ATSAM3S8CA-CUR - 64MHz Cortex-M3 MCU, 512KB Flash | Microchip
料号： ATSAM3S8CA-CUR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
ATSAM3S8CA-CUR 概述
A microcontroller (MCU) is a compact integrated circuit that combines a processor core, memory, and programmable peripherals on a single die, forming the lowest level of the embedded-system hierarchy (MCU -> embedded processor -> system-on-chip). The SAM3S family belongs to the ARM Cortex-M class of 32-bit RISC microcontrollers, positioned for cost-sensitive, low-power general-purpose control applications where deterministic interrupt handling and rich analog integration matter more than raw compute throughput.
Key features include the ARMv7-M architecture with Thumb-2 instruction set for high code density, a maximum CPU clock of 64 MHz, 512 KB (512K x 8) of Flash program memory, and an industrial operating temperature grade. Per Microchip product documentation for the ATSAM3S8C device, the family integrates 64 KB of SRAM and extended peripheral options including UART, SPI, TWI, and USB connectivity, alongside a multi-row memory controller (MRL A rating per Mouser listing).
Architecturally, the Cortex-M3 core provides a 3-stage pipeline, a nested vectored interrupt controller (NVIC), and hardware division, allowing deterministic low-latency interrupt response that suits real-time control loops. The Flash accelerator keeps the 64 MHz core fed from single-cycle-wait Flash, and the 1.8 V-class supply operation (per distributor listing data) supports low-power battery-operated designs.
Typical applications include industrial automation nodes, portable and battery-powered instruments, USB-connected sensor hubs, and building-control or metering endpoints. The small 9x9 mm 100-TFBGA footprint also suits compact consumer devices where board area is constrained.
Design consideration: the fine-pitch 0.8 mm ball pitch of the TFBGA demands careful PCB stackup and via-in-pad or escape routing on 4-layer boards, and power integrity on the 1.62-3.6 V-class supply domain should be verified with adequate decoupling on all VDDIO/VDDCORE ball groups.
This page synthesizes distributor pricing context, drop-in alternatives, cross-reference data, and practical design guidance not consolidated in the manufacturer datasheet.
直接替换替代料： ATSAM3S8CA-CUR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAM3S8CA-CUR （相同外形与封装尺寸） ——差异在于 Connectivity, RoHS Status, Core Processor, Package, Series.
快速对比工具——选择替代料号进行并排对比：
ATSAM3S8CA-CU
✅ 直接替换✓ 有现货
$5.25 / 个
查看数据手册 →ATSAM3S8CA-AUR
✅ 直接替换📋 参考替代料（不在目录中）
ATSAM3S8BA-MUR
✅ 直接替换✓ 有现货
$5.15 / 个
查看数据手册 →ATSAM3SD8CA-CUR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.68 / 个
查看数据手册 →ATSAM3S4CA-CUR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
ATSAM4N8CA-CUR
✅ 直接替换✓ 有现货
$1.74 / 个
查看数据手册 →ATSAM3S8CA-CUR 最大额定值与电气特性
| Core Processor | ARM Cortex-M3 |
| Core Architecture | 32-Bit RISC |
| 最大时钟频率 | 64 MHz |
| Flash Memory Size | 512 KB (512K x 8) |
| SRAM Size | 64 KB |
| 电源电压 | 1.8 V class (per distributor listing) |
| 封装 | 100-TFBGA (9x9 mm) |
| Number of Terminals | 100 |
| Terminal Form | Ball (BGA) |
| Package Shape | Square |
| 安装类型 | Surface Mount |
| Operating Temperature Grade | Industrial (-40C to +85C per IND TEMP listing) |
| Series | SAM3S (ATSAM3S8) |
| Moisture Sensitivity Level | MRL A (per Mouser listing) |
| RoHS / Green Status | Green package (per Mouser listing) |
| Temperature Grade | INDUSTRIAL (per Partstack listing) |
| Connectivity | UART, SPI, TWI, USB (per Microchip product page) |
ATSAM3S8CA-CUR square 引脚配置指南
ATSAM3S8CA-CUR（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： ATSAM3S8CA-CUR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
ATSAM3S8CA-CUR 适用于 6 应用s: Industrial Automation Nodes, USB-Connected Sensor Hubs, Battery-Powered Portable Instruments, Building Control and Metering, Consumer Embedded Devices, Embedded Development and Education.
Industrial Automation Nodes
The ATSAM3S8CA-CUR fits industrial automation endpoints such as sensor acquisition nodes, valve controllers, and fieldbus slaves. Its 64 MHz Cortex-M3 core delivers deterministic interrupt latency via the NVIC for real-time control loops, while 512 KB Flash accommodates protocol stacks and OTA-update headroom that smaller SAM3S variants cannot hold. The industrial temperature grade (-40C to +85C per Mouser listing) ensures reliable operation on factory floors. UART, SPI, and TWI peripherals (per the Microchip ATSAM3S8C product page) connect PLC I/O modules and isolated transceivers, and the 9x9 mm 100-TFBGA footprint allows dense multi-node boards where four-layer routing is already standard.
推荐
USB-Connected Sensor Hubs
With its integrated USB device port, the ATSAM3S8CA-CUR serves as the bridge between analog sensor front-ends and a host PC. The SAM3S8C product page confirms UART, SPI, TWI, and USB connectivity, letting designers attach ADCs and digital sensors over SPI/I2C while streaming aggregated data over full-speed USB. The 512 KB Flash holds USB descriptors, CDC/MSC class stacks, and data-log buffers in the 64 KB SRAM. Operation from a 1.8 V-class supply (per distributor listing data) supports bus-powered designs with modest power budgets. Because the Cortex-M3 core runs at 64 MHz, firmware can filter and packetize data in real time without dropping USB frames under sustained host polling loads.
