DSPIC30F6012AT-20E/PF - 16-bit DSC, 144KB Flash, 20 MIPS | Microchip
料号： DSPIC30F6012AT-20E/PF ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $15.57 | $15.57 |
| 10 | $14.85 | $148.50 |
| 100 | $13.62 | $1,362.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.95 | $10,950.00 |
DSPIC30F6012AT-20E/PF 概述
A Digital Signal Controller (DSC) is a hybrid between a microcontroller (MCU) and a digital signal processor (DSP). It combines a deterministic single-cycle MCU core with DSP arithmetic capability, sitting in the product hierarchy as: DSC -> microcontroller -> embedded processor -> semiconductor. This category of device is engineered for closed-loop control loops that must execute MAC operations and PID calculations within microseconds, where a general-purpose MCU lacks DSP throughput and a standalone DSP lacks peripheral integration.
The DSPIC30F6012AT-20E/PF delivers 144 KB of Flash program memory organized as 48K x 24 instruction words, alongside 8 KB of RAM for data. Its peripheral set includes CAN, I2C, SPI, and UART/USART communications interfaces, plus a 12-bit ADC, motor-control PWM, and up to 60 general-purpose I/O ports. The device operates from a 4.5 V to 5.5 V supply, drawing from internal Flash and supporting industrial temperature grades (-40 °C to +125 °C).
Architecturally, the dsPIC30F core uses a modified Harvard architecture with separate program and data buses, enabling simultaneous instruction fetch and DSP operand access. The DSP engine adds a 40-bit barrel shifter, dual 40-bit accumulators, and single-cycle 16x16 MAC, allowing real-time FFT, FIR/IIR filtering, and power-factor-correction math without off-chip accelerators. The wide 24-bit instruction word accelerates complex control loop execution while preserving C-code compatibility with standard MPLAB X IDE toolchains.
Typical applications include BLDC and AC induction motor drives, solar micro-inverters, industrial automation controllers, automotive body and chassis ECUs, uninterruptible power supplies (UPS), and switched-mode power supply (SMPS) digital control loops. The combination of DSP throughput, motor-control PWM, and CAN connectivity makes it well suited for field-oriented control (FOC) of three-phase motors.
When designing with this device, verify supply decoupling at each AVDD/VDD pair and route the analog VREF+ separately from digital ground returns. Confirm that the FOSC/PLL configuration matches the application's MIPS budget before committing to layout. This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes not collected on a single manufacturer page.
直接替换替代料： DSPIC30F6012AT-20E/PF ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC30F6012AT-20E/PF （相同外形与封装尺寸） ——差异在于 ADC, Package, Core, RoHS Status, Communication.
快速对比工具——选择替代料号进行并排对比：
DSPIC30F6012A-20E/PF
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC30F6012AT-30E/PF
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC30F6011AT-30I/PT
✅ 直接替换✓ 有现货
$7.5 / 个
查看数据手册 →DSPIC30F6011AT-20I/PT
✅ 直接替换✓ 有现货
$9.2 / 个
查看数据手册 →DSPIC30F6012A-20I/PT
✅ 直接替换✓ 有现货
$10.1 / 个
查看数据手册 →DSPIC30F6012AT-20E/PF 最大额定值与电气特性
| Core Architecture | dsPIC30F (16-bit DSC) |
| Program Memory (Flash) | 144 KB (48K x 24 instruction words) |
| Data RAM | 8 KB |
| Operating MIPS | 20 MIPS |
| Maximum Clock Speed | 40 MHz |
| Supply Voltage (VDD) | 4.5 V to 5.5 V |
| I/O Ports | 60 |
| 封装 | 64-pin TQFP (14x14 mm, 0.8 mm pitch) |
| Communication Interfaces | CAN, I2C, SPI, UART/USART |
| ADC | 12-bit (per datasheet family) |
| 工作温度范围 | -40 °C to +125 °C (extended, -E suffix) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Lead Free / Compliant (per packaging code) |
| ROM Type | Flash |
| Product Family | dsPIC30F General Purpose 16-bit Digital Signal Controller |
DSPIC30F6012AT-20E/PF 64-pin tqfp (14x14 mm, 0.8 mm pitch) 引脚配置指南
DSPIC30F6012AT-20E/PF（64-pin tqfp (14x14 mm, 0.8 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC30F6012AT-20E/PF.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC30F6012AT-20E/PF 适用于 7 应用s: Three-Phase BLDC Motor Drive (FOC), Solar Micro-Inverter Control, Switched-Mode Power Supply (SMPS) Digital Control, Industrial Automation Controller (PLC / Remote I/O), Automotive Body/Chassis ECU, Uninterruptible Power Supply (UPS) DSP Control, Audio Amplifier DSP Front-End.
Three-Phase BLDC Motor Drive (FOC)
The DSPIC30F6012AT-20E/PF is well-suited for field-oriented control of brushless DC motors because its DSP engine executes Clarke/Park transforms and PI loops within tight microsecond budgets. The on-chip motor-control PWM module directly drives three-phase inverter switches at switching frequencies up to ~20 kHz without external waveform generation logic, while the 144 KB Flash stores entire state-machine control firmware plus sensorless observer tables.
推荐
Solar Micro-Inverter Control
Grid-tie solar micro-inverters use the DSPIC30F6012AT-20E/PF for MPPT and anti-islanding DSP routines because its 20 MIPS budget is sufficient for real-time perturb-and-observe algorithms plus PLL grid synchronization. The 12-bit ADC samples PV input voltage and current at adequate resolution for energy harvesting, and the on-chip CAN or UART interfaces connect to a system-level monitoring bus. Industrial -40 °C to +125 °C rating handles rooftop thermal stress.
