ATSAM4SD32CA-CUR - 120MHz Cortex-M4 MCU 2MB Flash | Microchip
料号： ATSAM4SD32CA-CUR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $12.85 | $12.85 |
| 10 | $11.62 | $116.20 |
| 100 | $10.4 | $1,040.00 |
| 500 | $9.21 | $4,605.00 |
| 1,000 | $8.45 | $8,450.00 |
ATSAM4SD32CA-CUR 概述
A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, peripherals, and I/O on a single silicon die. ARM Cortex-M4 cores implement the Thumb-2 instruction set with hardware single-cycle multiply and optional single-precision FPU, fitting between Cortex-M0+ (lowest power) and Cortex-M7 (highest performance) in the Cortex-M hierarchy. Within power-management IC taxonomy, MCUs belong to the broader category of embedded processors / microcontrollers, sitting alongside DSPs, FPGAs, and application processors.
Key features of the ATSAM4SD32CA-CUR include its 120 MHz maximum CPU clock, single-cycle DSP MAC instructions, 2 MB Flash with security and secure boot, 160 KB SRAM (plus 2 KB backup SRAM), and 1.2 V internal core voltage supplied by an on-chip voltage regulator from a single 1.62-3.6 V external supply. The device provides up to 79 GPIO, up to 25 communication channels (USART, SPI, TWI), and a 10/100 Ethernet MAC with MII/RMII interface.
The architecture uses a multi-layer AHB bus matrix with separate bridges for code and data, eliminating contention between CPU and DMA. A peripheral DMA controller (PDC) with up to 24 channels enables zero-CPU-overhead data movement between peripherals and memory. The on-chip Flash is mapped at 0x00400000 and supports in-application programming via the SAM-BA bootloader.
Typical applications include industrial control (PLC, motor drives, HMI), consumer audio (USB speakers, headphones, audio docks), smart energy metering, building automation gateways, and connected IoT edge nodes requiring USB connectivity. The combination of 2 MB code space and high-speed ADC also suits data-acquisition loggers and portable instrumentation.
Design consideration: the 100-ball TFBGA requires a 4-layer PCB minimum with matched-length impedance control on USB/Ethernet differential pairs; place decoupling capacitors (100 nF + 4.7 µF) within 2 mm of every VDD pin to meet IEC 61967 EMI margins.
This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives from the SAM4S and SAM4S16A families, and design notes not found in the manufacturer datasheet.
直接替换替代料： ATSAM4SD32CA-CUR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAM4SD32CA-CUR （相同外形与封装尺寸） ——差异在于 ADC, Mounting Type, Package, Program Memory (Flash), Core Architecture.
快速对比工具——选择替代料号进行并排对比：
ATSAM4SD32CA-CUR-Q
✅ 直接替换📋 参考替代料（不在目录中）
ATSAM4S16CA-CUR
✅ 直接替换📋 参考替代料（不在目录中）
ATSAM4S8CA-CU
✅ 直接替换✓ 有现货
$6.18 / 个
查看数据手册 →ATSAM4SD32CA-AUR
✅ 直接替换✓ 有现货
$8.45 / 个
查看数据手册 →ATSAM4SD32CA-CU
✅ 直接替换✓ 有现货
$8.62 / 个
查看数据手册 →ATSAM4SD16CA-CUR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$5.55 / 个
查看数据手册 →ATSAM4SD32CA-CUR 最大额定值与电气特性
| Core | ARM Cortex-M4 with FPU |
| Maximum CPU Clock | 120 MHz |
| Program Memory | 2 MB Flash |
| SRAM | 160 KB |
| Backup SRAM | 2 KB |
| Supply Voltage (VDDIO/VDD) | 1.62 V to 3.6 V |
| Core Voltage (internal LDO) | 1.2 V |
| Number of I/O Pins | Up to 79 |
| 封装 | 100-ball TFBGA (9x9 mm) |
| 安装类型 | Surface Mount (Tape & Reel) |
| 工作温度 | -40 C to +85 C (Industrial) |
| ADC | 16-bit, up to 24 channels, 1 Msps |
| USB | USB 2.0 Full-Speed Device/Host with on-chip PHY |
| Ethernet MAC | 10/100 Mbps MII/RMII |
| RoHS 状态 | Compliant |
| MSL 等级 | 3 (168 hours) |
ATSAM4SD32CA-CUR 100-ball tfbga (9x9 mm) 引脚配置指南
ATSAM4SD32CA-CUR（100-ball tfbga (9x9 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： ATSAM4SD32CA-CUR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
ATSAM4SD32CA-CUR 适用于 6 应用s: Industrial Control and HMI, USB Audio Devices, Smart Energy Metering, Building Automation Gateways, Data Acquisition Loggers, Motor Drive Controllers.
Industrial Control and HMI
The ATSAM4SD32CA-CUR fits industrial PLC and HMI panels because its 120 MHz Cortex-M4 with FPU executes single-cycle DSP MAC instructions in real time, while 2 MB Flash accommodates full IEC 61131-3 runtime plus graphical HMI assets. The 16-bit ADC at 1 Msps captures analog sensor inputs for closed-loop control. The 100-ball TFBGA is small enough for compact panel-mount designs, and the industrial -40 to +85 C operating range covers factory-floor environments. The on-chip 10/100 Ethernet MAC enables Modbus TCP and EtherNet/IP gateway integration.
推荐
USB Audio Devices
The ATSAM4SD32CA-CUR is well-suited to USB speakers, USB headphones, and USB audio docks because it integrates a USB 2.0 Full-Speed device/host controller with on-chip PHY, eliminating the need for an external transceiver. The Cortex-M4 DSP extensions handle sample-rate conversion and audio mixing without CPU overhead. The 2 MB Flash stores USB audio class firmware plus optional DSP effects libraries. Compared to a discrete USB audio codec approach, the integrated solution reduces BOM and PCB area, though it requires careful impedance-controlled USB DP/DN routing per USB 2.0 spec.
