ATSAM4E8CA-CU - 120MHz ARM Cortex-M4 MCU 512KB | Microchip
料号： ATSAM4E8CA-CU ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $11.55 | $11.55 |
| 10 | $10.8 | $108.00 |
| 100 | $9.95 | $995.00 |
| 500 | $9.1 | $4,550.00 |
| 1,000 | $8.45 | $8,450.00 |
ATSAM4E8CA-CU 概述
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals on one die, forming the lowest complete level of an embedded system hierarchy: MCU -> embedded processor -> system-on-chip -> semiconductor device. MCUs are the workhorses of embedded electronics, executing control, sensing, and connectivity tasks in everything from appliances to industrial automation. The ARM Cortex-M4 architecture used here is a 32-bit RISC core widely adopted across the microcontroller industry.
Key features of the ATSAM4E8CA-CU include the 120 MHz Cortex-M4 core with a floating point unit (FPU) for efficient DSP and math operations, 512 KB of on-chip Flash for code storage, and the high data bandwidth bus architecture that Microchip highlights for the SAM4E family. Per the Microchip product page, the SAM4E8C features an FPU and a high data bandwidth architecture targeted at connectivity and control applications.
Technically, the device belongs to Microchip (formerly Atmel) SMART ARM-based Flash MCU portfolio. The Cortex-M4 core integrates hardware divide, single-cycle MAC, and optional single-precision FPU, enabling closed-loop control algorithms and signal processing without an external coprocessor. The Flash-based program memory allows in-system reprogramming for field upgrades.
Typical applications include industrial control and automation nodes, connectivity gateways and bridges, and consumer or building-control systems where a 120 MHz MCU with floating point capability reduces time-to-market. The 9x9 mm TFBGA footprint suits space-constrained, two-sided PCB layouts.
Design consideration: BGA packages require controlled-impedance PCB fabrication, X-ray inspection capability for rework, and via-in-pad or dog-bone fanout routing on the 0.8 mm ball pitch typical of this package class.
This page synthesizes distributor pricing, verified drop-in alternatives within the SAM4E/SAM4S families, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： ATSAM4E8CA-CU ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAM4E8CA-CU （相同外形与封装尺寸） ——差异在于 Package, Mounting Type, RoHS Status, Core Architecture, Pin-to-Pin Compatibility.
快速对比工具——选择替代料号进行并排对比：
ATSAM4E16CA-CU
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$6.68 / 个
查看数据手册 →ATSAM4E8CA-CUR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.24 / 个
查看数据手册 →ATSAM4SD16CA-CU
✅ 直接替换✓ 有现货
$5.2 / 个
查看数据手册 →ATSAM4SD32CA-CU
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$8.62 / 个
查看数据手册 →ATSAM4SA16CA-CU
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$5.39 / 个
查看数据手册 →ATSAM4E8CA-CU 最大额定值与电气特性
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| 最大时钟频率 | 120 MHz |
| Flash Memory | 512 KB (512K x 8) |
| Floating Point Unit | Yes (per Microchip SAM4E8C product page) |
| 封装 | 100-TFBGA (9x9 mm) |
| 安装类型 | Surface Mount |
| Program Memory Type | FLASH |
| Packaging Option Suffix | CU (Green TFBGA, industrial temp per Mouser) |
| RoHS 状态 | Compliant (Green package per Mouser listing) |
| Product Family | SAM4E (SMART ARM-based Flash MCU) |
ATSAM4E8CA-CU 100-tfbga (9x9 mm) 引脚配置指南
ATSAM4E8CA-CU（100-tfbga (9x9 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： ATSAM4E8CA-CU.
请参阅 数据手册 以查看完整引脚配置。
典型应用
ATSAM4E8CA-CU 适用于 6 应用s: Industrial Control and Automation, Connectivity Gateways and Bridges, Motor Control Drives, Consumer and Building Control, Test and Measurement Instrumentation, Embedded Security and Access Control.
Industrial Control and Automation
Factory automation nodes, PLC I/O modules, and machine controllers benefit directly from the ATSAM4E8CA-CU's 120 MHz ARM Cortex-M4 core with hardware FPU, which executes PID and field-oriented control loops with single-precision floating point math at deterministic speeds. The 512 KB Flash accommodates communication stacks, state machines, and diagnostics firmware without external memory. Microchip positions the SAM4E series' high data bandwidth architecture for exactly this class of control-heavy workload. Deployed as a distributed control node on an industrial fieldbus, the MCU handles real-time actuation while offloading complex computation from a host controller, and its industrial-grade green TFBGA package supports the extended-temperature requirements typical of cabinet-mounted automation electronics.
推荐
Connectivity Gateways and Bridges
Protocol-translation gateways between industrial fieldbus, USB, and serial networks fit the ATSAM4E8CA-CU because its 120 MHz Cortex-M4 core and high-bandwidth bus sustain concurrent communication stack execution with low latency. Microchip's own product page targets the SAM4E8C at connectivity applications, citing the FPU and high data bandwidth architecture. The 512 KB Flash stores dual protocol stacks plus OTA update code, and the 9x9 mm 100-TFBGA keeps gateway PCB area compact for DIN-rail and embedded form factors. In a typical design the MCU bridges serial device protocols to upstream Ethernet or USB hosts, with the FPU accelerating checksum, encryption, and data-conversion routines that dominate gateway CPU load.
