decouple all VDD/VDDIO pairs per the SAM3N datasheet recommendations.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing referenced as of 2026-09-19.
直接替换替代料： ATSAM3N1CB-CUR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAM3N1CB-CUR （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package.
快速对比工具——选择替代料号进行并排对比：
ATSAM3N1BA-CUR
✅ 直接替换📋 参考替代料（不在目录中）
ATSAM3N2CB-CU
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
ATSAM3N4CB-CU
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
ATSAM3N1CB-CUR 最大额定值与电气特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Max Clock Frequency | 48 MHz |
| Flash Memory | 64 KB (64K x 8) |
| 电源电压 | 1.8 V / 3.3 V |
| ADC Resolution | 10-bit |
| ADC Channels | 16 |
| DAC Resolution | 10-bit |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| 工作温度 | -40C to +85C |
| 封装 | 100-TFBGA (9x9 mm) |
| 安装类型 | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Series | SAM3N |
| Grade / Qualification | Automotive, AEC-Q100 (family designation per Octopart); GREEN, IND TEMP, MRL B |
ATSAM3N1CB-CUR 100-tfbga (9x9 mm) 引脚配置指南
ATSAM3N1CB-CUR（100-tfbga (9x9 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： ATSAM3N1CB-CUR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
ATSAM3N1CB-CUR 适用于 6 应用s: Industrial Sensor Hubs, Building Automation and HVAC Control, Portable and Battery-Powered Instruments, Consumer Appliance Control Panels, Motor Control and Actuation, Data Acquisition and Metering Nodes.
Industrial Sensor Hubs
The ATSAM3N1CB-CUR fits industrial sensor-hub designs because its 16-channel 10-bit ADC can digitize up to sixteen analog sensor inputs without external multiplexers, and its DMA controller streams conversion results to RAM without CPU intervention. Running at 48 MHz, the Cortex-M3 core handles filtering, scaling, and threshold logic while the watchdog timer guarantees recovery from firmware lockups in unattended equipment. Placed on a compact 9x9 mm TFBGA footprint, the MCU consolidates acquisition and control on a single small PCB area. Designers typically clock the ADC from a stable source and average multiple samples per channel to improve effective resolution beyond the native 10 bits, a trade-off of throughput for accuracy that suits slow industrial process variables.
推荐
Building Automation and HVAC Control
In building automation nodes, the ATSAM3N1CB-CUR's PWM peripherals drive damper motors, fan speed control, and valve actuators, while its 16-channel ADC reads temperature sensors, humidity elements, and pressure transmitters across multiple zones from one controller. The 10-bit DAC can generate analog control references for variable-frequency drive inputs. Operation from 1.8V or 3.3V simplifies integration with both legacy 3.3V logic and newer low-voltage sensor rails, and the -40C to +85C rating covers rooftop and mechanical-room environments. The on-chip brown-out detector ensures safe actuator states during supply sags. Firmware size for typical HVAC scheduling and communication tasks fits comfortably within the 64 KB Flash, keeping the bill of materials at the low end of the SAM3N family.
推荐
Portable and Battery-Powered Instruments
Battery-powered handheld instruments benefit from the ATSAM3N1CB-CUR's 1.8V operating option, which lowers dynamic power versus fixed 3.3V designs, and from the SAM3N series sleep and wait modes that reduce average current between measurement bursts. The DMA controller moves ADC samples to memory while the CPU rests in a low-power state, extending battery life in datalogging applications. The single 10-bit DAC provides audible alerts or analog output for external recorders without adding a separate DAC IC. The 9x9 mm TFBGA package conserves board area in compact enclosures, though its fine-pitch balls require multilayer PCB fabrication. Firmware for display drivers, menu systems, and measurement routines typically fits well within the 64 KB Flash budget.
推荐
Consumer Appliance Control Panels
Consumer appliance control panels use the ATSAM3N1CB-CUR to scan touch or mechanical keypads through its ADC channels and GPIO, drive LED indicators and backlights via PWM for dimming effects, and generate user-feedback tones through the on-chip 10-bit DAC. The 48 MHz Cortex-M3 core has ample headroom for menu logic, delay timers, and communication with the main appliance controller over UART. The GREEN, halogen-conscious package designation aligns with consumer environmental requirements, and the industrial -40C to +85C temperature rating exceeds typical household demands, adding margin. Because panel firmware is compact, the 64 KB Flash variant is the cost-optimal choice in the pin-compatible SAM3N lineup, and the TFBGA footprint supports dense, small control PCBs.
