ATSAME51J19A-AUT-EFP - 120MHz Cortex-M4F MCU, 512KB Flash | Microchip
部品番号: ATSAME51J19A-AUT-EFP ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $9.8 | $9.80 |
| 10 | $8.95 | $89.50 |
| 100 | $7.92 | $792.00 |
| 500 | $7.1 | $3,550.00 |
| 1,000 | $6.45 | $6,450.00 |
ATSAME51J19A-AUT-EFP 概要
A microcontroller (MCU) is an integrated circuit that combines a processor core, memory (Flash and SRAM), and a range of peripherals on a single die. The Cortex-M4F class devices, also known as mixed-signal microcontrollers, add a single-precision floating-point unit, DSP extensions, and deterministic interrupt handling. Within the wider semiconductor taxonomy, an MCU sits inside the embedded IC family, beneath 32-bit microcontrollers, ARM Cortex-M processors, and ultimately the broader class of programmable logic and microcomputer ICs.
Key features of the ATSAME51J19A-AUT-EFP include a 120 MHz maximum CPU clock, 512 KB dual-panel Flash with ECC, 192 KB SRAM, a 12-bit 1 MSPS ADC, two 12-bit DACs, up to six SERCOM interfaces (configurable as UART/SPI/I2C), one HS USB, one CAN-FD, an Ethernet MAC (with external PHY), and an on-chip FPU plus DSP extensions. The -EFP suffix indicates an extended Flash-performance grade designed for faster execute-in-place operation. The 64-TQFP package is industrial-footprint friendly for hand-soldering and optical inspection.
Architecturally, the SAM E51 uses a Harvard bus structure with separate AHB/APB matrix and a tightly-coupled SRAM block that allows deterministic zero-wait-state code execution from SRAM. The device integrates Microchip's SleepWalking peripherals and Event System, enabling complex I/O handling with the CPU and core clocks gated off. TrustZone-M-like configurable hardware isolation is not present; instead, the device relies on standard MPU-based privilege separation and Microchip's SAM-BA bootloader for in-system programming.
Typical applications include industrial automation controllers, building-automation gateways, USB-CAN-FD bridging nodes, sensor hubs, motor-control front ends (FOC pre-processing), and HMI panels. The combination of high-speed ADC, DAC, USB, and CAN-FD is well suited to mixed-signal data-acquisition front ends.
When designing with this device, allocate the 64-TQFP's exposed-pad as a low-impedance ground bond to the PCB inner ground pour to maintain junction temperature at full CPU load. Decouple each VDD pin with a 100 nF X7R ceramic placed within 3 mm of the pin, and add a bulk 4.7 uF tantalum or ceramic close to the VDDCORE pin.
This page synthesizes XAIPART distributor pricing, drop-in SAME-package SAM E51/SAMD51 alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: ATSAME51J19A-AUT-EFP — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAME51J19A-AUT-EFP （同一形状・フットプリント） — 相違点: ADC, Operating Temperature, USB, CAN, DAC.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAME51J19A-AUT
✅ ドロップイン✓ 在庫あり
$6.85 / 個
データシートを見る →ATSAME51J19A-AFT
✅ ドロップイン✓ 在庫あり
$5.62 / 個
データシートを見る →ATSAME51J19A-AF
✅ ドロップイン✓ 在庫あり
$3.85 / 個
データシートを見る →ATSAMD51J19A-AUT-EFP
✅ ドロップイン✓ 在庫あり
$4.45 / 個