推荐
Motor Control Drives
Servo drives, BLDC motors, and stepper controllers exploit the ATSAM4E8CA-CU's hardware floating point unit, which executes the trigonometric transforms of field-oriented control (FOC) without fixed-point software emulation. At 120 MHz, the Cortex-M4 sustains current-loop execution at the multi-kilohertz rates demanded by servo-class drives, while the 512 KB Flash holds field-weakening, protection, and commissioning firmware. Microchip explicitly highlights the SAM4E8C FPU for compute-intensive control. In a typical three-phase inverter design the MCU generates complementary PWM, samples current shunts through its ADC, and closes the torque loop internally, eliminating an external DSP and reducing bill-of-material cost for mid-range drive platforms.
推荐
Consumer and Building Control
Smart thermostats, access-control panels, and appliance controllers use the ATSAM4E8CA-CU where a 32-bit Cortex-M4 with FPU runs touchscreen interfaces, sensor fusion, and connectivity stacks concurrently. The 512 KB Flash supports graphics libraries and OTA updatable application code, while the 100-TFBGA (9x9 mm) package enables dense two-sided PCB layouts inside slim wall-plate and appliance housings. Microchip's SMART ARM Flash MCU portfolio targets consumer and building products with the same industrial-grade silicon. The high data bandwidth architecture keeps UI rendering responsive while background tasks handle networking and sensor polling, delivering smartphone-class interactivity at MCU power levels and cost.
推荐
Test and Measurement Instrumentation
Portable test instruments, data loggers, and sensor front-ends leverage the ATSAM4E8CA-CU's 120 MHz Cortex-M4 with FPU for real-time digital filtering, FFT computation, and calibration math executed in single-precision hardware. The 512 KB Flash stores instrument firmware, lookup tables, and logging buffers, while the high data bandwidth architecture moves ADC sample streams without core bottlenecks. Microchip targets the SAM4E8C at compute-heavy embedded instrumentation. In a handheld data logger, for example, the MCU timestamps, filters, and compresses measurement data locally before offloading over USB or serial links, and the compact 9x9 mm TFBGA suits battery-powered handheld enclosures where PCB area drives size and cost.
推荐
Embedded Security and Access Control
Access-control readers, safe locks, and security panels use the ATSAM4E8CA-CU to run cryptographic hashing and encrypted communication with acceptable latency, aided by the 120 MHz core and hardware arithmetic acceleration. The 512 KB Flash accommodates credential databases, firmware integrity code, and dual-bank update schemes, while the industrial green package meets the reliability expectations of installed security hardware. Microchip's SAM4E series high-bandwidth architecture keeps authentication response times short even under concurrent scanning and network traffic. In a typical reader, the MCU polls a credential interface, verifies credentials against stored keys, drives the lock actuator through PWM, and reports events upstream over an encrypted serial channel.
推荐
推荐产品汇总
工程参考数据： ATSAM4E8CA-CU ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAM4E16CA-CU | ATSAM4SD16CA-CU | ATSAM4SD32CA-CU | ATSAM4SA16CA-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4, 32-bit | ARM Cortex-M4, 32-bit | ARM Cortex-M4, 32-bit | ARM Cortex-M4, 32-bit | ARM Cortex-M4, 32-bit |
| Flash Memory | 512 KB | 1 MB | 1 MB | 2 MB | 1 MB |
| Floating Point Unit | Yes | Yes | Yes | Yes | Yes |
| Product Family | SAM4E | SAM4E | SAM4S | SAM4S | SAM4SA |
关键差异点
- 512 KB Flash for cost-optimized firmware （对比 ATSAM4E16CA-CU)
- SAM4E peripheral set with high bandwidth architecture （对比 ATSAM4SD16CA-CU)
- FPU on a 120 MHz Cortex-M4 （对比 ATSAM4SD32CA-CU)
- Trade-off: smaller Flash budget （对比 ATSAM4SD32CA-CU)
设计说明
The 100-TFBGA (9x9 mm) package requires a dedicated BGA fanout strategy. On the typical 0.8 mm ball pitch, outer rows can be routed dog-bone style while inner rows need via-in-pad (filled and capped) or layer-transition escape routing. Plan at least 4 PCB layers, verify the exact ball pitch in the Microchip package drawing before layout, and confirm your fabricator supports the via fill process. X-ray inspection is recommended for production solder-joint verification since BGA joints are invisible after reflow.
Decouple each BGA power ball with low-ESR ceramic capacitors placed on the nearest via pair; the fine ball grid leaves limited room, so use 0402 or smaller passives on the bottom side directly under the device. Consult the SAM4E datasheet power-supply section for the required VDDCORE/VDDIO sequencing or regulator arrangement. Estimated: with a 3.3V rail and typical MCU core current in the tens-of-mA range, dissipation stays well under 0.5 W, so thermal design is usually straightforward if copper pours connect the ground balls.
Do not assume identical ballouts across SAM4E densities: before dropping in ATSAM4E16CA-CU or a SAM4S-family part such as ATSAM4SD16CA-CU, diff the ballout tables in the respective Microchip datasheets, since peripheral multiplexing on shared balls can differ between families. Also confirm Flash programming granularity and erase-block organization, which vary by density, and re-validate clock configuration, since the 120 MHz maximum requires the correct PLL multiplier and flash wait-state settings from the family reference manual.
At 120 MHz core operation with a high data bandwidth bus, keep high-speed clock and bus traces short and reference a continuous ground plane. Match trace lengths on any parallel interface routed off-die, and add series termination (estimated 22-33 ohm, tune with board-level measurement) on fast switching outputs to limit ringing and EMI. Route the analog supply and reference balls away from switching noise per the datasheet layout guidance for ADC accuracy.
合规信息
Mouser listing describes 'LFBGA GREEN IND' - GREEN denotes Microchip's RoHS-compliant, halogen-free green package; IND denotes industrial temperature. REACH and conflict-minerals status not stated in provided data.
