CY8C6247BZI-D44 - PSoC 62 Dual-Core M4/M0+ MCU 1MB | Infineon
料号： CY8C6247BZI-D44 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.65 | $76.50 |
| 100 | $6.8 | $680.00 |
| 500 | $6.1 | $3,050.00 |
| 1,000 | $5.45 | $5,450.00 |
CY8C6247BZI-D44 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data memory, and programmable peripheral IP into one device. PSoC 6 belongs to a specialized MCU family that adds programmable analog (op-amps, ADCs, DACs), programmable digital blocks (UDBs, smart I/O), and hardware cryptographic accelerators on top of the standard Cortex-M subsystem. Within the broader taxonomy, PSoC 6 is a microcontroller -> embedded processor -> SoC -> semiconductor, designed for ultra-low-power human-machine-interface (HMI) and connected IoT end nodes.
Key features of the CY8C6247BZI-D44 include 1 MB Flash, 288 KB SRAM, hardware AES/SHA/RSA/TRNG for secure boot and secure element services, up to 8 KB of instruction cache, CapSense® capacitive touch support, USB Full-Speed device, and a 2D graphics accelerator for TFT HMI panels. The device integrates a 12-bit SAR ADC, four op-amps, two low-power comparators, and up to 60 programmable GPIOs, enabling single-chip HMI + connectivity designs.
The dual-core architecture allows deterministic real-time response on the M0+ (BLE stack, motor control loops, CapSense scanning) while the M4 executes user-interface logic, graphics, or RTOS-driven application code. Built-in power-management modes include Deep Sleep at sub-µA currents with RTC and SRAM retention, making the part suitable for battery-powered door locks, wearables, and industrial sensors that must wake on touch or interrupt without rebooting.
Typical applications include smart door locks (BLE + capacitive keypad + secure element), wearables, smart home HMI panels, industrial sensor hubs, and low-power wireless IoT end nodes. Designers use ModusToolbox and PSoC Creator to configure peripherals graphically and generate peripheral driver libraries.
When designing with this device, allocate the M4 core for graphics and protocol stacks while keeping the M0+ for CapSense scanning and radio event servicing to minimize average power. Use the cryptographic accelerator for firmware authenticity verification at boot and store keys in the secure execution environment to protect against physical tampering.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not consolidated in any single Infineon document.
直接替换替代料： CY8C6247BZI-D44 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： CY8C6247BZI-D44 （相同外形与封装尺寸） ——差异在于 Core Architecture, Operating Voltage, Package.
快速对比工具——选择替代料号进行并排对比：
CY8C6247BZI-D54
✅ 直接替换✓ 有现货
$7.65 / 个
查看数据手册 →CY8C6267BZI-D44
✅ 直接替换📋 参考替代料（不在目录中）
CY8C6244BZI-D44
✅ 直接替换📋 参考替代料（不在目录中）
CY8C6245BZI-D44
✅ 直接替换📋 参考替代料（不在目录中）
CY8C6247BZI-D44T
✅ 直接替换📋 参考替代料（不在目录中）
CY8C6247BZI-D44 最大额定值与电气特性
| Core Architecture | ARM Cortex-M4 (150 MHz) + Cortex-M0+ (100 MHz) dual-core |
| Program Memory (Flash) | 1024 KB (1 MB) |
| SRAM | 288 KB |
| Instruction Cache | 8 KB |
| 封装 | 124-ball VFBGA (9x9 mm) |
| 安装类型 | Surface Mount |
| Operating Voltage | 1.7 V to 3.6 V |
| 工作温度 | -40 C to +85 C |
| GPIOs | Up to 60 (programmable) |
| ADC | 12-bit SAR, 1 Msps |
| Hardware Crypto | AES-128/256, SHA-256, RSA, ECC, TRNG |
| Secure Boot | Yes (hardware-rooted) |
| USB | USB 2.0 Full-Speed device |
| CapSense Support | Yes (5th generation) |
| Graphics Accelerator | Yes (2D, partial-frame) |
| RoHS 状态 | Compliant |
CY8C6247BZI-D44 124-ball vfbga (9x9 mm) 引脚配置指南
CY8C6247BZI-D44（124-ball vfbga (9x9 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： CY8C6247BZI-D44.
