DSPIC30F6012AT-20E/PF - 16-bit DSC, 144KB Flash, 20 MIPS | Microchip
부품 번호: DSPIC30F6012AT-20E/PF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $15.57 | $15.57 |
| 10 | $14.85 | $148.50 |
| 100 | $13.62 | $1,362.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.95 | $10,950.00 |
DSPIC30F6012AT-20E/PF 개요
A Digital Signal Controller (DSC) is a hybrid between a microcontroller (MCU) and a digital signal processor (DSP). It combines a deterministic single-cycle MCU core with DSP arithmetic capability, sitting in the product hierarchy as: DSC -> microcontroller -> embedded processor -> semiconductor. This category of device is engineered for closed-loop control loops that must execute MAC operations and PID calculations within microseconds, where a general-purpose MCU lacks DSP throughput and a standalone DSP lacks peripheral integration.
The DSPIC30F6012AT-20E/PF delivers 144 KB of Flash program memory organized as 48K x 24 instruction words, alongside 8 KB of RAM for data. Its peripheral set includes CAN, I2C, SPI, and UART/USART communications interfaces, plus a 12-bit ADC, motor-control PWM, and up to 60 general-purpose I/O ports. The device operates from a 4.5 V to 5.5 V supply, drawing from internal Flash and supporting industrial temperature grades (-40 °C to +125 °C).
Architecturally, the dsPIC30F core uses a modified Harvard architecture with separate program and data buses, enabling simultaneous instruction fetch and DSP operand access. The DSP engine adds a 40-bit barrel shifter, dual 40-bit accumulators, and single-cycle 16x16 MAC, allowing real-time FFT, FIR/IIR filtering, and power-factor-correction math without off-chip accelerators. The wide 24-bit instruction word accelerates complex control loop execution while preserving C-code compatibility with standard MPLAB X IDE toolchains.
Typical applications include BLDC and AC induction motor drives, solar micro-inverters, industrial automation controllers, automotive body and chassis ECUs, uninterruptible power supplies (UPS), and switched-mode power supply (SMPS) digital control loops. The combination of DSP throughput, motor-control PWM, and CAN connectivity makes it well suited for field-oriented control (FOC) of three-phase motors.
When designing with this device, verify supply decoupling at each AVDD/VDD pair and route the analog VREF+ separately from digital ground returns. Confirm that the FOSC/PLL configuration matches the application's MIPS budget before committing to layout. This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes not collected on a single manufacturer page.
드롭인 대체품: DSPIC30F6012AT-20E/PF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC30F6012AT-20E/PF (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, Core, RoHS Status, Communication.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC30F6012A-20E/PF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC30F6012AT-30E/PF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC30F6011AT-30I/PT
✅ 드롭인✓ 재고 있음
$7.5 / 개
데이터시트 보기 →DSPIC30F6011AT-20I/PT
✅ 드롭인✓ 재고 있음
$9.2 / 개
데이터시트 보기 →DSPIC30F6012A-20I/PT
✅ 드롭인✓ 재고 있음
$10.1 / 개
데이터시트 보기 →DSPIC30F6012AT-20E/PF 최대 정격 & 전기적 특성
| Core Architecture | dsPIC30F (16-bit DSC) |
| Program Memory (Flash) | 144 KB (48K x 24 instruction words) |
| Data RAM | 8 KB |
| Operating MIPS | 20 MIPS |
| Maximum Clock Speed | 40 MHz |
| Supply Voltage (VDD) | 4.5 V to 5.5 V |
| I/O Ports | 60 |
| 패키지 | 64-pin TQFP (14x14 mm, 0.8 mm pitch) |
| Communication Interfaces | CAN, I2C, SPI, UART/USART |
| ADC | 12-bit (per datasheet family) |
| 동작 온도 범위 | -40 °C to +125 °C (extended, -E suffix) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Lead Free / Compliant (per packaging code) |
| ROM Type | Flash |
| Product Family | dsPIC30F General Purpose 16-bit Digital Signal Controller |
DSPIC30F6012AT-20E/PF 64-pin tqfp (14x14 mm, 0.8 mm pitch) 핀 구성 가이드
DSPIC30F6012AT-20E/PF(64-pin tqfp (14x14 mm, 0.8 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC30F6012AT-20E/PF.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC30F6012AT-20E/PF 적합 용도: 7 애플리케이션s: Three-Phase BLDC Motor Drive (FOC), Solar Micro-Inverter Control, Switched-Mode Power Supply (SMPS) Digital Control, Industrial Automation Controller (PLC / Remote I/O), Automotive Body/Chassis ECU, Uninterruptible Power Supply (UPS) DSP Control, Audio Amplifier DSP Front-End.
Three-Phase BLDC Motor Drive (FOC)
The DSPIC30F6012AT-20E/PF is well-suited for field-oriented control of brushless DC motors because its DSP engine executes Clarke/Park transforms and PI loops within tight microsecond budgets. The on-chip motor-control PWM module directly drives three-phase inverter switches at switching frequencies up to ~20 kHz without external waveform generation logic, while the 144 KB Flash stores entire state-machine control firmware plus sensorless observer tables.
추천
Solar Micro-Inverter Control
Grid-tie solar micro-inverters use the DSPIC30F6012AT-20E/PF for MPPT and anti-islanding DSP routines because its 20 MIPS budget is sufficient for real-time perturb-and-observe algorithms plus PLL grid synchronization. The 12-bit ADC samples PV input voltage and current at adequate resolution for energy harvesting, and the on-chip CAN or UART interfaces connect to a system-level monitoring bus. Industrial -40 °C to +125 °C rating handles rooftop thermal stress.
