DSPIC33CK256MP306T-I/MR - 100MIPS 16-bit DSC 256KB Flash | Microchip
料号： DSPIC33CK256MP306T-I/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5.62 | $5.62 |
| 10 | $5.05 | $50.50 |
| 100 | $4.48 | $448.00 |
| 500 | $4.02 | $2,010.00 |
| 1,000 | $3.61 | $3,610.00 |
DSPIC33CK256MP306T-I/MR 概述
A digital signal controller combines the compute characteristics of a microcontroller with DSP-grade arithmetic capability in a single chip. Within the power-management hierarchy, the dsPIC33CK family sits above general-purpose MCUs and below multi-core application processors, making it the de facto choice for real-time closed-loop control where deterministic interrupt latency and fast multiply-accumulate throughput matter more than an OS-driven workload.
Key features include a single 100 MHz dsPIC DSC core with DSP-enhanced instruction set, dual-panel Flash enabling live firmware updates, 8-channel DMA, on-chip operational amplifiers, 12-bit high-speed ADCs, and high-resolution PWM peripherals. Functional Safety (FuSa) package support, per DigiKey and Microchip classification, assists IEC 61508-class industrial designs with safety documentation availability.
The dsPIC33CK core executes most instructions in a single cycle and pairs a DSP engine (40-bit accumulator, single-cycle MAC) with C-compiler-friendly addressing modes. The 12-bit ADC supports conversion rates suited to fast current-loop sampling in motor drives, while the PWM module offers fine edge placement resolution for power conversion topologies. Dual-panel Flash allows code execution from one panel while erasing or programming the other.
Typical applications include precision motor control (FOC for BLDC and PMSM), digital power supplies and PFC stages, industrial power inverters, and sensor conditioning front ends, all of which exploit the 100 MIPS core, on-chip op amps, and high-resolution PWM.
Design consideration: budget GPIO and pin-mux carefully on the 64-pin QFN, and place ADC sampling so current-loop deadlines fit within the 10 ns core clock period for deterministic control.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： DSPIC33CK256MP306T-I/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33CK256MP306T-I/MR （相同外形与封装尺寸） ——差异在于 Package, Core, Core Speed, CAN Interface, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
DSPIC33CK256MP306T-H/MR
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33CK256MP306-I/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.41 / 个
查看数据手册 →DSPIC33CK256MP306T-E/MR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33CK256MP506T-I/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.98 / 个
查看数据手册 →DSPIC33CK128MP506-E/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.42 / 个
查看数据手册 →DSPIC33CK256MP306T-I/MR 最大额定值与电气特性
| Core | dsPIC33CK, 16-bit DSC |
| Core Speed | 100 MHz / 100 MIPS |
| Program Memory (Flash) | 256KB (256K x 8), dual panel |
| SRAM | 64KB |
| DMA Channels | 8 |
| ADC | 12-bit, high-speed |
| Op Amps | On-chip operational amplifiers |
| PWM | High-resolution PWM |
| 封装 | 64-QFN (9x9 mm), MR |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +125C (I grade) |
| Functional Safety Support | FuSa package available |
| Technology | CMOS |
DSPIC33CK256MP306T-I/MR 64-qfn (9x9 mm), mr 引脚配置指南
DSPIC33CK256MP306T-I/MR（64-qfn (9x9 mm), mr 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33CK256MP306T-I/MR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33CK256MP306T-I/MR 适用于 6 应用s: Precision FOC Motor Control, Digital Power Supplies and PFC, Industrial Inverters and Solar Micro-Converters, Sensor Conditioning Front Ends, Robotics and Motion Control, Electric Vehicle Auxiliary Systems.
Precision FOC Motor Control
Field-oriented control of BLDC and PMSM motors demands deterministic current-loop deadlines, fast ADC sampling, and high-resolution PWM - the dsPIC33CK256MP306T-I/MR delivers all three on one die. Its 100 MIPS (100 MHz) core executes single-cycle MAC operations for the Clarke/Park transforms, while the 12-bit high-speed ADC samples phase currents several times per PWM period. The on-chip op amps amplify shunt-resistor signals directly, removing external amplifiers and their offset errors from the signal chain. Placed at the center of the inverter board with the high-resolution PWM driving gate drivers, the DSC achieves current-loop bandwidths sufficient for servo-grade torque ripple performance; the trade-off is that only 16-bit DSP math is available versus 32-bit parts, generally adequate for most industrial drives.
推荐
Digital Power Supplies and PFC
Switching power supplies and power-factor-correction stages benefit from the DSPIC33CK256MP306T-I/MR's high-resolution PWM edge placement, which allows duty-cycle resolution fine enough to suppress limit-cycle oscillation in converters operating at hundreds of kHz. The 12-bit ADC can sample output voltage and inductor current synchronously with the PWM period, and the 100 MHz core closes voltage and current loops in software with DSP-grade multiply-accumulate throughput. Dual-panel Flash lets one firmware image run while updates are applied - valuable in deployed power infrastructure. Because control gains are software parameters, the same PCB supports multiple output-voltage SKUs; the trade-off versus a fixed analog controller is firmware validation effort and the need for careful ADC-PWM synchronization during layout.
