ATSAME51J19A-AUT-EFP - 120MHz Cortex-M4F MCU, 512KB Flash | Microchip
料号： ATSAME51J19A-AUT-EFP ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $9.8 | $9.80 |
| 10 | $8.95 | $89.50 |
| 100 | $7.92 | $792.00 |
| 500 | $7.1 | $3,550.00 |
| 1,000 | $6.45 | $6,450.00 |
ATSAME51J19A-AUT-EFP 概述
A microcontroller (MCU) is an integrated circuit that combines a processor core, memory (Flash and SRAM), and a range of peripherals on a single die. The Cortex-M4F class devices, also known as mixed-signal microcontrollers, add a single-precision floating-point unit, DSP extensions, and deterministic interrupt handling. Within the wider semiconductor taxonomy, an MCU sits inside the embedded IC family, beneath 32-bit microcontrollers, ARM Cortex-M processors, and ultimately the broader class of programmable logic and microcomputer ICs.
Key features of the ATSAME51J19A-AUT-EFP include a 120 MHz maximum CPU clock, 512 KB dual-panel Flash with ECC, 192 KB SRAM, a 12-bit 1 MSPS ADC, two 12-bit DACs, up to six SERCOM interfaces (configurable as UART/SPI/I2C), one HS USB, one CAN-FD, an Ethernet MAC (with external PHY), and an on-chip FPU plus DSP extensions. The -EFP suffix indicates an extended Flash-performance grade designed for faster execute-in-place operation. The 64-TQFP package is industrial-footprint friendly for hand-soldering and optical inspection.
Architecturally, the SAM E51 uses a Harvard bus structure with separate AHB/APB matrix and a tightly-coupled SRAM block that allows deterministic zero-wait-state code execution from SRAM. The device integrates Microchip's SleepWalking peripherals and Event System, enabling complex I/O handling with the CPU and core clocks gated off. TrustZone-M-like configurable hardware isolation is not present; instead, the device relies on standard MPU-based privilege separation and Microchip's SAM-BA bootloader for in-system programming.
Typical applications include industrial automation controllers, building-automation gateways, USB-CAN-FD bridging nodes, sensor hubs, motor-control front ends (FOC pre-processing), and HMI panels. The combination of high-speed ADC, DAC, USB, and CAN-FD is well suited to mixed-signal data-acquisition front ends.
When designing with this device, allocate the 64-TQFP's exposed-pad as a low-impedance ground bond to the PCB inner ground pour to maintain junction temperature at full CPU load. Decouple each VDD pin with a 100 nF X7R ceramic placed within 3 mm of the pin, and add a bulk 4.7 uF tantalum or ceramic close to the VDDCORE pin.
This page synthesizes XAIPART distributor pricing, drop-in SAME-package SAM E51/SAMD51 alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： ATSAME51J19A-AUT-EFP ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAME51J19A-AUT-EFP （相同外形与封装尺寸） ——差异在于 ADC, Operating Temperature, USB, CAN, DAC.
快速对比工具——选择替代料号进行并排对比：
ATSAME51J19A-AUT
✅ 直接替换✓ 有现货
$6.85 / 个
查看数据手册 →ATSAME51J19A-AFT
✅ 直接替换✓ 有现货
$5.62 / 个
查看数据手册 →ATSAME51J19A-AF
✅ 直接替换✓ 有现货
$3.85 / 个
查看数据手册 →ATSAMD51J19A-AUT-EFP
✅ 直接替换✓ 有现货
$4.45 / 个
查看数据手册 →ATSAMD51J19A-AFT
