DSPIC33CK256MP306-I/MR - 100MHz DSC 256KB Flash | Microchip
料号： DSPIC33CK256MP306-I/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.52 | $6.52 |
| 10 | $5.93 | $59.30 |
| 100 | $5.28 | $528.00 |
| 500 | $4.79 | $2,395.00 |
| 1,000 | $4.41 | $4,410.00 |
DSPIC33CK256MP306-I/MR 概述
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and control logic of a microcontroller. Within the power-management hierarchy, the dsPIC33CK family sits between general-purpose MCUs and dedicated motor-control ASICs, offering a DSP engine (barrel shifter, single-cycle MAC, DSP instruction set) on top of a 16-bit MCU core, making it a power-management and control IC for precision motion and digital power systems.
Key features include 100 MIPS core performance, 256 KB dual-panel flash supporting live firmware updates, 64 KB of ECC-protected RAM, up to three integrated operational amplifiers, 12-bit ADCs capable of up to 3.5 Msps, and high-resolution PWM peripherals for digital power conversion.
Technically, the dsPIC33CK core executes one instruction per cycle at 100 MHz, with DSP multiply-accumulate instructions and hardware divide support. Dual-panel flash allows one panel to execute code while the other is reprogrammed, supporting field upgrades without an external bootloader flash. The internal oscillator removes the need for an external crystal in many designs, and multiple PGECx/PGEDx pairs support ICSP programming.
Typical applications include precision motor control (FOC for BLDC/PMSM), digital power supplies (totem-pole PFC, LLC), industrial automation, and automotive-adjacent control systems. High ADC sample rates paired with fast PWM enable closed-loop control bandwidths well above analog-compensated alternatives.
Design consideration: use any PGECx/PGEDx pair consistently for ICSP - ICSPCLK and ICSPDAT must come from the same pair. Decouple all VDD/VDDCORE pins with 0.1 uF ceramics close to the pins.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： DSPIC33CK256MP306-I/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33CK256MP306-I/MR （相同外形与封装尺寸） ——差异在于 Package, Core, Operating Temperature, RoHS Status, CAN.
快速对比工具——选择替代料号进行并排对比：
DSPIC33CK256MP306-H/MR
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33CK512MP306-I/MR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33CK128MP306-I/MR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33CK128MP506-E/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.42 / 个
查看数据手册 →DSPIC33CK256MP206-I/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.85 / 个
查看数据手册 →DSPIC33CK256MP306-I/MR 最大额定值与电气特性
| Core | dsPIC33CK 16-bit DSC |
| Core Speed | 100 MHz (100 MIPS) |
| Program Memory (Flash) | 256 KB (dual panel) |
| RAM Size | 64 KB |
| ADC Resolution | 12-bit |
| 封装 | 64-QFN (MR, 9x9 mm), exposed pad (64-VFQFN) |
| 安装类型 | Surface Mount |
| Oscillator Type | Internal |
| Operating Temperature Min | -40 C |
| Operating Temperature Max | 85 C |
| Integrated Peripherals | OpAmps, 12-bit ADCs, high-resolution PWM |
| Terminal Pitch | 0.5 mm |
| Programming Interface | ICSP (multiple PGECx/PGEDx pairs) |
| DMA Channels | 8 |
| RoHS 状态 | RoHS compliant |
DSPIC33CK256MP306-I/MR 64-qfn (mr, 9x9 mm), exposed pad (64-vfqfn) 引脚配置指南
DSPIC33CK256MP306-I/MR（64-qfn (mr, 9x9 mm), exposed pad (64-vfqfn) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33CK256MP306-I/MR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33CK256MP306-I/MR 适用于 6 应用s: Precision BLDC/PMSM Motor Control, Digital Power Supplies (PFC / LLC), Industrial Automation and PLC I/O, Battery Management and Charging Systems, Digital Audio and Signal Processing, Automotive-Area Control (via -H variant).
Precision BLDC/PMSM Motor Control
The DSPIC33CK256MP306-I/MR is purpose-built for field-oriented control (FOC) of BLDC and PMSM motors: the 100 MHz (100 MIPS) core executes fast current loops, the 12-bit ADCs sample phase currents at high rates, and integrated op-amps condition shunt-resistor signals without external amplifiers. The high-resolution PWM peripherals generate complementary outputs with dead-time insertion for three-phase inverters. Eight DMA channels offload ADC results to RAM without CPU intervention, keeping interrupt latency deterministic. Placed at the heart of a servo drive or industrial robot joint, the DSC closes current loops in the tens-of-microseconds range; the main trade-off versus an analog controller is firmware complexity, offset by Microchip's motor-control libraries and the dual-panel flash enabling in-field drive firmware updates.
推荐
Digital Power Supplies (PFC / LLC)
In totem-pole PFC and LLC resonant converter designs, the DSPIC33CK256MP306-I/MR replaces analog control with a fully digital loop. Its high-resolution PWM provides sub-nanosecond duty-cycle and phase resolution needed for ZVS tuning, while 12-bit ADCs sample output voltage, input current, and temperature for multi-loop control at up to 100 MHz instruction throughput. The integrated op-amps can buffer current-shunt signals for average-current-mode control. The 256 KB dual-panel flash lets manufacturers ship firmware updates that retune compensation laws without hardware changes. One design consideration is that digital control adds computation delay relative to analog loops; mitigations include ADC-PWM hardware triggering that eliminates software jitter, supported by the device's 8-channel DMA for zero-overhead result transfer.