推荐
Switched-Mode Power Supply (SMPS) Digital Control
Digitally controlled SMPS designs rely on the DSPIC30F6012AT-20E/PF's DSP throughput to execute voltage-mode and current-mode control loops at switching frequencies exceeding 100 kHz. The high-resolution PWM and fast ADC sampling enable peak current-mode control, while DSP-based compensation networks (Type-II/Type-III) provide adaptive loop response across load transients. Designers benefit from firmware-based tuning versus analog component rework.
推荐
Industrial Automation Controller (PLC / Remote I/O)
PLC modules and remote I/O nodes use the DSPIC30F6012AT-20E/PF as a 5V-tolerant MCU with deterministic interrupt response, supporting CANopen, Modbus RTU, and SPI-based ADC backplanes. The 60 I/O pins enable direct scan matrix or LED-bar driving without external mux ICs, while the DSP engine handles PID control of valves and pumps. -40 °C to +125 °C temperature rating ensures cabinet-mount reliability.
推荐
Automotive Body/Chassis ECU
Body controllers (BCM, seat controllers, HVAC flaps) leverage the DSPIC30F6012AT-20E/PF's CAN bus interface and 5V I/O tolerance to interface with 12V automotive networks. The DSP engine supports LIN-to-CAN gateway translation and PWM-driven LED matrix lighting. The -E temperature rating suits under-dash and cabin-mounted ECUs where ambient extremes are common.
推荐
Uninterruptible Power Supply (UPS) DSP Control
Online UPS designs use the DSPIC30F6012AT-20E/PF for sinusoidal PWM generation, RMS voltage measurement, and battery state-of-charge DSP algorithms. The MAC engine computes real-time THD measurements of inverter output, enabling adaptive dead-time compensation. Industrial temperature grade and 60 I/O pins support paralleled system topologies with redundant control paths.
推荐
Audio Amplifier DSP Front-End
Class-D amplifier front-end controllers use the DSPIC30F6012AT-20E/PF for speaker protection algorithms (DC blocker, dynamic bass boost) and feedback loop computation. The DSP engine runs FIR crossover filters in real time at 48 kHz sample rates, while the PWM drives the output MOSFET bridge. Designers can store custom EQ presets in 144 KB Flash without external memory.
推荐
推荐产品汇总
工程参考数据： DSPIC30F6012AT-20E/PF ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC30F6012A-20E/PF | DSPIC30F6012AT-30E/PF | DSPIC30F6011AT-30I/PT | DSPIC30F6011AT-20I/PT | DSPIC30F6012A-20I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (14x14 mm, /PF) | 64-pin TQFP (14x14 mm, /PF) - same | 64-pin TQFP (14x14 mm, /PF) - same | 64-pin TQFP (10x10 mm, /PT) - same family | 64-pin TQFP (10x10 mm, /PT) - same family | 64-pin TQFP (10x10 mm, /PT) - same family |
| Core | dsPIC30F (16-bit DSC) | dsPIC30F (16-bit DSC) | dsPIC30F (16-bit DSC) | dsPIC30F (16-bit DSC) | dsPIC30F (16-bit DSC) | dsPIC30F (16-bit DSC) |
| Program Flash | 144 KB | 144 KB | 144 KB | 132 KB | 132 KB | 144 KB |
| Data RAM | 8 KB | 8 KB | 8 KB | 6 KB | 6 KB | 8 KB |
| Maximum MIPS | 20 MIPS | 20 MIPS | 30 MIPS | 30 MIPS | 20 MIPS | 20 MIPS |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Temperature Grade | -40 °C to +125 °C (-E) | -40 °C to +125 °C (-E) | -40 °C to +125 °C (-E) | -40 °C to +85 °C (-I) | -40 °C to +85 °C (-I) | -40 °C to +85 °C (-I) |
关键差异点
- Highest MIPS in same-package 144 KB Flash tier of dsPIC30F601x family （对比 DSPIC30F6011AT-30I/PT)
- Lower-cost tape-and-reel variant of the same silicon die （对比 DSPIC30F6012A-20E/PF)
- Speed grade upgradability within same family （对比 DSPIC30F6012AT-30E/PF)
设计说明
Decouple each VDD/AVDD pair with a 100 nF ceramic + 10 µF bulk capacitor placed within 5 mm of the package pin. The DSP engine draws transient bursts during MAC instructions; insufficient bulk capacitance causes AVDD sag that couples into ADC readings. Microchip reference designs recommend separate analog and digital ground returns joined at a single point near the device.
Route the 40 MHz system clock traces as short, impedance-controlled lines and avoid running them parallel to switching PWM outputs to prevent coupling into the DSP engine. The 64-pin TQFP (14x14 mm) package has a 0.8 mm pitch requiring fine-pitch PCB manufacturing capability; use 4 mil traces and 4 mil spacing minimum for escape routing from inner pads.
Verify the FOSC/PLL configuration register (OSCCON) matches the application's MIPS budget before committing to layout — a misconfigured PLL can lock the part at the wrong frequency or fail to start. When migrating from dsPIC30F to dsPIC33F, peripheral register layouts differ; do not assume binary compatibility. Always rebuild bootloader projects against the new family header files.
At sustained 20 MIPS operation with active PWM and ADC, internal die power dissipation remains below 200 mW and the 64-pin TQFP thermal pad (if present) or copper pour on the 14x14 mm footprint provides adequate heat spreading. For high-ambient installations above 105 °C, derate switching frequency to keep junction temperature within the -40 °C to +125 °C operating envelope.
合规信息
Lead-free TQFP packaging per /PF suffix; RoHS/REACH compliance confirmed by Microchip product page. Not AEC-Q100 qualified — automotive designs should evaluate dsPIC33F automotive grades.
