CY8C6247BZI-D44 - PSoC 62 Dual-Core M4/M0+ MCU 1MB | Infineon
部品番号: CY8C6247BZI-D44 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.65 | $76.50 |
| 100 | $6.8 | $680.00 |
| 500 | $6.1 | $3,050.00 |
| 1,000 | $5.45 | $5,450.00 |
CY8C6247BZI-D44 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data memory, and programmable peripheral IP into one device. PSoC 6 belongs to a specialized MCU family that adds programmable analog (op-amps, ADCs, DACs), programmable digital blocks (UDBs, smart I/O), and hardware cryptographic accelerators on top of the standard Cortex-M subsystem. Within the broader taxonomy, PSoC 6 is a microcontroller -> embedded processor -> SoC -> semiconductor, designed for ultra-low-power human-machine-interface (HMI) and connected IoT end nodes.
Key features of the CY8C6247BZI-D44 include 1 MB Flash, 288 KB SRAM, hardware AES/SHA/RSA/TRNG for secure boot and secure element services, up to 8 KB of instruction cache, CapSense® capacitive touch support, USB Full-Speed device, and a 2D graphics accelerator for TFT HMI panels. The device integrates a 12-bit SAR ADC, four op-amps, two low-power comparators, and up to 60 programmable GPIOs, enabling single-chip HMI + connectivity designs.
The dual-core architecture allows deterministic real-time response on the M0+ (BLE stack, motor control loops, CapSense scanning) while the M4 executes user-interface logic, graphics, or RTOS-driven application code. Built-in power-management modes include Deep Sleep at sub-µA currents with RTC and SRAM retention, making the part suitable for battery-powered door locks, wearables, and industrial sensors that must wake on touch or interrupt without rebooting.
Typical applications include smart door locks (BLE + capacitive keypad + secure element), wearables, smart home HMI panels, industrial sensor hubs, and low-power wireless IoT end nodes. Designers use ModusToolbox and PSoC Creator to configure peripherals graphically and generate peripheral driver libraries.
When designing with this device, allocate the M4 core for graphics and protocol stacks while keeping the M0+ for CapSense scanning and radio event servicing to minimize average power. Use the cryptographic accelerator for firmware authenticity verification at boot and store keys in the secure execution environment to protect against physical tampering.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not consolidated in any single Infineon document.
ドロップイン代替品: CY8C6247BZI-D44 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: CY8C6247BZI-D44 （同一形状・フットプリント） — 相違点: Core Architecture, Operating Voltage, Package.
クイック比較ツール — 並列比較する代替部品を選択:
CY8C6247BZI-D54
✅ ドロップイン✓ 在庫あり
$7.65 / 個
データシートを見る →CY8C6267BZI-D44
✅ ドロップイン📋 参考代替品（カタログ未掲載）
CY8C6244BZI-D44
✅ ドロップイン📋 参考代替品（カタログ未掲載）
CY8C6245BZI-D44
✅ ドロップイン📋 参考代替品（カタログ未掲載）
CY8C6247BZI-D44T
✅ ドロップイン📋 参考代替品（カタログ未掲載）
CY8C6247BZI-D44 最大定格＆電気的特性
| Core Architecture | ARM Cortex-M4 (150 MHz) + Cortex-M0+ (100 MHz) dual-core |
| Program Memory (Flash) | 1024 KB (1 MB) |
| SRAM | 288 KB |
| Instruction Cache | 8 KB |
| パッケージ | 124-ball VFBGA (9x9 mm) |
| 実装タイプ | Surface Mount |
| Operating Voltage | 1.7 V to 3.6 V |
| 動作温度 | -40 C to +85 C |
| GPIOs | Up to 60 (programmable) |
| ADC | 12-bit SAR, 1 Msps |
| Hardware Crypto | AES-128/256, SHA-256, RSA, ECC, TRNG |
| Secure Boot | Yes (hardware-rooted) |
| USB | USB 2.0 Full-Speed device |
| CapSense Support | Yes (5th generation) |
| Graphics Accelerator | Yes (2D, partial-frame) |
| RoHS ステータス | Compliant |
CY8C6247BZI-D44 124-ball vfbga (9x9 mm) ピン配置ガイド
CY8C6247BZI-D44 (124-ball vfbga (9x9 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: CY8C6247BZI-D44.