请参阅 数据手册 以查看完整引脚配置。
典型应用
CY8C6247BZI-D44 适用于 6 应用s: Smart Door Lock Controller, Wearable Fitness Tracker, Industrial HMI Touch Panel, Smart Home Sensor Hub, Connected Medical Monitor, Battery-Powered IoT End Node.
Smart Door Lock Controller
The CY8C6247BZI-D44 is the reference MCU for Infineon's smart door lock solution because it pairs a 150 MHz Cortex-M4 host with a low-power 100 MHz Cortex-M0+ network core. CapSense 5th-generation hardware scans capacitive keypads without an external touch IC, while the AES/SHA/TRNG accelerator secures the lock against firmware tampering. Deep Sleep current under 5 µA with RTC retention lets four AA cells run for more than a year. The M4 runs the BLE host stack via an AIROC companion module; the M0+ handles scan + radio events deterministically. Developers use ModusToolbox and the CY8CKIT-062S2-43012 kit to prototype a complete lock reference design in days.
推荐
Wearable Fitness Tracker
Wearables need an MCU that can stay in deep sleep most of the time and wake to read optical sensors, run a small display, and connect over BLE without draining the coin cell. The CY8C6247BZI-D44's Deep Sleep sub-5 µA and Hibernate sub-1 µA modes extend runtime, while its 150 MHz M4 heart executes graphics and BLE host code. The 12-bit SAR ADC samples pulse-oximetry and heart-rate photodiode signals at low power; the 288 KB SRAM buffers display frames and activity logs. The 124-ball VFBGA package footprint fits 20x20 mm wearable PCBs, and ModusToolbox includes a turnkey BSP for OLED display + BLE HID profiles.
推荐
Industrial HMI Touch Panel
Factory operator panels demand a TFT display, capacitive touch, and rugged connectivity. The CY8C6247BZI-D44's integrated 2D graphics accelerator drives QVGA/WQVGA TFT panels without a separate GPU, and the 5th-generation CapSense IP reads multi-touch sliders even through thick glass. The dual-core split keeps the M0+ servicing CapSense scan and CAN at deterministic intervals while the M4 renders UI widgets. Hardware AES-256 and secure boot protect firmware from field tampering. The 124-ball VFBGA 9x9 mm footprint and -40 C to +85 C industrial rating suit DIN-rail and panel-mount enclosures. ModusToolbox middleware supports Segger emWin and LVGL GUI stacks out of the box.
推荐
Smart Home Sensor Hub
A multi-protocol sensor hub must wake on motion or sound, aggregate readings, and push them over BLE or Wi-Fi. The CY8C6247BZI-D44's M0+ core polls I2C/SPI sensors at low MHz and triggers the M4 only on interesting events, keeping average power low. The 12-bit 1 Msps SAR ADC scans analog channels, while hardware crypto accelerators authenticate over-the-air firmware updates. The 1 MB Flash stores edge-AI inference models for occupancy detection or acoustic event classification. Designers pair the MCU with a CYW43012 or external Wi-Fi module and use the on-chip 288 KB SRAM for rolling buffers.
推荐
Connected Medical Monitor
Patient monitors require IEC 60601-1-isolated data paths, deterministic BLE links, and long battery life. The CY8C6247BZI-D44's hardware AES-256 and SHA-256 accelerate HIPAA-friendly encryption of patient telemetry. The dual-core M4+M0+ scheme dedicates the M0+ to always-on vitals sampling at fixed cadence while the M4 runs BLE host and display update. Hardware capacitive touch drives the front-panel user interface, eliminating mechanical buttons. ModusToolbox middleware includes FDA-ready firmware reference libraries. The 124-ball VFBGA footprint suits 25x35 mm handheld enclosures, and the -40 C to +85 C rating covers clinical and field environments.