추천
Switched-Mode Power Supply (SMPS) Digital Control
Digitally controlled SMPS designs rely on the DSPIC30F6012AT-20E/PF's DSP throughput to execute voltage-mode and current-mode control loops at switching frequencies exceeding 100 kHz. The high-resolution PWM and fast ADC sampling enable peak current-mode control, while DSP-based compensation networks (Type-II/Type-III) provide adaptive loop response across load transients. Designers benefit from firmware-based tuning versus analog component rework.
추천
Industrial Automation Controller (PLC / Remote I/O)
PLC modules and remote I/O nodes use the DSPIC30F6012AT-20E/PF as a 5V-tolerant MCU with deterministic interrupt response, supporting CANopen, Modbus RTU, and SPI-based ADC backplanes. The 60 I/O pins enable direct scan matrix or LED-bar driving without external mux ICs, while the DSP engine handles PID control of valves and pumps. -40 °C to +125 °C temperature rating ensures cabinet-mount reliability.
추천
Automotive Body/Chassis ECU
Body controllers (BCM, seat controllers, HVAC flaps) leverage the DSPIC30F6012AT-20E/PF's CAN bus interface and 5V I/O tolerance to interface with 12V automotive networks. The DSP engine supports LIN-to-CAN gateway translation and PWM-driven LED matrix lighting. The -E temperature rating suits under-dash and cabin-mounted ECUs where ambient extremes are common.
추천
Uninterruptible Power Supply (UPS) DSP Control
Online UPS designs use the DSPIC30F6012AT-20E/PF for sinusoidal PWM generation, RMS voltage measurement, and battery state-of-charge DSP algorithms. The MAC engine computes real-time THD measurements of inverter output, enabling adaptive dead-time compensation. Industrial temperature grade and 60 I/O pins support paralleled system topologies with redundant control paths.
추천
Audio Amplifier DSP Front-End
Class-D amplifier front-end controllers use the DSPIC30F6012AT-20E/PF for speaker protection algorithms (DC blocker, dynamic bass boost) and feedback loop computation. The DSP engine runs FIR crossover filters in real time at 48 kHz sample rates, while the PWM drives the output MOSFET bridge. Designers can store custom EQ presets in 144 KB Flash without external memory.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC30F6012AT-20E/PF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC30F6012A-20E/PF | DSPIC30F6012AT-30E/PF | DSPIC30F6011AT-30I/PT | DSPIC30F6011AT-20I/PT | DSPIC30F6012A-20I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (14x14 mm, /PF) | 64-pin TQFP (14x14 mm, /PF) - same | 64-pin TQFP (14x14 mm, /PF) - same | 64-pin TQFP (10x10 mm, /PT) - same family | 64-pin TQFP (10x10 mm, /PT) - same family | 64-pin TQFP (10x10 mm, /PT) - same family |
| Core | dsPIC30F (16-bit DSC) | dsPIC30F (16-bit DSC) | dsPIC30F (16-bit DSC) | dsPIC30F (16-bit DSC) | dsPIC30F (16-bit DSC) | dsPIC30F (16-bit DSC) |
| Program Flash | 144 KB | 144 KB | 144 KB | 132 KB | 132 KB | 144 KB |
| Data RAM | 8 KB | 8 KB | 8 KB | 6 KB | 6 KB | 8 KB |
| Maximum MIPS | 20 MIPS | 20 MIPS | 30 MIPS | 30 MIPS | 20 MIPS | 20 MIPS |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Temperature Grade | -40 °C to +125 °C (-E) | -40 °C to +125 °C (-E) | -40 °C to +125 °C (-E) | -40 °C to +85 °C (-I) | -40 °C to +85 °C (-I) | -40 °C to +85 °C (-I) |
주요 차별점
- Highest MIPS in same-package 144 KB Flash tier of dsPIC30F601x family (vs DSPIC30F6011AT-30I/PT)
- Lower-cost tape-and-reel variant of the same silicon die (vs DSPIC30F6012A-20E/PF)
- Speed grade upgradability within same family (vs DSPIC30F6012AT-30E/PF)
설계 노트
Decouple each VDD/AVDD pair with a 100 nF ceramic + 10 µF bulk capacitor placed within 5 mm of the package pin. The DSP engine draws transient bursts during MAC instructions; insufficient bulk capacitance causes AVDD sag that couples into ADC readings. Microchip reference designs recommend separate analog and digital ground returns joined at a single point near the device.
Route the 40 MHz system clock traces as short, impedance-controlled lines and avoid running them parallel to switching PWM outputs to prevent coupling into the DSP engine. The 64-pin TQFP (14x14 mm) package has a 0.8 mm pitch requiring fine-pitch PCB manufacturing capability; use 4 mil traces and 4 mil spacing minimum for escape routing from inner pads.
Verify the FOSC/PLL configuration register (OSCCON) matches the application's MIPS budget before committing to layout — a misconfigured PLL can lock the part at the wrong frequency or fail to start. When migrating from dsPIC30F to dsPIC33F, peripheral register layouts differ; do not assume binary compatibility. Always rebuild bootloader projects against the new family header files.
At sustained 20 MIPS operation with active PWM and ADC, internal die power dissipation remains below 200 mW and the 64-pin TQFP thermal pad (if present) or copper pour on the 14x14 mm footprint provides adequate heat spreading. For high-ambient installations above 105 °C, derate switching frequency to keep junction temperature within the -40 °C to +125 °C operating envelope.
규정 준수 정보
Lead-free TQFP packaging per /PF suffix; RoHS/REACH compliance confirmed by Microchip product page. Not AEC-Q100 qualified — automotive designs should evaluate dsPIC33F automotive grades.