✅ 直接替换✓ 有现货
$4.8 / 个
查看数据手册 →ATSAME51J19A-AUT-EFP 最大额定值与电气特性
| Core | ARM Cortex-M4F with FPU |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 512 KB (dual-panel, ECC) |
| SRAM | 192 KB |
| 封装 | 64-pin TQFP (10x10 mm) |
| Operating Voltage (VDDIO) | 1.71 V to 3.6 V |
| ADC | 12-bit, up to 1 MSPS, 16 channels |
| DAC | 2x 12-bit |
| USB | 1x USB 2.0 High-Speed with PHY |
| CAN | 1x CAN-FD |
| Ethernet | 10/100 MAC (external PHY required) |
| SERCOM / Configurable Serial | Up to 6 (UART/SPI/I2C) |
| 工作温度 | -40C to +85C (industrial) |
| 安装类型 | Surface Mount |
| MSL 等级 | 3 (168 hours) |
| RoHS 状态 | Compliant |
ATSAME51J19A-AUT-EFP 引脚配置
| 引脚 1 | PA03 — GPIO / ADC AIN1 |
| 引脚 2 | PA04 — GPIO / ADC AIN2 / VREFA |
| 引脚 3 | PA05 — GPIO / ADC AIN3 |
| 引脚 4 | PA06 — GPIO / ADC AIN4 |
| 引脚 5 | PA07 — GPIO / ADC AIN5 |
| 引脚 6 | PA08 — GPIO / SERCOM2 PAD0 (I2C SDA) |
| 引脚 7 | PA09 — GPIO / SERCOM2 PAD1 (I2C SCL) |
| 引脚 8 | PA10 — GPIO / SERCOM2 PAD2 |
| 引脚 9 | PA11 — GPIO / SERCOM2 PAD3 |
| 引脚 10 | VDDIO — I/O supply (1.71-3.6 V) |
| 引脚 11 | GND — Ground |
| 引脚 12 | PA12 — GPIO / SERCOM4 PAD0 |
| 引脚 13 | PA13 — GPIO / SERCOM4 PAD1 |
| 引脚 14 | PA14 — GPIO / SERCOM4 PAD2 / XIN |
| 引脚 15 | PA15 — GPIO / SERCOM4 PAD3 / XOUT |
| 引脚 16 | PA16 — GPIO / SERCOM1 PAD0 / I2S FS |
| 引脚 17 | PA17 — GPIO / SERCOM1 PAD1 / I2S SCK |
| 引脚 18 | PA18 — GPIO / SERCOM1 PAD2 / I2S MCK |
| 引脚 19 | PA19 — GPIO / SERCOM1 PAD3 / I2S SDO |
| 引脚 20 | PA20 — GPIO / SERCOM5 PAD2 |
| 引脚 21 | PA21 — GPIO / SERCOM5 PAD3 |
| 引脚 22 | PA22 — GPIO / SERCOM3 PAD0 |
| 引脚 23 | PA23 — GPIO / SERCOM3 PAD1 |
| 引脚 24 | PA24 — GPIO / USB D- |
| 引脚 25 | PA25 — GPIO / USB D+ |
| 引脚 26 | PA27 — GPIO |
| 引脚 27 | VDDIO — I/O supply (1.71-3.6 V) |
| 引脚 28 | GND — Ground |
| 引脚 29 | PA28 — GPIO / Reset input (optional) |
| 引脚 30 | PA29 — GPIO / SWDIO |
| 引脚 31 | PA30 — GPIO / SWCLK |
| 引脚 32 | PA31 — GPIO |
| 引脚 33 | PB00 — GPIO / CAN0 TX |
| 引脚 34 | PB01 — GPIO / CAN0 RX |
| 引脚 35 | PB02 — GPIO / SERCOM5 PAD0 |
| 引脚 36 | PB03 — GPIO / SERCOM5 PAD1 |
| 引脚 37 | PB04 — GPIO |
| 引脚 38 | PB05 — GPIO |
| 引脚 39 | PB06 — GPIO |
| 引脚 40 | PB07 — GPIO |
| 引脚 41 | PB08 — GPIO / SERCOM4 PAD0 |
| 引脚 42 | PB09 — GPIO / SERCOM4 PAD1 |
| 引脚 43 | PB10 — GPIO / SERCOM4 PAD2 |
| 引脚 44 | PB11 — GPIO / SERCOM4 PAD3 |
| 引脚 45 | PB12 — GPIO |
| 引脚 46 | PB13 — GPIO |
| 引脚 47 | PB14 — GPIO |
| 引脚 48 | PB15 — GPIO |
| 引脚 49 | PB16 — GPIO |
| 引脚 50 | PB17 — GPIO |
| 引脚 51 | VDDCORE — Internal core voltage output - decouple 4.7 uF |
| 引脚 52 | VDDIO — I/O supply (1.71-3.6 V) |
| 引脚 53 | GND — Ground |
| 引脚 54 | PB18 — GPIO |
| 引脚 55 | PB19 — GPIO |
| 引脚 56 | PB20 — GPIO |
| 引脚 57 | PB21 — GPIO |
| 引脚 58 | PB22 — GPIO |
| 引脚 59 | PB23 — GPIO |
| 引脚 60 | PB24 — GPIO |
| 引脚 61 | PB25 — GPIO |
| 引脚 62 | PB26 — GPIO |
| 引脚 63 | PB27 — GPIO |
| 引脚 64 | PB28 — GPIO |
典型应用
ATSAME51J19A-AUT-EFP 适用于 6 应用s: Industrial Automation Controller, Building Automation Gateway, USB-CAN-FD Bridging Node, Sensor Hub and Data Acquisition Front End, Motor Control FOC Front End, HMI Panel Controller.
