ATSAM3SD8BA-AUR - 64MHz Cortex-M3 MCU 512KB Flash | Microchip
料号： ATSAM3SD8BA-AUR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7.44 | $7.44 |
| 10 | $6.7 | $67.00 |
| 100 | $5.95 | $595.00 |
| 500 | $5.35 | $2,675.00 |
| 1,000 | $4.85 | $4,850.00 |
ATSAM3SD8BA-AUR 概述
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the heart of an embedded system. The ATSAM3SD8BA-AUR belongs to the SAM3S family within the ARM Cortex-M class of 32-bit MCUs, sitting in the hierarchy: Cortex-M3 -> ARM embedded processor -> 32-bit microcontroller -> system-on-chip.
Key features include a 64 MHz Cortex-M3 core with an industry-standard Thumb-2 instruction set, 512KB of on-chip FLASH supporting in-system programming, an industrial temperature rating (per distributor data, IND TEMP grade), and a wide supply range of 1.8V to 3.3V as listed by distributors. The device also integrates a fast Flash Access accelerator and rich connectivity peripherals typical of the SAM3S family.
Architecturally, the SAM3S series pairs the Cortex-M3 core with an AHB/APB bus matrix, Nested Vectored Interrupt Controller, and low-power modes, enabling deterministic real-time performance. The 512KB FLASH allows large application firmware, bootloaders, and OTA-style update schemes without external memory.
Typical applications include industrial control panels, consumer appliance interfaces, data-logging equipment, and USB-connected embedded systems where a 512KB flash budget and 64 MHz headroom are required.
Design consideration: place 0.1uF decoupling capacitors close to each supply pin and follow the SAM3S datasheet clock layout guidance for the external crystal circuit.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet. Pricing referenced is as of 2026-09-19.
直接替换替代料： ATSAM3SD8BA-AUR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAM3SD8BA-AUR （相同外形与封装尺寸） ——差异在于 RoHS Status, Package, Core Processor, USB, Core Size.
快速对比工具——选择替代料号进行并排对比：
ATSAM3SD8BA-AU
✅ 直接替换✓ 有现货
$8.05 / 个
查看数据手册 →ATSAM3S8BA-MUR
✅ 直接替换✓ 有现货
$5.15 / 个
查看数据手册 →ATSAM3SD8BA-MUR
✅ 直接替换✓ 有现货
$3.98 / 个
查看数据手册 →ATSAM3S4BA-AUR
✅ 直接替换✓ 有现货
$3.44 / 个
查看数据手册 →ATSAM3N4BA-MU
✅ 直接替换✓ 有现货
$3.48 / 个
查看数据手册 →ATSAM3SD8BA-AUR 最大额定值与电气特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Max Clock Frequency | 64 MHz |
| FLASH Memory Size | 512KB (512K x 8) |
| 电源电压 | 1.8 V to 3.3 V |
| 封装 | 64-LQFP (10x10 mm) |
| 引脚数 | 64 |
| 安装类型 | Surface Mount |
| Temperature Grade | Industrial (IND TEMP) |
| Terminal Form | Gull Wing |
| Package Shape | Square (LFQFP) |
| Packing | Tape & Reel (R suffix) |
| RoHS 状态 | Compliant (Green, per Mouser listing) |
ATSAM3SD8BA-AUR square (lfqfp) 引脚配置指南
ATSAM3SD8BA-AUR（square (lfqfp) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： ATSAM3SD8BA-AUR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
ATSAM3SD8BA-AUR 适用于 6 应用s: Industrial Control Panels, Consumer Appliance Interfaces, Embedded Data Logging, Motor and Relay Control Units, USB-Connected Embedded Systems, Battery-Powered Portable Instruments.
Industrial Control Panels
The ATSAM3SD8BA-AUR's industrial temperature grade (IND TEMP, per Mouser and Partstack listings) and 64 MHz ARM Cortex-M3 core make it well suited to factory control panels and automation endpoints. Its 512KB FLASH accommodates state-machine-heavy control firmware plus a bootloader for field updates, while the 1.8V to 3.3V supply range integrates cleanly into standard 3.3V industrial logic rails. The gull-wing 64-LQFP (10x10 mm) package provides enough I/O for keypad scanning, display drive, and sensor polling in a single controller. Because the Cortex-M3 includes a Nested Vectored Interrupt Controller, deterministic response to process events is achievable without an external real-time co-processor.
推荐
Consumer Appliance Interfaces
Appliance control boards - washing machines, cooktops, HVAC user interfaces - need a display-capable MCU with generous program memory. The ATSAM3SD8BA-AUR's 512KB FLASH holds rich UI assets, multi-language strings, and communication stacks, while its 64 MHz Cortex-M3 comfortably drives segmented or graphical displays. Its low-power SAM3S architecture supports the standby modes required by energy-efficiency regulations, and the green (RoHS-compliant) LQFP-64 package meets consumer product environmental requirements. Veswin describes this part as a green, low-power MCU suited to rugged environments, matching the harsh in-appliance electrical environment of motor switching and relay noise.
推荐
Embedded Data Logging
Data-logging equipment benefits directly from the ATSAM3SD8BA-AUR's combination of large on-chip FLASH and 32-bit processing. The 512KB (512K x 8) FLASH stores configuration tables, calibration constants, and firmware with reserve space for in-field upgrades, while sampled data can be buffered off-chip via the SAM3S family's serial connectivity. The 64 MHz core processes sensor streams and time-stamps records in real time, and the industrial temperature rating supports loggers mounted outdoors or inside equipment enclosures. With a 1.8V to 3.3V supply range, the device runs directly from battery-backed 3V rails, and SAM3S low-power modes extend battery life between maintenance intervals in portable recorders.