推荐
Industrial Automation and PLC I/O
For industrial automation nodes, the DSPIC33CK256MP306-I/MR provides deterministic DSP performance for machine sensing, actuation, and condition monitoring. The -40 C to +85 C industrial temperature rating covers uncontrolled factory-floor environments, and the internal oscillator removes the cost and failure points of external crystals in vibration-prone installations. Its 64 KB of RAM and 8 DMA channels support circular buffers for FFT-based vibration analysis, while the 256 KB dual-panel flash hosts both application code and a field-updatable loader. Multiple PGECx/PGEDx pairs allow programming headers to be routed to the most convenient connector location. Compared with a general-purpose MCU, the DSP engine accelerates filter and transform computations by an order of magnitude, enabling predictive maintenance analytics at the edge.
推荐
Battery Management and Charging Systems
The DSPIC33CK256MP306-I/MR suits battery chargers and battery-management systems that need both accurate measurement and active control. The 12-bit ADCs monitor cell voltages and currents, the integrated op-amps buffer sense signals, and the high-resolution PWM drives synchronous buck/boost charging stages with precise current ripple characteristics. Running the charging state machine in firmware allows adaptive CC/CV profiles per battery chemistry without analog redesign. The 256 KB flash accommodates complex state-of-charge algorithms and logging tables in 64 KB RAM. The industrial -40 C to +85 C range suits outdoor energy-storage enclosures. A key consideration is firmware functional-safety rigor; Microchip offers Functional Safety (FuSa) package support for the dsPIC33C family, as noted in DigiKey's listing of the family variants.
推荐
Digital Audio and Signal Processing
The single-cycle MAC and DSP instruction set of the DSPIC33CK256MP306-I/MR make it effective for embedded audio processing: active crossover filters, limiters, and effects chains. The 100 MHz core sustains multiple biquad filter sections at 48 kHz sample rates with headroom for control tasks, and the 64 KB RAM holds delay lines and coefficient tables. Twelve-bit ADCs digitize line-level inputs with adequate dynamic range for control-oriented audio (volume, tone), while the integrated op-amps can serve as input biasing stages. The 256 KB dual-panel flash enables firmware-updatable audio products in the field. For high-fidelity output, pair the DSC with an external audio codec over SPI/I2C; the DSP engine then focuses purely on the processing chain rather than conversion.
推荐
Automotive-Area Control (via -H variant)
For applications migrating toward automotive qualification, the same 64-QFN design accepts the DSPIC33CK256MP306-H/MR drop-in variant, which per Microchip USA operates from -40 C to +150 C and meets AEC-Q100 standards. This lets a single PCB layout serve industrial prototypes and automotive production: validate control firmware on the -I/MR part, then qualify with the -H part without layout changes. Typical near-automotive uses include auxiliary pumps, cooling fans, actuators, and zone controllers where CAN networking and precise motor control converge. The 0.5 mm pitch PQCC-64 package (JESD-30: S-PQCC-N64) supports standard SMT assembly. Designers should verify AEC-Q100 qualification scope and PPAP availability with Microchip for their specific production program.
推荐
推荐产品汇总
工程参考数据： DSPIC33CK256MP306-I/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33CK256MP306-H/MR | DSPIC33CK512MP306-I/MR | DSPIC33CK128MP306-I/MR | DSPIC33CK128MP506-E/MR | DSPIC33CK256MP206-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (MR, 9x9 mm) | 64-QFN (MR) - same | 64-QFN (MR) - same | 64-QFN (MR) - same | 64-QFN (MR) - same | 64-QFN (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Flash Memory | 256 KB (dual panel) | 256 KB | 512 KB | 128 KB | 128 KB | 256 KB |
| Operating Temperature | -40 C to +85 C | -40 C to +150 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (E) | -40 C to +85 C |
| Qualification Grade | Industrial | AEC-Q100 automotive | Industrial | Industrial | Extended (E) grade | Industrial |
关键差异点
- 256 KB dual-panel flash enables live field updates （对比 DSPIC33CK128MP306-I/MR)
- Automotive drop-in path available （对比 DSPIC33CK256MP306-H/MR)
- Cost-optimized when CAN-FD is not needed （对比 DSPIC33CK128MP506-E/MR)
设计说明
The 64-QFN exposed pad is the primary ground and thermal path. Connect it to a solid ground plane through an array of 5x5 or 7x7 thermal vias filled with solder. Decouple every VDD and VDDCORE pin with 0.1 uF ceramic capacitors placed within 1-2 mm of the pin; add 4.7-10 uF bulk capacitance per supply domain. Poor VDDCORE decoupling is the most common cause of erratic operation at 100 MHz operation.
ICSP programming requires matched PGECx/PGEDx pairs: per Northern Software's dsPIC33CK256MP306 notes, if PGEC2 carries ICSPCLK, ICSPDAT must use PGED2 - mixing pairs from different pins prevents programming. Route exactly one pair to the programming header and keep it free of conflicting peripherals in your pin-mapping utility. Also verify the internal oscillator configuration fuses before first power-up, since clock misconfiguration can lock out debug access.
Use the ADC-to-PWM hardware trigger path rather than software-initiated sampling in control loops: hardware triggering removes interrupt jitter, which directly reduces control-loop noise in FOC and digital power applications. Keep high-current PWM/triangle carrier traces away from ADC input traces and use a dedicated low-impedance analog ground region near the ADC pins. The 12-bit converters will only deliver full accuracy with clean reference decoupling.
合规信息
RoHS compliant and lead-free per standard Microchip -I suffix industrial parts; the -I/MR is not AEC-Q100 qualified - use the DSPIC33CK256MP306-H/MR variant for AEC-Q100.