推荐
Motor Control and Actuation
The ATSAM3N1CB-CUR supports small motor control tasks through its PWM outputs, which generate the gating waveforms for brushed DC and stepper motor drivers, while the 16-channel 10-bit ADC reads current-sense amplifiers and position potentiometers for closed-loop feedback. The DMA controller transfers current samples at fixed intervals, keeping control-loop jitter low without CPU loading. The watchdog timer enforces safe shutdown if firmware stalls mid-drive, protecting actuators and loads. The 48 MHz Cortex-M3 core executes PI control loops at several kilohertz update rates, adequate for fans, pumps, and conveyance mechanisms. Designers should verify PWM resolution at their chosen carrier frequency and consult the SAM3N datasheet timer configuration tables for complementary-output arrangements needed by half-bridge drivers.
推荐
Data Acquisition and Metering Nodes
Distributed data acquisition and utility metering nodes leverage the ATSAM3N1CB-CUR's combination of a 16-channel 10-bit ADC for multi-point measurement, a 10-bit DAC for calibration outputs or analog retransmission, and a UART or SPI link for upstream reporting to gateways. The DMA engine buffers conversion results between communication events, and the brown-out detector plus power-on reset ensure measurement integrity across unstable supply conditions common in field deployments. Storage of calibration constants and rolling logs fits within 64 KB Flash when data is offloaded frequently. The -40C to +85C temperature rating supports outdoor meter cabinets, and the compact 100-TFBGA package lets the acquisition electronics share a PCB with power and communication circuitry in tight meter enclosures.
推荐
推荐产品汇总
工程参考数据： ATSAM3N1CB-CUR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAM3N1BA-CUR | ATSAM3N2CB-CU | ATSAM3N4CB-CU |
|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | ARM Cortex-M3 / 48 MHz | ARM Cortex-M3 / 48 MHz | ARM Cortex-M3 / 48 MHz | ARM Cortex-M3 / 48 MHz |
| Flash Memory | 64 KB | 64 KB | 128 KB | 256 KB |
| ADC | 16-ch, 10-bit | 16-ch, 10-bit | 16-ch, 10-bit | 16-ch, 10-bit |
| Packaging | Tape & Reel (TR) | Tape & Reel | Tray | Tray |
关键差异点
- Lowest-cost 100-pin TFBGA entry point in SAM3N family （对比 ATSAM3N4CB-CU)
- On-chip 10-bit DAC plus 16-channel 10-bit ADC （对比 ATSAM3N1BA-CUR)
- Upgrade path within same footprint （对比 ATSAM3N2CB-CU)
设计说明
The 100-TFBGA (9x9) package uses a fine-pitch ball array that requires via-in-pad or dog-bone fanout techniques. Plan a minimum four-layer stackup with dedicated ground and power planes so that every VDD/VDDIO ball has a short via to the power plane and every GND ball connects directly to the ground plane. Decouple each supply pair with 100 nF ceramics placed on the inner layer directly beneath the package, supplemented by bulk 10 uF capacitance. Verify your fabricator's capability for the BGA ball pitch before committing the footprint, per standard Microchip SAM3N layout guidance.
Do not assume Flash code room: the ATSAM3N1CB-CUR provides 64 KB, and once a bootloader plus communication stack are included, application space can shrink quickly. If OTA updates or double-banked images are planned, choose the pin-compatible ATSAM3N4CB (256 KB) from the start. Also verify the suffix semantics when ordering: the -CUR ending encodes package, temperature grade, and tape-and-reel packing; ordering the wrong suffix yields a different packing or grade even though the die is identical. Cross-check the ordering-code table in the SAM3N datasheet before release.
The device operates at 1.8V or 3.3V; when running the core and I/O from separate domains, observe the SAM3N datasheet power-up sequencing requirements so VDDCORE is established before or with VDDIO to avoid latch-up or I/O undefined states. Estimated: dynamic power scales roughly with V^2 and frequency, so operating at 1.8V instead of 3.3V can cut core dynamic power by about 70% at the same 48 MHz clock, a significant saving in battery designs. Confirm exact figures against the datasheet current-consumption tables for your clock configuration.
合规信息
Mouser listing identifies the part as GREEN (halogen-conscious), IND TEMP, MRL B; Octopart lists the SAM3N family as Automotive, AEC-Q100. REACH and conflict-minerals status not stated in provided data.