推荐
Battery-Powered Portable Instruments
The ATSAM3S8CA-CUR suits portable meters, handheld diagnostic tools, and data loggers. The 1.8 V-class supply operation (per Hotenda listing data) combined with Cortex-M3 sleep and wait modes lets firmware duty-cycle aggressively, extending battery life in instruments that idle between measurements. The 64 MHz clock is available on demand for FFT or calibration math, then throttled back between sessions. 512 KB Flash retains calibration tables, multi-language UI assets, and logging firmware without external memory, and the 9x9 mm TFBGA keeps the main PCB small enough for handheld enclosures. Industrial temperature grading also permits use in outdoor and vehicle-mounted test equipment exposed to wide ambient ranges.
推荐
Building Control and Metering
Smart meters, thermostats, and lighting controllers benefit from the ATSAM3S8CA-CUR's balance of memory and integration. The 512 KB Flash supports metering firmware plus communication stacks over TWI, UART, and USB interfaces confirmed on the Microchip ATSAM3S8C page, while the 64 KB SRAM buffers tariff tables and consumption histories locally. The green RoHS-compliant package (per Mouser listing) meets building-products environmental requirements, and the industrial temperature grade handles unconditioned electrical-panel environments. The square 100-ball TFBGA enables compact two-side-mounted controller boards. Designers should budget the 0.8 mm ball-pitch escape routing on a four-layer stackup, which is standard practice in this product segment.
推荐
Consumer Embedded Devices
The ATSAM3S8CA-CUR is cost-effective for consumer products such as appliance panels, toys with connectivity, and small HMI controllers. The Cortex-M3 at 64 MHz provides enough headroom for touch-sensing scanning and UI rendering, while USB device capability (per the Microchip ATSAM3S8C product page) enables firmware update or PC-link features that differentiate consumer SKUs. The 100-TFBGA (9x9 mm) package minimizes PCB area in space-limited enclosures, and the Green/MRL A rating (per Mouser) simplifies assembly at high-volume contract manufacturers using standard lead-free reflow profiles. The large Flash also allows single-firmware platforms spanning multiple product variants, reducing inventory fragmentation across a consumer portfolio.
推荐
Embedded Development and Education
The SAM3S series is a common teaching platform for ARM Cortex-M embedded courses and rapid prototyping. The ATSAM3S8CA-CUR exposes the classic Cortex-M3 programming model - NVIC, SysTick, and Thumb-2 assembly - with approachable peripheral sets (UART, SPI, TWI, USB) documented in Microchip application notes and reference designs. The 512 KB Flash forgives unoptimized student code, and the 64 KB SRAM supports RTOS-based laboratory exercises using FreeRTOS-class kernels. Because the 100-TFBGA is difficult for hand prototyping, it is typically used on pre-assembled target boards, with debug via the Cortex-M serial-wire interface. Long-term code compatibility across the SAM3 family lets course materials remain valid across die shrinks.
推荐
推荐产品汇总
工程参考数据： ATSAM3S8CA-CUR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAM3S8CA-CU | ATSAM3S8CA-AUR | ATSAM3S8BA-MUR | ATSAM3SD8CA-CUR | ATSAM4N8CA-CUR |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M4 |
| Firmware Port Required | N/A (baseline) | No - fully replaceable per FindIC | No - same family | Minor - peripheral set differences | Minor - DAC peripheral additions | Yes - Cortex-M3 to M4 port |
关键差异点
- Largest peripheral set in the SAM3S8 sub-family （对比 ATSAM3S8BA-MUR)
- True zero-modification substitution （对比 ATSAM4N8CA-CUR)
- Cost-reduced migration path on the same footprint （对比 ATSAM3S4CA-CUR)
设计说明
The 100-TFBGA (9x9 mm) package uses a 0.8 mm ball pitch, which requires either via-in-pad with filled vias or dog-bone escape routing. On a standard 4-layer stackup (signal/GND/power/signal), allocate the inner ground plane unbroken under the ball field for return paths. Follow the SAM3S datasheet layout guidelines for VDDIO and VDDCORE ball groups: place 100 nF ceramic decoupling within 2 mm of each supply ball plus one bulk 10 uF per supply domain. Estimated: this is standard BGA practice, not a datasheet-mandated figure.
The part operates from a 1.8 V-class supply domain (per distributor listing data); confirm the exact SAM3S supply ranges (VDDCORE/VDDIO) in the official datasheet before finalizing the power tree. Sequence power-up per the datasheet reset requirements and ensure the NRST pin has a defined pull-up with a 100 nF local capacitor, since brown-out glitches during slow rail ramp are the most common cause of field boot failures on SAM3 designs. Verify brown-out detector settings in firmware for battery or slowly-rising supplies.
When substituting ATSAM3S8CA-CU or ATSAM3S8CA-AUR, the silicon is identical, but when evaluating the ATSAM4N8CA-CUR (Cortex-M4), remember that peripheral register maps and clock tree configuration differ from SAM3S - a firmware port and full re-validation are mandatory, and code size will grow with the M4 DSP extensions unused. Also confirm Flash wait-state settings after any clock change: running 64 MHz Flash fetches with wrong accelerator settings causes subtle timing failures. Validate USB eye diagrams if the device port is used.
合规信息
Mouser listing describes the part as BGA, Green, IND TEMP, MRL A, indicating a Green (lead-free/RoHS-type) package. Detailed REACH, halogen, and conflict-minerals statements were not present in the provided data.
