ATSAM3SD8BA-AUR - 64MHz Cortex-M3 MCU 512KB Flash | Microchip
Référence : ATSAM3SD8BA-AUR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.44 | $7,44 |
| 10 | $6.7 | $67,00 |
| 100 | $5.95 | $595,00 |
| 500 | $5.35 | $2 675,00 |
| 1 000 | $4.85 | $4 850,00 |
ATSAM3SD8BA-AUR Présentation
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the heart of an embedded system. The ATSAM3SD8BA-AUR belongs to the SAM3S family within the ARM Cortex-M class of 32-bit MCUs, sitting in the hierarchy: Cortex-M3 -> ARM embedded processor -> 32-bit microcontroller -> system-on-chip.
Key features include a 64 MHz Cortex-M3 core with an industry-standard Thumb-2 instruction set, 512KB of on-chip FLASH supporting in-system programming, an industrial temperature rating (per distributor data, IND TEMP grade), and a wide supply range of 1.8V to 3.3V as listed by distributors. The device also integrates a fast Flash Access accelerator and rich connectivity peripherals typical of the SAM3S family.
Architecturally, the SAM3S series pairs the Cortex-M3 core with an AHB/APB bus matrix, Nested Vectored Interrupt Controller, and low-power modes, enabling deterministic real-time performance. The 512KB FLASH allows large application firmware, bootloaders, and OTA-style update schemes without external memory.
Typical applications include industrial control panels, consumer appliance interfaces, data-logging equipment, and USB-connected embedded systems where a 512KB flash budget and 64 MHz headroom are required.
Design consideration: place 0.1uF decoupling capacitors close to each supply pin and follow the SAM3S datasheet clock layout guidance for the external crystal circuit.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet. Pricing referenced is as of 2026-09-19.
Alternatives de remplacement direct pour ATSAM3SD8BA-AUR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM3SD8BA-AUR (même facteur de forme et même empreinte) — différant par RoHS Status, Package, Core Processor, USB, Core Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM3SD8BA-AU
✅ Remplacement direct✓ En stock
$8.05 / unité
Voir la fiche technique →ATSAM3S8BA-MUR
✅ Remplacement direct✓ En stock
$5.15 / unité
Voir la fiche technique →ATSAM3SD8BA-MUR
✅ Remplacement direct✓ En stock
$3.98 / unité
Voir la fiche technique →ATSAM3S4BA-AUR
✅ Remplacement direct✓ En stock
$3.44 / unité
Voir la fiche technique →ATSAM3N4BA-MU
✅ Remplacement direct✓ En stock
$3.48 / unité
Voir la fiche technique →ATSAM3SD8BA-AUR Valeurs maximales et caractéristiques électriques
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Max Clock Frequency | 64 MHz |
| FLASH Memory Size | 512KB (512K x 8) |
| Tension d'alimentation | 1.8 V to 3.3 V |
| Boîtier | 64-LQFP (10x10 mm) |
| Nombre de broches | 64 |
| Type de montage | Surface Mount |
| Temperature Grade | Industrial (IND TEMP) |
| Terminal Form | Gull Wing |
| Package Shape | Square (LFQFP) |
| Packing | Tape & Reel (R suffix) |
| Statut RoHS | Compliant (Green, per Mouser listing) |
Guide de configuration des broches du ATSAM3SD8BA-AUR square (lfqfp)
Configuration des broches du ATSAM3SD8BA-AUR (boîtier square (lfqfp)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour ATSAM3SD8BA-AUR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
ATSAM3SD8BA-AUR convient pour 6 applications: Industrial Control Panels, Consumer Appliance Interfaces, Embedded Data Logging, Motor and Relay Control Units, USB-Connected Embedded Systems, Battery-Powered Portable Instruments.
Industrial Control Panels
The ATSAM3SD8BA-AUR's industrial temperature grade (IND TEMP, per Mouser and Partstack listings) and 64 MHz ARM Cortex-M3 core make it well suited to factory control panels and automation endpoints. Its 512KB FLASH accommodates state-machine-heavy control firmware plus a bootloader for field updates, while the 1.8V to 3.3V supply range integrates cleanly into standard 3.3V industrial logic rails. The gull-wing 64-LQFP (10x10 mm) package provides enough I/O for keypad scanning, display drive, and sensor polling in a single controller. Because the Cortex-M3 includes a Nested Vectored Interrupt Controller, deterministic response to process events is achievable without an external real-time co-processor.
Recommandé
Consumer Appliance Interfaces
Appliance control boards - washing machines, cooktops, HVAC user interfaces - need a display-capable MCU with generous program memory. The ATSAM3SD8BA-AUR's 512KB FLASH holds rich UI assets, multi-language strings, and communication stacks, while its 64 MHz Cortex-M3 comfortably drives segmented or graphical displays. Its low-power SAM3S architecture supports the standby modes required by energy-efficiency regulations, and the green (RoHS-compliant) LQFP-64 package meets consumer product environmental requirements. Veswin describes this part as a green, low-power MCU suited to rugged environments, matching the harsh in-appliance electrical environment of motor switching and relay noise.