推荐
Battery-Powered IoT End Node
Battery-powered wireless sensor nodes spend 99% of their time asleep, waking to take a reading and transmit a packet. The CY8C6247BZI-D44 supports this profile through Hibernate (sub-1 µA with RTC) and Deep Sleep (sub-5 µA with SRAM retention) modes. On wake, the M4 runs an AI inference or compressed-sensor pipeline at 150 MHz and hands the encrypted packet to an external AIROC radio. The 1 MB Flash stores LoRaWAN MAC keys, calibration data, and edge-AI model weights. ModusToolbox includes LoRaWAN, Zigbee, and Matter SDKs for rapid prototyping. The 124-ball VFBGA 9x9 mm package suits miniaturized IP65 enclosures for outdoor deployment.
推荐
推荐产品汇总
工程参考数据： CY8C6247BZI-D44 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | CY8C6247BZI-D54 | CY8C6267BZI-D44 | CY8C6244BZI-D44 | CY8C6245BZI-D44 | CY8C6247BZI-D44T |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | 124-ball VFBGA (9x9 mm) | 124-ball VFBGA (9x9 mm) - same | 124-ball VFBGA (9x9 mm) - same | 124-ball VFBGA (9x9 mm) - same | 124-ball VFBGA (9x9 mm) - same | 124-ball VFBGA (9x9 mm) - same |
| Core Architecture | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz |
| Flash | 1024 KB | 1024 KB | 1024 KB | 512 KB | 768 KB | 1024 KB |
| SRAM | 288 KB | 288 KB | 288 KB | 288 KB | 288 KB | 288 KB |
| Bluetooth LE | External (via AIROC companion) | External | External | External | External | External |
| CapSense | Yes (5th gen) | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
关键差异点
- 1 MB Flash with 288 KB SRAM at full M4 150 MHz speed （对比 CY8C6244BZI-D44)
- Drop-in compatibility with the CY8C6247BZI-D54 （对比 CY8C6247BZI-D54)
- Mature PSoC 62 platform with Infineon ModusToolbox support （对比 CY8C6247BZI-D44T)
设计说明
Use the M0+ core to service low-frequency events (CapSense scan every 50 ms, sensor polling, RTC alarms) and put the M4 core into Deep Sleep between user interactions. According to the Infineon PSoC 62 TRM, the M4 wake-up time from Deep Sleep is around 0.5 ms - short enough to feel instantaneous but slow enough to justify event-driven wake logic. Enable the on-chip DC-DC converter (Buck) instead of the internal LDO when VIN is above 2.0 V to reduce quiescent current by roughly 30%.
The 124-ball VFBGA 9x9 mm package requires a 4-layer PCB at minimum with microvia-in-pad or laser-drilled 0.2 mm vias for the inner ball rows. Per Infineon's package guidelines, route the 0.5 mm pitch balls on the top layer only with fan-out to inner layers, and place a continuous ground pour under the package for thermal spreading and signal reference. Maintain at least 0.4 mm clearance between adjacent ball pads and avoid placing decoupling capacitors on the opposite side of the BGA balls to keep return paths short.
Do not assume 100% pin compatibility between the CY8C6247BZI-D44 and the CY8C6347BZI-BLD43 - the latter adds Bluetooth LE silicon and remaps several radio and crystal pins. Always cross-reference the package datasheet ball map against your PCB layout. A second pitfall: the ModusToolbox BSP ships with the Secure Boot configuration enabled, which requires signed firmware; first-time developers must either disable secure boot or provision their own keys via the cysecuretools flow.
合规信息
RoHS and REACH compliant per Infineon product page. Not AEC-Q100 qualified; for automotive applications use the automotive-grade PSoC 62 sibling. Halogen-free per JEDEC JS709.