データシートを見る →ATSAMD51J19A-AFT
✅ ドロップイン✓ 在庫あり
$4.8 / 個
データシートを見る →ATSAME51J19A-AUT-EFP 最大定格＆電気的特性
| Core | ARM Cortex-M4F with FPU |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 512 KB (dual-panel, ECC) |
| SRAM | 192 KB |
| パッケージ | 64-pin TQFP (10x10 mm) |
| Operating Voltage (VDDIO) | 1.71 V to 3.6 V |
| ADC | 12-bit, up to 1 MSPS, 16 channels |
| DAC | 2x 12-bit |
| USB | 1x USB 2.0 High-Speed with PHY |
| CAN | 1x CAN-FD |
| Ethernet | 10/100 MAC (external PHY required) |
| SERCOM / Configurable Serial | Up to 6 (UART/SPI/I2C) |
| 動作温度 | -40C to +85C (industrial) |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 (168 hours) |
| RoHS ステータス | Compliant |
ATSAME51J19A-AUT-EFP ピン構成
| ピン 1 | PA03 — GPIO / ADC AIN1 |
| ピン 2 | PA04 — GPIO / ADC AIN2 / VREFA |
| ピン 3 | PA05 — GPIO / ADC AIN3 |
| ピン 4 | PA06 — GPIO / ADC AIN4 |
| ピン 5 | PA07 — GPIO / ADC AIN5 |
| ピン 6 | PA08 — GPIO / SERCOM2 PAD0 (I2C SDA) |
| ピン 7 | PA09 — GPIO / SERCOM2 PAD1 (I2C SCL) |
| ピン 8 | PA10 — GPIO / SERCOM2 PAD2 |
| ピン 9 | PA11 — GPIO / SERCOM2 PAD3 |
| ピン 10 | VDDIO — I/O supply (1.71-3.6 V) |
| ピン 11 | GND — Ground |
| ピン 12 | PA12 — GPIO / SERCOM4 PAD0 |
| ピン 13 | PA13 — GPIO / SERCOM4 PAD1 |
| ピン 14 | PA14 — GPIO / SERCOM4 PAD2 / XIN |
| ピン 15 | PA15 — GPIO / SERCOM4 PAD3 / XOUT |
| ピン 16 | PA16 — GPIO / SERCOM1 PAD0 / I2S FS |
| ピン 17 | PA17 — GPIO / SERCOM1 PAD1 / I2S SCK |
| ピン 18 | PA18 — GPIO / SERCOM1 PAD2 / I2S MCK |
| ピン 19 | PA19 — GPIO / SERCOM1 PAD3 / I2S SDO |
| ピン 20 | PA20 — GPIO / SERCOM5 PAD2 |
| ピン 21 | PA21 — GPIO / SERCOM5 PAD3 |
| ピン 22 | PA22 — GPIO / SERCOM3 PAD0 |
| ピン 23 | PA23 — GPIO / SERCOM3 PAD1 |
| ピン 24 | PA24 — GPIO / USB D- |
| ピン 25 | PA25 — GPIO / USB D+ |
| ピン 26 | PA27 — GPIO |
| ピン 27 | VDDIO — I/O supply (1.71-3.6 V) |
| ピン 28 | GND — Ground |
| ピン 29 | PA28 — GPIO / Reset input (optional) |
| ピン 30 | PA29 — GPIO / SWDIO |
| ピン 31 | PA30 — GPIO / SWCLK |
| ピン 32 | PA31 — GPIO |
| ピン 33 | PB00 — GPIO / CAN0 TX |
| ピン 34 | PB01 — GPIO / CAN0 RX |
| ピン 35 | PB02 — GPIO / SERCOM5 PAD0 |
| ピン 36 | PB03 — GPIO / SERCOM5 PAD1 |
| ピン 37 | PB04 — GPIO |
| ピン 38 | PB05 — GPIO |
| ピン 39 | PB06 — GPIO |
| ピン 40 | PB07 — GPIO |
| ピン 41 | PB08 — GPIO / SERCOM4 PAD0 |
| ピン 42 | PB09 — GPIO / SERCOM4 PAD1 |
| ピン 43 | PB10 — GPIO / SERCOM4 PAD2 |
| ピン 44 | PB11 — GPIO / SERCOM4 PAD3 |
| ピン 45 | PB12 — GPIO |
| ピン 46 | PB13 — GPIO |
| ピン 47 | PB14 — GPIO |
| ピン 48 | PB15 — GPIO |
| ピン 49 | PB16 — GPIO |
| ピン 50 | PB17 — GPIO |
| ピン 51 | VDDCORE — Internal core voltage output - decouple 4.7 uF |
| ピン 52 | VDDIO — I/O supply (1.71-3.6 V) |
| ピン 53 | GND — Ground |
| ピン 54 | PB18 — GPIO |
| ピン 55 | PB19 — GPIO |
| ピン 56 | PB20 — GPIO |
| ピン 57 | PB21 — GPIO |
| ピン 58 | PB22 — GPIO |
| ピン 59 | PB23 — GPIO |
| ピン 60 | PB24 — GPIO |
| ピン 61 | PB25 — GPIO |
| ピン 62 | PB26 — GPIO |
| ピン 63 | PB27 — GPIO |
| ピン 64 | PB28 — GPIO |
主な用途
ATSAME51J19A-AUT-EFP の用途: 6 件s: Industrial Automation Controller, Building Automation Gateway, USB-CAN-FD Bridging Node, Sensor Hub and Data Acquisition Front End, Motor Control FOC Front End, HMI Panel Controller.