Recommandé
Embedded Data Logging
Data-logging equipment benefits directly from the ATSAM3SD8BA-AUR's combination of large on-chip FLASH and 32-bit processing. The 512KB (512K x 8) FLASH stores configuration tables, calibration constants, and firmware with reserve space for in-field upgrades, while sampled data can be buffered off-chip via the SAM3S family's serial connectivity. The 64 MHz core processes sensor streams and time-stamps records in real time, and the industrial temperature rating supports loggers mounted outdoors or inside equipment enclosures. With a 1.8V to 3.3V supply range, the device runs directly from battery-backed 3V rails, and SAM3S low-power modes extend battery life between maintenance intervals in portable recorders.
Recommandé
Motor and Relay Control Units
The ATSAM3SD8BA-AUR's real-time 64 MHz Cortex-M3 core and deterministic interrupt architecture make it appropriate for controlling motors, relays, and actuators in equipment requiring timed switching sequences. Its industrial temperature grade tolerates the elevated ambient temperatures inside motor-drive enclosures, and its 3.3V logic interfaces cleanly with gate-driver and relay-driver ICs. The 512KB FLASH allows implementation of sequence tables, fault logs, and communication protocols simultaneously without external memory. The 64-pin LQFP provides sufficient GPIO to drive multiple actuator channels while reading limit switches, all from one controller, reducing BOM count compared to smaller 8-bit parts.
Recommandé
USB-Connected Embedded Systems
SAM3S-family devices of the SD8 class are designed with USB device connectivity as a core use case, making the ATSAM3SD8BA-AUR suitable for instruments, dongles, and peripheral devices that report to a PC over USB. The 512KB FLASH holds a USB stack, a mass-storage or HID class implementation, and the application firmware simultaneously, and the 64 MHz core sustains sustained USB transaction processing with headroom. Distributor listings (Hotenda, DigiKey) highlight the SAM3S USB MCU classification. The 1.8V to 3.3V supply range allows bus-powered designs drawing directly from the 5V USB rail through a small LDO, simplifying power architecture in compact peripheral enclosures.
Recommandé
Battery-Powered Portable Instruments
Portable instruments benefit from the SAM3S family's low-power design philosophy: the ATSAM3SD8BA-AUR supports multiple sleep and wait modes that reduce average current between measurements. Its 1.8V supply capability allows operation directly from a two-cell alkaline stack or single-cell Li-ion through a simple regulator, and the 64 MHz Cortex-M3 delivers burst processing for signal analysis before returning to low-power idle. The 512KB FLASH retains calibration and logging structures without an external serial flash, reducing PCB area in handheld form factors. Veswin's characterization of the part as a green, low-power MCU for rugged environments aligns with field-instrument requirements for drop resistance and temperature excursions.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM3SD8BA-AUR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM3SD8BA-AU | ATSAM3S8BA-MUR | ATSAM3S4BA-AUR | ATSAM3N4BA-MU |
|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 32-Bit | ARM Cortex-M3, 32-Bit | ARM Cortex-M3, 32-Bit | ARM Cortex-M3, 32-Bit | ARM Cortex-M3, 32-Bit |
| Max Clock Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| FLASH Memory | 512KB | 512KB | 512KB | 256KB | 256KB |
| Supply Voltage | 1.8 V to 3.3 V | 1.8 V to 3.3 V | 1.8 V to 3.3 V | 1.8 V to 3.3 V | 1.8 V to 3.3 V |
| Temperature Grade | Industrial (IND TEMP) | Industrial | Industrial | Industrial | Industrial |
| Packing | Tape & Reel (R suffix) | Tray | Tape & Reel (MRL) | Tape & Reel | Tape & Reel |
Principaux différenciateurs
- Maximum on-chip flash in the 64-pin SAM3S line (vs ATSAM3S4BA-AUR)
- Identical device available in tray packaging (vs ATSAM3SD8BA-AU)
- SD8 connectivity features retained (vs ATSAM3N4BA-MU)
Notes de conception
Decouple every VDD pin of the ATSAM3SD8BA-AUR with a 0.1uF ceramic capacitor placed within 2 mm of the pin, connected to a solid ground plane, and add a bulk 10uF capacitor near the supply entry. The SAM3S family uses separate supply domains (core and I/O); follow the SAM3S datasheet power section for the correct VDDCORE decoupling and any required external components on the internal regulator output. Poor decoupling on 64 MHz Cortex-M3 parts commonly manifests as intermittent flash-read corruption at high temperature.
Route the main crystal (XIN/XOUT) and 32.768 kHz crystal (XIN32/XOUT32) traces as short as possible and guard them with a grounded keep-out ring to prevent coupling from switching I/O. The 64-LQFP (10x10 mm) package places pins on 0.5 mm pitch; use a solder-mask-defined pad per the Microchip LQFP footprint recommendation and avoidvia-in-pad under fine pitch traces. Estimate: standard practice for 0.5 mm pitch LQFP assembly is paste aperture reduction of 10-20% to prevent bridging - confirm with your assembler.
The R-suffix part is supplied on tape and reel; ensure your reel size and MSL (moisture sensitivity level) baking requirements are handled before reflow - check the datasheet MSL rating and J-STD-033 floor-life rules. Also note that replacing this part with a same-pinout SAM3S variant such as ATSAM3S4BA (256KB) will fail at link time if the firmware image exceeds 256KB - always check the linker map before qualifying a lower-flash alternative. Program/erase and lock-bit behavior differs between SAM3S family members; re-run flash routines on any substituted device.
Informations de conformité
Mouser listing describes the part as LQFP,Green,IND TEMP - Green indicates RoHS-compliant lead-free construction. AEC-Q100 status not stated in provided data.