推荐
Smart Energy Metering
The ATSAM4SD32CA-CUR suits single-phase and polyphase smart energy meters because its 16-bit ADC captures current and voltage waveforms simultaneously while the Cortex-M4 DSP extensions execute power-quality calculations (RMS, harmonic analysis, FFT) in real time. The 2 MB Flash stores metering firmware, calibration tables, and DLMS/COSEM communication stacks. The 160 KB SRAM buffers sampled waveform data without DMA contention. The industrial temperature range and on-chip RTC with backup domain support tamper detection and time-of-use billing.
推荐
Building Automation Gateways
The ATSAM4SD32CA-CUR fits BACnet, KNX, and Modbus building-automation gateways because its multiple USART, SPI, and TWI interfaces support concurrent fieldbus connections. The 10/100 Ethernet MAC provides the IP backbone, and 2 MB Flash stores the full protocol stack plus web-based configuration UI. The Cortex-M4 handles JSON parsing for REST API integration with cloud BMS platforms. Compared to a multi-MCU approach, the single-chip design lowers BOM cost and simplifies EMC compliance.
推荐
Data Acquisition Loggers
The ATSAM4SD32CA-CUR suits portable data-acquisition loggers because its 1 Msps 16-bit ADC captures multi-channel analog data while 160 KB SRAM buffers samples between SD card writes via SPI. The 2 MB Flash stores the acquisition firmware and on-device analysis scripts. The peripheral DMA controller moves ADC samples to memory without CPU intervention, leaving the Cortex-M4 free for FFT and statistical processing. Battery operation is supported by the on-chip voltage regulator with low-power modes down to a few µA in backup mode.
推荐
Motor Drive Controllers
The ATSAM4SD32CA-CUR serves as a low-cost motor-drive controller for BLDC, PMSM, and stepper applications in sub-1 kW ranges. The Cortex-M4 DSP extensions execute single-cycle Park/Clarke transforms and space-vector PWM generation, while the 16-bit ADC samples phase currents synchronously with PWM. The 2 MB Flash stores sensorless FOC libraries plus application code, and the industrial temperature range covers integrated motor-module environments. A separate gate driver IC like the IRS2003 is required for the high-voltage power stage.
推荐
推荐产品汇总
工程参考数据： ATSAM4SD32CA-CUR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAM4SD32CA-CUR-Q | ATSAM4S16CA-CUR | ATSAM4S8CA-CU | ATSAM4SD32CA-AUR | ATSAM4SD32CA-CU |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Flash Memory | 2 MB | 2 MB | 1 MB (-50%) | 512 KB (-75%) | 2 MB | 2 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB (-20%) | 160 KB | 160 KB |
| Maximum CPU Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Automotive Grade (AEC-Q100) | No | Yes (AEC-Q100) | No | No | No | No |
| Operating Temperature | -40C to +85C | -40C to +105C (Grade 2) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging Form | Tape & Reel (13-inch) | Tape & Reel | Tape & Reel | Tray (CU suffix) | Tape & Reel (AUR suffix) | Tray (CU suffix) |
关键差异点
- Largest Flash density in SAM4S TFBGA-100 family （对比 ATSAM4S16CA-CUR)
- Automotive-qualified drop-in variant available （对比 ATSAM4SD32CA-CUR-Q)
- Same family architecture as ATSAM4S16CA-CUR with larger memory （对比 ATSAM4S8CA-CU)
设计说明
The 100-ball TFBGA package requires a minimum 4-layer PCB with continuous GND plane beneath the BGA for both power delivery and thermal dissipation. Route the USB DP/DN differential pair with 90 ohm differential impedance and matched length within 150 mils to meet USB 2.0 spec. Place 100 nF + 4.7 uF decoupling capacitors within 2 mm of every VDD/VDDIO ball pair. Use 0.5 mm pitch BGA escape routing on the top layer with microvia-in-pad if available; otherwise dog-bone fanout requires 0.8 mm pitch minimum trace/space.
Estimated: at 120 MHz with all peripherals active, the ATSAM4SD32CA-CUR dissipates approximately 200-300 mW in normal operation. The TFBGA-100 package has a typical theta_JA of 30-35 C/W on a 4-layer JEDEC test board, yielding a junction-temperature rise of 6-10 C above ambient at typical industrial operating conditions. For sealed enclosures without airflow, derate CPU clock or duty-cycle peripherals to maintain junction temperature below 100 C (TJ_max = 125 C, leaving 25 C margin).
Do not apply power to the ATSAM4SD32CA-CUR without first programming the supply controller - brown-out during Flash programming can corrupt the Flash content lock bits and brick the device until a full chip erase. Always use the SAM-BA bootloader or JTAG/SWD with a verified image before disconnecting the debugger. Avoid using NRST as a GPIO on prototype boards - early Atmel errata documents flagged pin-contention issues if NRST is repurposed before the bootloader completes initialization.
The ATSAM4SD32CA-CUR has separate VDDIO (1.62-3.6 V) and VDDCORE pins - VDDCORE is supplied by the on-chip 1.2 V regulator from VDDIO but requires an external 1 uF + 100 nF decoupling pair close to the balls. In backup mode (RTC running, CPU off), current drops to approximately 2-4 uA at 3.3 V. Use the supply controller (SUPC) sleepwalking mode to wake on RTC alarm while keeping RAM retention.
合规信息
RoHS compliant per Microchip product page. Standard grade is not AEC-Q100 - choose ATSAM4SD32CA-CUR-Q for automotive.