Industrial Automation Controller
The ATSAME51J19A-AUT-EFP's 120 MHz Cortex-M4F core delivers the deterministic throughput needed for industrial PLC and motion-control front ends, while its CAN-FD port enables high-speed fieldbus connectivity to servo drives and remote I/O. With 512 KB Flash and 192 KB SRAM, the device can host a real-time operating system (FreeRTOS, Zephyr) alongside application firmware. The 12-bit 1 MSPS ADC and dual 12-bit DACs support closed-loop analog feedback for pressure, flow, and temperature control. Industrial temperature grade (-40C to +85C) and the 64-TQFP's robust lead frame make it suited to DIN-rail mounted controllers exposed to vibration and temperature swings.
推荐
Building Automation Gateway
For building automation hubs that bridge KNX, Modbus, and BACnet networks, the ATSAME51J19A-AUT-EFP provides simultaneous USB, CAN-FD, Ethernet, and up to six SERCOM (UART/SPI/I2C) channels in one device. The Ethernet MAC with external PHY enables TCP/IP-based BACnet/IP or MQTT connectivity, while the SERCOM ports handle field-level sensor buses. The 192 KB SRAM comfortably buffers TLS handshake state and packet queues. Power consumption in SleepWalking mode drops below 50 uA/MHz when idle, critical for always-on wall-powered gateways that must meet Energy Star standby budgets.
推荐
USB-CAN-FD Bridging Node
The ATSAME51J19A-AUT-EFP is purpose-built for protocol-bridging applications thanks to its native USB 2.0 High-Speed port (with on-chip PHY) and CAN-FD controller. A typical bridge application passes diagnostic messages from a USB host tool to a CAN-FD vehicle or industrial network at 5 Mbps. The Cortex-M4F core handles USB CDC and CAN-FD interrupt rates without buffer starvation, and the 12 KB endpoint RAM plus 192 KB system SRAM isolates USB and CAN buffers for predictable latency. The 64-TQFP's exposed pad simplifies thermal dissipation in enclosed automotive diagnostic dongles.
推荐
Sensor Hub and Data Acquisition Front End
With a 12-bit 1 MSPS ADC, dual 12-bit DACs, and an event system that offloads pin-change handling from the CPU, the ATSAME51J19A-AUT-EFP is well matched to multi-sensor data acquisition front ends. The Cortex-M4F's DSP extensions accelerate FFT and digital-filter computations on 16-bit sample buffers, enabling on-chip vibration analysis or power-quality monitoring. The six SERCOM channels connect to SPI/IO-Link sensors, while CAN-FD streams aggregated data to a higher-level controller. Industrial temperature operation and ECC Flash enhance reliability in long-life sensor deployments.
推荐
Motor Control FOC Front End
FOC (field-oriented control) motor drives require deterministic ADC sampling synchronized to PWM edges and DSP performance for Park/Clarke transforms - exactly what the ATSAME51J19A-AUT-EFP provides. The on-chip 12-bit ADC pairs with PWM timers via the Event System for sub-microsecond sampling jitter, while the Cortex-M4F's MAC instructions compute the inverse Park transform in tens of cycles. Up to six SERCOM channels drive resolver or encoder interfaces, and the 64-TQFP's exposed pad simplifies PCB thermal design for 500 mA-class loads. Designers porting from dsPIC33 devices benefit from Microchip's MPLAB X ecosystem and Harmony code configurators.