推荐
Motor and Relay Control Units
The ATSAM3SD8BA-AUR's real-time 64 MHz Cortex-M3 core and deterministic interrupt architecture make it appropriate for controlling motors, relays, and actuators in equipment requiring timed switching sequences. Its industrial temperature grade tolerates the elevated ambient temperatures inside motor-drive enclosures, and its 3.3V logic interfaces cleanly with gate-driver and relay-driver ICs. The 512KB FLASH allows implementation of sequence tables, fault logs, and communication protocols simultaneously without external memory. The 64-pin LQFP provides sufficient GPIO to drive multiple actuator channels while reading limit switches, all from one controller, reducing BOM count compared to smaller 8-bit parts.
推荐
USB-Connected Embedded Systems
SAM3S-family devices of the SD8 class are designed with USB device connectivity as a core use case, making the ATSAM3SD8BA-AUR suitable for instruments, dongles, and peripheral devices that report to a PC over USB. The 512KB FLASH holds a USB stack, a mass-storage or HID class implementation, and the application firmware simultaneously, and the 64 MHz core sustains sustained USB transaction processing with headroom. Distributor listings (Hotenda, DigiKey) highlight the SAM3S USB MCU classification. The 1.8V to 3.3V supply range allows bus-powered designs drawing directly from the 5V USB rail through a small LDO, simplifying power architecture in compact peripheral enclosures.
推荐
Battery-Powered Portable Instruments
Portable instruments benefit from the SAM3S family's low-power design philosophy: the ATSAM3SD8BA-AUR supports multiple sleep and wait modes that reduce average current between measurements. Its 1.8V supply capability allows operation directly from a two-cell alkaline stack or single-cell Li-ion through a simple regulator, and the 64 MHz Cortex-M3 delivers burst processing for signal analysis before returning to low-power idle. The 512KB FLASH retains calibration and logging structures without an external serial flash, reducing PCB area in handheld form factors. Veswin's characterization of the part as a green, low-power MCU for rugged environments aligns with field-instrument requirements for drop resistance and temperature excursions.
推荐
推荐产品汇总
工程参考数据： ATSAM3SD8BA-AUR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAM3SD8BA-AU | ATSAM3S8BA-MUR | ATSAM3S4BA-AUR | ATSAM3N4BA-MU |
|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 32-Bit | ARM Cortex-M3, 32-Bit | ARM Cortex-M3, 32-Bit | ARM Cortex-M3, 32-Bit | ARM Cortex-M3, 32-Bit |
| Max Clock Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| FLASH Memory | 512KB | 512KB | 512KB | 256KB | 256KB |
| Supply Voltage | 1.8 V to 3.3 V | 1.8 V to 3.3 V | 1.8 V to 3.3 V | 1.8 V to 3.3 V | 1.8 V to 3.3 V |
| Temperature Grade | Industrial (IND TEMP) | Industrial | Industrial | Industrial | Industrial |
| Packing | Tape & Reel (R suffix) | Tray | Tape & Reel (MRL) | Tape & Reel | Tape & Reel |
关键差异点
- Maximum on-chip flash in the 64-pin SAM3S line （对比 ATSAM3S4BA-AUR)
- Identical device available in tray packaging （对比 ATSAM3SD8BA-AU)
- SD8 connectivity features retained （对比 ATSAM3N4BA-MU)
设计说明
Decouple every VDD pin of the ATSAM3SD8BA-AUR with a 0.1uF ceramic capacitor placed within 2 mm of the pin, connected to a solid ground plane, and add a bulk 10uF capacitor near the supply entry. The SAM3S family uses separate supply domains (core and I/O); follow the SAM3S datasheet power section for the correct VDDCORE decoupling and any required external components on the internal regulator output. Poor decoupling on 64 MHz Cortex-M3 parts commonly manifests as intermittent flash-read corruption at high temperature.
Route the main crystal (XIN/XOUT) and 32.768 kHz crystal (XIN32/XOUT32) traces as short as possible and guard them with a grounded keep-out ring to prevent coupling from switching I/O. The 64-LQFP (10x10 mm) package places pins on 0.5 mm pitch; use a solder-mask-defined pad per the Microchip LQFP footprint recommendation and avoidvia-in-pad under fine pitch traces. Estimate: standard practice for 0.5 mm pitch LQFP assembly is paste aperture reduction of 10-20% to prevent bridging - confirm with your assembler.
The R-suffix part is supplied on tape and reel; ensure your reel size and MSL (moisture sensitivity level) baking requirements are handled before reflow - check the datasheet MSL rating and J-STD-033 floor-life rules. Also note that replacing this part with a same-pinout SAM3S variant such as ATSAM3S4BA (256KB) will fail at link time if the firmware image exceeds 256KB - always check the linker map before qualifying a lower-flash alternative. Program/erase and lock-bit behavior differs between SAM3S family members; re-run flash routines on any substituted device.
合规信息
Mouser listing describes the part as LQFP,Green,IND TEMP - Green indicates RoHS-compliant lead-free construction. AEC-Q100 status not stated in provided data.