詳細は データシート をご参照ください。
主な用途
CY8C6247BZI-D44 の用途: 6 件s: Smart Door Lock Controller, Wearable Fitness Tracker, Industrial HMI Touch Panel, Smart Home Sensor Hub, Connected Medical Monitor, Battery-Powered IoT End Node.
Smart Door Lock Controller
The CY8C6247BZI-D44 is the reference MCU for Infineon's smart door lock solution because it pairs a 150 MHz Cortex-M4 host with a low-power 100 MHz Cortex-M0+ network core. CapSense 5th-generation hardware scans capacitive keypads without an external touch IC, while the AES/SHA/TRNG accelerator secures the lock against firmware tampering. Deep Sleep current under 5 µA with RTC retention lets four AA cells run for more than a year. The M4 runs the BLE host stack via an AIROC companion module; the M0+ handles scan + radio events deterministically. Developers use ModusToolbox and the CY8CKIT-062S2-43012 kit to prototype a complete lock reference design in days.
おすすめ
Wearable Fitness Tracker
Wearables need an MCU that can stay in deep sleep most of the time and wake to read optical sensors, run a small display, and connect over BLE without draining the coin cell. The CY8C6247BZI-D44's Deep Sleep sub-5 µA and Hibernate sub-1 µA modes extend runtime, while its 150 MHz M4 heart executes graphics and BLE host code. The 12-bit SAR ADC samples pulse-oximetry and heart-rate photodiode signals at low power; the 288 KB SRAM buffers display frames and activity logs. The 124-ball VFBGA package footprint fits 20x20 mm wearable PCBs, and ModusToolbox includes a turnkey BSP for OLED display + BLE HID profiles.
おすすめ
Industrial HMI Touch Panel
Factory operator panels demand a TFT display, capacitive touch, and rugged connectivity. The CY8C6247BZI-D44's integrated 2D graphics accelerator drives QVGA/WQVGA TFT panels without a separate GPU, and the 5th-generation CapSense IP reads multi-touch sliders even through thick glass. The dual-core split keeps the M0+ servicing CapSense scan and CAN at deterministic intervals while the M4 renders UI widgets. Hardware AES-256 and secure boot protect firmware from field tampering. The 124-ball VFBGA 9x9 mm footprint and -40 C to +85 C industrial rating suit DIN-rail and panel-mount enclosures. ModusToolbox middleware supports Segger emWin and LVGL GUI stacks out of the box.
おすすめ
Smart Home Sensor Hub
A multi-protocol sensor hub must wake on motion or sound, aggregate readings, and push them over BLE or Wi-Fi. The CY8C6247BZI-D44's M0+ core polls I2C/SPI sensors at low MHz and triggers the M4 only on interesting events, keeping average power low. The 12-bit 1 Msps SAR ADC scans analog channels, while hardware crypto accelerators authenticate over-the-air firmware updates. The 1 MB Flash stores edge-AI inference models for occupancy detection or acoustic event classification. Designers pair the MCU with a CYW43012 or external Wi-Fi module and use the on-chip 288 KB SRAM for rolling buffers.
おすすめ
Connected Medical Monitor
Patient monitors require IEC 60601-1-isolated data paths, deterministic BLE links, and long battery life. The CY8C6247BZI-D44's hardware AES-256 and SHA-256 accelerate HIPAA-friendly encryption of patient telemetry. The dual-core M4+M0+ scheme dedicates the M0+ to always-on vitals sampling at fixed cadence while the M4 runs BLE host and display update. Hardware capacitive touch drives the front-panel user interface, eliminating mechanical buttons. ModusToolbox middleware includes FDA-ready firmware reference libraries. The 124-ball VFBGA footprint suits 25x35 mm handheld enclosures, and the -40 C to +85 C rating covers clinical and field environments.