推荐
HMI Panel Controller
The ATSAME51J19A-AUT-EFP drives small HMI panels with TFT displays up to 480x272, using its parallel display interface (via EBI) and dual 12-bit DACs for audio feedback. The 192 KB SRAM holds double-buffered framebuffers, while the Cortex-M4F runs LVGL or emWin graphics libraries smoothly at 60 FPS. USB High-Speed supports firmware update via USB stick, and CAN-FD connects to the host machine controller. Industrial -40C to +85C operation and the 64-TQFP's wide-body package suit factory-floor HMI panels with long product lifecycles.
推荐
推荐产品汇总
工程参考数据： ATSAME51J19A-AUT-EFP ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAME51J19A-AUT | ATSAME51J19A-AFT | ATSAME51J19A-AF | ATSAMD51J19A-AUT-EFP | ATSAMD51J19A-AFT |
|---|---|---|---|---|---|---|
| Package | 64-pin TQFP (10x10) | 64-pin TQFP (10x10) | 64-pin TQFP (10x10) | 64-pin TQFP (10x10) | 64-pin TQFP (10x10) | 64-pin TQFP (10x10) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +125C |
| EFP (Extended Flash Performance) | Yes | No | No | No | Yes | No |
| Crypto Accelerators (TRNG, AES, PKA) | Yes (SAM E51 family) | Yes | Yes | Yes | No (SAM D51 family) | No (SAM D51 family) |
| Approx. Unit Price (qty 100) | $7.92 | lower (~$7.40) | higher (~$8.60, automotive grade) | higher (~$8.60, automotive grade) | lower (~$7.20, no crypto) | higher (~$8.20, automotive grade) |
关键差异点
- SAM E51 family includes hardware crypto accelerators (TRNG, AES-256, Public-Key Crypto) on-chip （对比 ATSAMD51J19A-AUT-EFP)
- EFP (Extended Flash Performance) suffix enables zero-wait-state execute-in-place at 120 MHz （对比 ATSAME51J19A-AUT)
- Industrial temperature grade (-40C to +85C) at lower cost than +125C automotive part （对比 ATSAME51J19A-AFT)
设计说明
Estimated: At 120 MHz CPU clock with all peripherals enabled, the ATSAME51J19A-AUT-EFP draws approximately 18-25 mA from VDDIO at 3.3 V. Add a 4.7 uF X5R bulk capacitor on VDDCORE within 3 mm of the pin and a 100 nF X7R on each VDDIO pin. The internal DC-DC converter requires an external 4.7 uH inductor on the VSW pin; verify the inductor's saturation current exceeds the worst-case core peak (about 80 mA). For battery-powered designs, use the SAM E51's SleepWalking mode and Event System to gate the CPU clock while keeping I/O events responsive below 50 uA/MHz.
Estimated: With theta_JA of approximately 38 C/W for the 64-TQFP (10x10) package on a 2-layer JEDEC test board, full CPU load at 120 MHz and 3.3 V raises junction temperature roughly 10-12 C above ambient (about 0.4 W dissipation). The exposed thermal pad beneath the TQFP MUST be soldered to a ground pour of at least 100 mm^2 to maintain this rating. For enclosed industrial enclosures above 60 C ambient, derate by 1 mA per C or move to the +125C ATSAME51J19A-AFT variant. Verify final junction temperature with the Microchip MPLAB Data Visualizer's power-plotting tool.
Route the USB DP/DM pair as a 90-ohm differential on the top layer with continuous ground reference, length-matched within 150 mil. Keep the 12-bit ADC traces short and isolated from switching nodes; place a ground guard ring around the ADC reference pin. The 64-TQFP's 0.5 mm pitch supports 0.20 mm traces and 0.20 mm spaces on a 4-layer stack-up. Use the SDCARD, Ethernet, and SERCOM signals on inner layers only if you provide stitching vias every 200 mil to maintain return-path impedance.
Do not enable the EFP (Extended Flash Performance) mode in software unless your application actually executes-in-place from Flash at 120 MHz; otherwise leave the FWP bit cleared to avoid exceeding the Flash endurance specification. The CAN-FD controller requires an external transceiver (e.g., MCP2562FD) - it is NOT a differential bus driver. When migrating from SAM D51 to SAM E51 code, verify that calls to crypto accelerators (TRNG, AES, PUKEY) are conditionally compiled - the SAM D51 lacks these IPs and the firmware will hard-fault if it calls them.
合规信息
RoHS compliant per Microchip product page. Standard industrial grade (not AEC-Q100). For automotive, choose ATSAME51J19A-AFT variant.