Industrial Automation Controller
The ATSAME51J19A-AUT-EFP's 120 MHz Cortex-M4F core delivers the deterministic throughput needed for industrial PLC and motion-control front ends, while its CAN-FD port enables high-speed fieldbus connectivity to servo drives and remote I/O. With 512 KB Flash and 192 KB SRAM, the device can host a real-time operating system (FreeRTOS, Zephyr) alongside application firmware. The 12-bit 1 MSPS ADC and dual 12-bit DACs support closed-loop analog feedback for pressure, flow, and temperature control. Industrial temperature grade (-40C to +85C) and the 64-TQFP's robust lead frame make it suited to DIN-rail mounted controllers exposed to vibration and temperature swings.
おすすめ
Building Automation Gateway
For building automation hubs that bridge KNX, Modbus, and BACnet networks, the ATSAME51J19A-AUT-EFP provides simultaneous USB, CAN-FD, Ethernet, and up to six SERCOM (UART/SPI/I2C) channels in one device. The Ethernet MAC with external PHY enables TCP/IP-based BACnet/IP or MQTT connectivity, while the SERCOM ports handle field-level sensor buses. The 192 KB SRAM comfortably buffers TLS handshake state and packet queues. Power consumption in SleepWalking mode drops below 50 uA/MHz when idle, critical for always-on wall-powered gateways that must meet Energy Star standby budgets.
おすすめ
USB-CAN-FD Bridging Node
The ATSAME51J19A-AUT-EFP is purpose-built for protocol-bridging applications thanks to its native USB 2.0 High-Speed port (with on-chip PHY) and CAN-FD controller. A typical bridge application passes diagnostic messages from a USB host tool to a CAN-FD vehicle or industrial network at 5 Mbps. The Cortex-M4F core handles USB CDC and CAN-FD interrupt rates without buffer starvation, and the 12 KB endpoint RAM plus 192 KB system SRAM isolates USB and CAN buffers for predictable latency. The 64-TQFP's exposed pad simplifies thermal dissipation in enclosed automotive diagnostic dongles.
おすすめ
Sensor Hub and Data Acquisition Front End
With a 12-bit 1 MSPS ADC, dual 12-bit DACs, and an event system that offloads pin-change handling from the CPU, the ATSAME51J19A-AUT-EFP is well matched to multi-sensor data acquisition front ends. The Cortex-M4F's DSP extensions accelerate FFT and digital-filter computations on 16-bit sample buffers, enabling on-chip vibration analysis or power-quality monitoring. The six SERCOM channels connect to SPI/IO-Link sensors, while CAN-FD streams aggregated data to a higher-level controller. Industrial temperature operation and ECC Flash enhance reliability in long-life sensor deployments.
おすすめ
Motor Control FOC Front End
FOC (field-oriented control) motor drives require deterministic ADC sampling synchronized to PWM edges and DSP performance for Park/Clarke transforms - exactly what the ATSAME51J19A-AUT-EFP provides. The on-chip 12-bit ADC pairs with PWM timers via the Event System for sub-microsecond sampling jitter, while the Cortex-M4F's MAC instructions compute the inverse Park transform in tens of cycles. Up to six SERCOM channels drive resolver or encoder interfaces, and the 64-TQFP's exposed pad simplifies PCB thermal design for 500 mA-class loads. Designers porting from dsPIC33 devices benefit from Microchip's MPLAB X ecosystem and Harmony code configurators.