おすすめ
Battery-Powered IoT End Node
Battery-powered wireless sensor nodes spend 99% of their time asleep, waking to take a reading and transmit a packet. The CY8C6247BZI-D44 supports this profile through Hibernate (sub-1 µA with RTC) and Deep Sleep (sub-5 µA with SRAM retention) modes. On wake, the M4 runs an AI inference or compressed-sensor pipeline at 150 MHz and hands the encrypted packet to an external AIROC radio. The 1 MB Flash stores LoRaWAN MAC keys, calibration data, and edge-AI model weights. ModusToolbox includes LoRaWAN, Zigbee, and Matter SDKs for rapid prototyping. The 124-ball VFBGA 9x9 mm package suits miniaturized IP65 enclosures for outdoor deployment.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: CY8C6247BZI-D44 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | CY8C6247BZI-D54 | CY8C6267BZI-D44 | CY8C6244BZI-D44 | CY8C6245BZI-D44 | CY8C6247BZI-D44T |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | 124-ball VFBGA (9x9 mm) | 124-ball VFBGA (9x9 mm) - same | 124-ball VFBGA (9x9 mm) - same | 124-ball VFBGA (9x9 mm) - same | 124-ball VFBGA (9x9 mm) - same | 124-ball VFBGA (9x9 mm) - same |
| Core Architecture | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz | Cortex-M4 150 MHz + Cortex-M0+ 100 MHz |
| Flash | 1024 KB | 1024 KB | 1024 KB | 512 KB | 768 KB | 1024 KB |
| SRAM | 288 KB | 288 KB | 288 KB | 288 KB | 288 KB | 288 KB |
| Bluetooth LE | External (via AIROC companion) | External | External | External | External | External |
| CapSense | Yes (5th gen) | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
主な差別化要因
- 1 MB Flash with 288 KB SRAM at full M4 150 MHz speed （vs CY8C6244BZI-D44)
- Drop-in compatibility with the CY8C6247BZI-D54 （vs CY8C6247BZI-D54)
- Mature PSoC 62 platform with Infineon ModusToolbox support （vs CY8C6247BZI-D44T)
設計ノート
Use the M0+ core to service low-frequency events (CapSense scan every 50 ms, sensor polling, RTC alarms) and put the M4 core into Deep Sleep between user interactions. According to the Infineon PSoC 62 TRM, the M4 wake-up time from Deep Sleep is around 0.5 ms - short enough to feel instantaneous but slow enough to justify event-driven wake logic. Enable the on-chip DC-DC converter (Buck) instead of the internal LDO when VIN is above 2.0 V to reduce quiescent current by roughly 30%.
The 124-ball VFBGA 9x9 mm package requires a 4-layer PCB at minimum with microvia-in-pad or laser-drilled 0.2 mm vias for the inner ball rows. Per Infineon's package guidelines, route the 0.5 mm pitch balls on the top layer only with fan-out to inner layers, and place a continuous ground pour under the package for thermal spreading and signal reference. Maintain at least 0.4 mm clearance between adjacent ball pads and avoid placing decoupling capacitors on the opposite side of the BGA balls to keep return paths short.
Do not assume 100% pin compatibility between the CY8C6247BZI-D44 and the CY8C6347BZI-BLD43 - the latter adds Bluetooth LE silicon and remaps several radio and crystal pins. Always cross-reference the package datasheet ball map against your PCB layout. A second pitfall: the ModusToolbox BSP ships with the Secure Boot configuration enabled, which requires signed firmware; first-time developers must either disable secure boot or provision their own keys via the cysecuretools flow.
コンプライアンス情報
RoHS and REACH compliant per Infineon product page. Not AEC-Q100 qualified; for automotive applications use the automotive-grade PSoC 62 sibling. Halogen-free per JEDEC JS709.