推荐
Industrial Inverters and Solar Micro-Converters
Three-phase inverter bridges and MPPT solar converters need simultaneous multi-channel control: the DSPIC33CK256MP306T-I/MR provides the PWM channels for three phases plus auxiliary converters, with the 12-bit ADC multiplexed across DC-link voltage, grid current, and temperature inputs. The 100 MIPS core runs MPPT algorithms alongside the grid-current control loop, and the 8 DMA channels offload ADC FIFO and UART data movement so the CPU budget stays available for control math. Functional Safety (FuSa) package support assists IEC 61508-oriented documentation for grid-tied equipment. Designers should verify dead-time insertion accuracy at the chosen PWM carrier frequency, since dead-time directly affects distortion and shoot-through risk in the power stage.
推荐
Sensor Conditioning Front Ends
The on-chip operational amplifiers and 12-bit ADC make the DSPIC33CK256MP306T-I/MR an efficient single-chip front end for bridge and current sensors. Strain gauges, pressure bridges, and shunt resistors can be amplified by the internal op amps and sampled by the ADC at rates far above the signal bandwidth, enabling oversampling and digital filtering in the 100 MIPS core. The 64KB SRAM buffers waveforms locally, and DMA moves samples to memory without CPU intervention, so the controller can also handle通信 and logging tasks concurrently. Compared with a discrete amplifier-plus-MCU design, component count and drift sources drop substantially; the trade-off is that op amp specifications are fixed by silicon, so ultra-low-noise (<10 nV/rtHz) applications may still require an external instrumentation amplifier ahead of the MCU.
推荐
Robotics and Motion Control
Multi-axis robotics controllers use the DSPIC33CK256MP306T-I/MR as a per-axis motion DSC: 100 MIPS handles trajectory interpolation and FOC current loops simultaneously, high-resolution PWM drives the motor stage, and quadrature/encoder interfaces feed position feedback. The 8-channel DMA streams encoder counts and ADC samples without jitter-inducing interrupts, and dual-panel Flash permits field firmware updates during maintenance windows without bricking deployed axes. Communication to a central controller over UART/CAN keeps the architecture modular - one DSC per axis scales better than one large MCU running everything, improving determinism and fault isolation. The principal consideration is bus bandwidth: with many axes, CAN FD or SPI framing must be budgeted so coordinated motion commands arrive within the servo update period.
推荐
Electric Vehicle Auxiliary Systems
Beyond traction, EV platforms need many small motor drives - pumps, fans, actuators, and thermal-management blowers - and the DSPIC33CK256MP306T-I/MR fits these sub-controllers well: industrial -40C to +125C temperature range, compact 64-QFN 9x9 mm footprint for dense boards, and FuSa documentation support for safety-relevant auxiliaries. The 12-bit ADC reads position sensors and bus voltages while the high-resolution PWM drives the motor stage; the 100 MIPS core leaves headroom for diagnostic and communication stacks. Dual-panel Flash supports firmware updates at the service bay. Note that this -I industrial-grade part is not itself AEC-Q100 automotive-qualified - for traction-critical or PPAP-required modules, engineers should confirm the appropriate qualified suffix with Microchip before design lock.
推荐
推荐产品汇总
工程参考数据： DSPIC33CK256MP306T-I/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33CK256MP306T-H/MR | DSPIC33CK256MP306-I/MR | DSPIC33CK256MP506T-I/MR | DSPIC33CK128MP506-E/MR |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS |
| Flash Memory | 256KB dual panel | 256KB dual panel | 256KB dual panel | 256KB dual panel | 128KB dual panel |
| SRAM | 64KB | 64KB | 64KB | 64KB | 64KB |
| Operating Temperature | -40C to +125C (I grade) | High-temp grade (H) | -40C to +125C (I grade) | -40C to +125C (I grade) | Extended grade (E) |
| Peripheral Complement | Op amps, 12-bit ADC, high-res PWM | Same as MP306 | Same as MP306 | Richer (extra CAN FD/comms) | Richer (extra CAN FD/comms) |
关键差异点
- Full 256KB Flash in the 64-QFN footprint （对比 DSPIC33CK128MP506-E/MR)
- Lower-cost peripheral set with identical compute （对比 DSPIC33CK256MP506T-I/MR)
- Industrial-grade availability with FuSa documentation （对比 DSPIC33CK256MP306T-H/MR)
设计说明
The 64-QFN (9x9 mm) MR package has a central exposed thermal pad that must be soldered to a grounded copper pour for both thermal and ground-integrity reasons. Use a via array (typically 5x5 on 1 mm pitch) under the pad to tie it to internal ground planes, and follow Microchip's QFN land-pattern recommendations for solder paste segmentation to prevent voiding and float. Keep the ICSP/programming pins (MCLR, PGD, PGC) accessible on test points since the QFN leaves no probing access after assembly.
Because most digital pins use Peripheral Pin Select, assign analog-sensitive functions (ADC inputs, op amp pins, VREF) away from fast-switching PWM lines during schematic capture, before pin-mux is locked in firmware. Keep PWM routing short and symmetric to the gate drivers, and place a solid ground return under each PWM pair to limit dv/dt coupling into the ADC front end. Route the analog reference (AVDD/AVSS) as a star branch from the supply entry, not daisy-chained from digital decoupling.
Three recurring mistakes with dsPIC33CK designs: (1) forgetting that the ADC must be synchronized to the PWM period - sampling free-running produces beat-frequency artifacts in current loops; (2) underestimating dual-panel Flash partition sizing, which limits the maximum single-image firmware; plan partitions before writing the bootloader; (3) assuming the -T suffix changes silicon - it only indicates tape-and-reel packaging, so do not substitute -T for tray parts in reflow-only lines expecting tray. Verify suffix semantics on the distributor page before ordering.
合规信息
Compliance status not stated in the retrieved distributor snippets; confirm on Microchip's product page or the distributor compliance documents before release.