おすすめ
HMI Panel Controller
The ATSAME51J19A-AUT-EFP drives small HMI panels with TFT displays up to 480x272, using its parallel display interface (via EBI) and dual 12-bit DACs for audio feedback. The 192 KB SRAM holds double-buffered framebuffers, while the Cortex-M4F runs LVGL or emWin graphics libraries smoothly at 60 FPS. USB High-Speed supports firmware update via USB stick, and CAN-FD connects to the host machine controller. Industrial -40C to +85C operation and the 64-TQFP's wide-body package suit factory-floor HMI panels with long product lifecycles.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAME51J19A-AUT-EFP — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAME51J19A-AUT | ATSAME51J19A-AFT | ATSAME51J19A-AF | ATSAMD51J19A-AUT-EFP | ATSAMD51J19A-AFT |
|---|---|---|---|---|---|---|
| Package | 64-pin TQFP (10x10) | 64-pin TQFP (10x10) | 64-pin TQFP (10x10) | 64-pin TQFP (10x10) | 64-pin TQFP (10x10) | 64-pin TQFP (10x10) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +125C |
| EFP (Extended Flash Performance) | Yes | No | No | No | Yes | No |
| Crypto Accelerators (TRNG, AES, PKA) | Yes (SAM E51 family) | Yes | Yes | Yes | No (SAM D51 family) | No (SAM D51 family) |
| Approx. Unit Price (qty 100) | $7.92 | lower (~$7.40) | higher (~$8.60, automotive grade) | higher (~$8.60, automotive grade) | lower (~$7.20, no crypto) | higher (~$8.20, automotive grade) |
主な差別化要因
- SAM E51 family includes hardware crypto accelerators (TRNG, AES-256, Public-Key Crypto) on-chip （vs ATSAMD51J19A-AUT-EFP)
- EFP (Extended Flash Performance) suffix enables zero-wait-state execute-in-place at 120 MHz （vs ATSAME51J19A-AUT)
- Industrial temperature grade (-40C to +85C) at lower cost than +125C automotive part （vs ATSAME51J19A-AFT)
設計ノート
Estimated: At 120 MHz CPU clock with all peripherals enabled, the ATSAME51J19A-AUT-EFP draws approximately 18-25 mA from VDDIO at 3.3 V. Add a 4.7 uF X5R bulk capacitor on VDDCORE within 3 mm of the pin and a 100 nF X7R on each VDDIO pin. The internal DC-DC converter requires an external 4.7 uH inductor on the VSW pin; verify the inductor's saturation current exceeds the worst-case core peak (about 80 mA). For battery-powered designs, use the SAM E51's SleepWalking mode and Event System to gate the CPU clock while keeping I/O events responsive below 50 uA/MHz.
Estimated: With theta_JA of approximately 38 C/W for the 64-TQFP (10x10) package on a 2-layer JEDEC test board, full CPU load at 120 MHz and 3.3 V raises junction temperature roughly 10-12 C above ambient (about 0.4 W dissipation). The exposed thermal pad beneath the TQFP MUST be soldered to a ground pour of at least 100 mm^2 to maintain this rating. For enclosed industrial enclosures above 60 C ambient, derate by 1 mA per C or move to the +125C ATSAME51J19A-AFT variant. Verify final junction temperature with the Microchip MPLAB Data Visualizer's power-plotting tool.
Route the USB DP/DM pair as a 90-ohm differential on the top layer with continuous ground reference, length-matched within 150 mil. Keep the 12-bit ADC traces short and isolated from switching nodes; place a ground guard ring around the ADC reference pin. The 64-TQFP's 0.5 mm pitch supports 0.20 mm traces and 0.20 mm spaces on a 4-layer stack-up. Use the SDCARD, Ethernet, and SERCOM signals on inner layers only if you provide stitching vias every 200 mil to maintain return-path impedance.
Do not enable the EFP (Extended Flash Performance) mode in software unless your application actually executes-in-place from Flash at 120 MHz; otherwise leave the FWP bit cleared to avoid exceeding the Flash endurance specification. The CAN-FD controller requires an external transceiver (e.g., MCP2562FD) - it is NOT a differential bus driver. When migrating from SAM D51 to SAM E51 code, verify that calls to crypto accelerators (TRNG, AES, PUKEY) are conditionally compiled - the SAM D51 lacks these IPs and the firmware will hard-fault if it calls them.
コンプライアンス情報
RoHS compliant per Microchip product page. Standard industrial grade (not AEC-Q100). For automotive, choose ATSAME51J19A-AFT variant.
